JP4101524B2 - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
JP4101524B2
JP4101524B2 JP2002028112A JP2002028112A JP4101524B2 JP 4101524 B2 JP4101524 B2 JP 4101524B2 JP 2002028112 A JP2002028112 A JP 2002028112A JP 2002028112 A JP2002028112 A JP 2002028112A JP 4101524 B2 JP4101524 B2 JP 4101524B2
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Japan
Prior art keywords
target
backing plate
sliding member
pressing member
film forming
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Expired - Fee Related
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JP2002028112A
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English (en)
Japanese (ja)
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JP2003226967A5 (enExample
JP2003226967A (ja
Inventor
博司 大塚
八弥 竹内
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2002028112A priority Critical patent/JP4101524B2/ja
Publication of JP2003226967A publication Critical patent/JP2003226967A/ja
Publication of JP2003226967A5 publication Critical patent/JP2003226967A5/ja
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JP2002028112A 2002-02-05 2002-02-05 成膜装置 Expired - Fee Related JP4101524B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002028112A JP4101524B2 (ja) 2002-02-05 2002-02-05 成膜装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002028112A JP4101524B2 (ja) 2002-02-05 2002-02-05 成膜装置

Publications (3)

Publication Number Publication Date
JP2003226967A JP2003226967A (ja) 2003-08-15
JP2003226967A5 JP2003226967A5 (enExample) 2005-08-11
JP4101524B2 true JP4101524B2 (ja) 2008-06-18

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JP2002028112A Expired - Fee Related JP4101524B2 (ja) 2002-02-05 2002-02-05 成膜装置

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JP (1) JP4101524B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010116605A (ja) * 2008-11-13 2010-05-27 Fujikura Ltd ターゲット保持装置、ならびにこれを用いた成膜装置および成膜方法
JP5995419B2 (ja) * 2011-09-01 2016-09-21 株式会社東芝 スパッタリングターゲット及びそれを用いた磁気メモリの製造方法
JP5775175B2 (ja) 2011-12-12 2015-09-09 キヤノンアネルバ株式会社 スパッタリング装置およびシールド
JP5708472B2 (ja) * 2011-12-21 2015-04-30 住友金属鉱山株式会社 マグネトロンスパッタリングカソード及びこれを備えたスパッタリング装置
JP6360884B2 (ja) * 2013-04-08 2018-07-18 エリコン サーフェス ソリューションズ アーゲー、 プフェフィコン 増加した電力適合性を有するスパッタリングターゲット
JP6339871B2 (ja) * 2014-06-19 2018-06-06 東京エレクトロン株式会社 板状部材の固定機構、ｐｖｄ処理装置及び板状部材の固定方法
JP6508774B2 (ja) * 2015-06-09 2019-05-08 株式会社高純度化学研究所 スパッタリングターゲット組立体
TWI788618B (zh) * 2019-01-25 2023-01-01 美商應用材料股份有限公司 物理氣相沉積靶材組件

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JP2003226967A (ja) 2003-08-15

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