JP4109905B2 - 部品実装基板生産装置 - Google Patents

部品実装基板生産装置 Download PDF

Info

Publication number
JP4109905B2
JP4109905B2 JP2002159911A JP2002159911A JP4109905B2 JP 4109905 B2 JP4109905 B2 JP 4109905B2 JP 2002159911 A JP2002159911 A JP 2002159911A JP 2002159911 A JP2002159911 A JP 2002159911A JP 4109905 B2 JP4109905 B2 JP 4109905B2
Authority
JP
Japan
Prior art keywords
unit
head
control unit
component mounting
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2002159911A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004006512A (ja
JP2004006512A5 (enExample
Inventor
健二 岡本
陽一 田中
浩人 宮崎
典晃 吉田
英雄 左近
幹夫 長谷川
徹 竹馬
敬太 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2002159911A priority Critical patent/JP4109905B2/ja
Publication of JP2004006512A publication Critical patent/JP2004006512A/ja
Publication of JP2004006512A5 publication Critical patent/JP2004006512A5/ja
Application granted granted Critical
Publication of JP4109905B2 publication Critical patent/JP4109905B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP2002159911A 2002-05-31 2002-05-31 部品実装基板生産装置 Expired - Lifetime JP4109905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002159911A JP4109905B2 (ja) 2002-05-31 2002-05-31 部品実装基板生産装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002159911A JP4109905B2 (ja) 2002-05-31 2002-05-31 部品実装基板生産装置

Publications (3)

Publication Number Publication Date
JP2004006512A JP2004006512A (ja) 2004-01-08
JP2004006512A5 JP2004006512A5 (enExample) 2005-10-06
JP4109905B2 true JP4109905B2 (ja) 2008-07-02

Family

ID=30429501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002159911A Expired - Lifetime JP4109905B2 (ja) 2002-05-31 2002-05-31 部品実装基板生産装置

Country Status (1)

Country Link
JP (1) JP4109905B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652693U (ja) * 1992-12-24 1994-07-19 鐵治 ▲茨▼木 便器兼用バケツの転倒防止具

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005039268A1 (ja) 2003-10-15 2005-04-28 Matsushita Electric Industrial Co., Ltd. 部品装着装置
WO2006064680A1 (ja) 2004-12-15 2006-06-22 Matsushita Electric Industrial Co., Ltd. 動作時間短縮方法、動作時間短縮装置、プログラムおよび部品実装機
JP4643425B2 (ja) * 2005-02-07 2011-03-02 パナソニック株式会社 部品実装順序決定方法
JP4695954B2 (ja) * 2005-09-30 2011-06-08 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4939984B2 (ja) * 2007-03-14 2012-05-30 富士機械製造株式会社 電子回路部品装着装置
JP2008251771A (ja) * 2007-03-30 2008-10-16 Hitachi High-Tech Instruments Co Ltd 部品実装装置
JP4893702B2 (ja) * 2008-07-01 2012-03-07 パナソニック株式会社 部品実装関連作業機
JP5083158B2 (ja) * 2008-10-03 2012-11-28 パナソニック株式会社 電子部品実装用装置および電子部品実装用装置における操作指示方法
JP5788644B2 (ja) * 2010-05-28 2015-10-07 富士機械製造株式会社 統括制御装置および、統括制御方法
JP5750235B2 (ja) * 2010-04-29 2015-07-15 富士機械製造株式会社 製造作業機
JP5728169B2 (ja) * 2010-05-28 2015-06-03 富士機械製造株式会社 製造作業機
EP2566315B1 (en) * 2010-04-29 2022-08-24 FUJI Corporation Integrated control device and integrated control method
JP2012069587A (ja) * 2010-09-21 2012-04-05 Fuji Mach Mfg Co Ltd 対回路基板作業機および対回路基板作業システム
JP6180750B2 (ja) * 2012-02-22 2017-08-16 Juki株式会社 対基板作業システム
EP2822373B1 (en) * 2012-02-28 2019-01-09 FUJI Corporation Component mounting machine
WO2014033900A1 (ja) * 2012-08-31 2014-03-06 富士機械製造株式会社 部品実装機
JP5602287B2 (ja) * 2013-07-23 2014-10-08 富士機械製造株式会社 装着ヘッドメンテナンス装置
WO2015052788A1 (ja) * 2013-10-09 2015-04-16 富士機械製造株式会社 搭載位置最適化プログラム
JP5829713B2 (ja) * 2014-03-19 2015-12-09 富士機械製造株式会社 製造作業機
JP5963800B2 (ja) * 2014-04-25 2016-08-03 富士機械製造株式会社 製造作業機
JP5938487B2 (ja) * 2015-01-20 2016-06-22 富士機械製造株式会社 製造システム構築方法
JP7023154B2 (ja) * 2018-03-28 2022-02-21 芝浦メカトロニクス株式会社 電子部品実装装置
CN112309944A (zh) * 2020-11-09 2021-02-02 博讯光电科技(合肥)有限公司 一种固晶机以及针头取放芯片方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652693U (ja) * 1992-12-24 1994-07-19 鐵治 ▲茨▼木 便器兼用バケツの転倒防止具

Also Published As

Publication number Publication date
JP2004006512A (ja) 2004-01-08

Similar Documents

Publication Publication Date Title
JP4109905B2 (ja) 部品実装基板生産装置
JP4883070B2 (ja) 電子部品実装システムおよび電子部品実装方法
JP4883069B2 (ja) 電子部品実装システムおよび電子部品実装方法
JP2004104075A (ja) 対基板作業システム
US20200089201A1 (en) Component mounting system and progress display system of set-up work
US20180206372A1 (en) Group determination method and group determination apparatus
WO2005039268A1 (ja) 部品装着装置
JP4564235B2 (ja) 部品実装装置及び部品実装方法
JP2010087449A (ja) 電子部品実装システム
KR20120016609A (ko) 전자 부품 실장 시스템 및 전자 부품 실장 방법
JP4163452B2 (ja) 部品実装基板生産装置
KR20140000272A (ko) 전자 부품 실장 시스템 및 전자 부품 실장 방법
KR20140000269A (ko) 전자 부품 실장 시스템 및 전자 부품 실장 방법
JP5845399B2 (ja) 電子部品実装システムおよび電子部品実装方法
KR20140000271A (ko) 전자 부품 실장 시스템 및 전자 부품 실장 방법
JP4354249B2 (ja) 部品装着装置
JP2010118389A (ja) 部品実装方法および部品実装システム
JP2012033686A (ja) 電子部品実装装置及び電子部品実装装置におけるフィーダユニット交換方法
JP4346667B2 (ja) 部品実装装置及び部品実装方法
JP2007281227A (ja) 実装機における部品供給装置の配置設定方法
JP4682994B2 (ja) 電子部品実装装置および電子部品実装方法
WO2021220649A1 (ja) 半田プリコート形成装置および実装基板製造装置
JP2018092971A (ja) 部品実装システムおよび段取り作業管理システムならびに段取り作業管理方法
JP5008579B2 (ja) 電子部品の実装方法、装置及びライン
JP2010056141A (ja) 部品実装システム、部品実装方法、基板貼付状態検出装置、印刷条件データ作成装置および印刷機

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050525

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050525

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080214

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080311

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080407

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110411

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4109905

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120411

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130411

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130411

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140411

Year of fee payment: 6

EXPY Cancellation because of completion of term