JP4087000B2 - レードル及びレードルのライニング方法 - Google Patents

レードル及びレードルのライニング方法 Download PDF

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Publication number
JP4087000B2
JP4087000B2 JP06089999A JP6089999A JP4087000B2 JP 4087000 B2 JP4087000 B2 JP 4087000B2 JP 06089999 A JP06089999 A JP 06089999A JP 6089999 A JP6089999 A JP 6089999A JP 4087000 B2 JP4087000 B2 JP 4087000B2
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JP
Japan
Prior art keywords
ladle
lining
skull
converter
river
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP06089999A
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English (en)
Japanese (ja)
Other versions
JP2000254771A (ja
JP2000254771A5 (https=
Inventor
文生 橋内
祐史郎 平井
敏博 亀谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to JP06089999A priority Critical patent/JP4087000B2/ja
Priority to US09/520,158 priority patent/US6284044B1/en
Publication of JP2000254771A publication Critical patent/JP2000254771A/ja
Publication of JP2000254771A5 publication Critical patent/JP2000254771A5/ja
Application granted granted Critical
Publication of JP4087000B2 publication Critical patent/JP4087000B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
JP06089999A 1999-03-08 1999-03-08 レードル及びレードルのライニング方法 Expired - Lifetime JP4087000B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP06089999A JP4087000B2 (ja) 1999-03-08 1999-03-08 レードル及びレードルのライニング方法
US09/520,158 US6284044B1 (en) 1999-03-08 2000-03-07 Film forming method and film forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06089999A JP4087000B2 (ja) 1999-03-08 1999-03-08 レードル及びレードルのライニング方法

Publications (3)

Publication Number Publication Date
JP2000254771A JP2000254771A (ja) 2000-09-19
JP2000254771A5 JP2000254771A5 (https=) 2005-06-23
JP4087000B2 true JP4087000B2 (ja) 2008-05-14

Family

ID=13155675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06089999A Expired - Lifetime JP4087000B2 (ja) 1999-03-08 1999-03-08 レードル及びレードルのライニング方法

Country Status (2)

Country Link
US (1) US6284044B1 (https=)
JP (1) JP4087000B2 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551403B1 (en) * 2000-05-25 2003-04-22 Nec Electronics, Inc. Solvent pre-wet system for wafers
JP3754322B2 (ja) * 2001-05-24 2006-03-08 東京エレクトロン株式会社 塗布膜形成方法及びその装置
JP2004322168A (ja) * 2003-04-25 2004-11-18 Disco Abrasive Syst Ltd レーザー加工装置
CN100380596C (zh) * 2003-04-25 2008-04-09 株式会社半导体能源研究所 液滴排出装置、图案的形成方法及半导体装置的制造方法
US7713841B2 (en) * 2003-09-19 2010-05-11 Micron Technology, Inc. Methods for thinning semiconductor substrates that employ support structures formed on the substrates
KR100564582B1 (ko) * 2003-10-28 2006-03-29 삼성전자주식회사 전자 소자 기판의 표면 처리 장치 및 이를 이용한 표면처리 방법
TWI240952B (en) * 2003-10-28 2005-10-01 Samsung Electronics Co Ltd System for rinsing and drying semiconductor substrates and method therefor
JP2005161168A (ja) * 2003-12-01 2005-06-23 Tokyo Ohka Kogyo Co Ltd 被膜形成方法
US7244665B2 (en) * 2004-04-29 2007-07-17 Micron Technology, Inc. Wafer edge ring structures and methods of formation
KR100596783B1 (ko) * 2004-05-03 2006-07-04 주식회사 하이닉스반도체 감광액 도포장치
JP4343022B2 (ja) * 2004-05-10 2009-10-14 東京エレクトロン株式会社 基板の処理方法及び基板の処理装置
JP3988834B2 (ja) * 2004-06-03 2007-10-10 芝浦メカトロニクス株式会社 樹脂層形成方法及び樹脂層形成装置、ディスク及びディスク製造方法
US8158517B2 (en) * 2004-06-28 2012-04-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing wiring substrate, thin film transistor, display device and television device
JP4531502B2 (ja) * 2004-09-14 2010-08-25 東京エレクトロン株式会社 塗布処理装置
JP4216238B2 (ja) * 2004-09-24 2009-01-28 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
DE102004053139A1 (de) * 2004-11-03 2006-06-01 Süss Microtec Lithography Gmbh Drehbare Vorrichtung zum Halten eines Substrats
CN100592208C (zh) * 2006-07-03 2010-02-24 元太科技工业股份有限公司 防止静电聚集的光刻胶涂布机承载盘
US20080176004A1 (en) * 2007-01-19 2008-07-24 Tokyo Electron Limited Coating treatment apparatus, substrate treatment system, coating treatment method, and computer storage medium
JP5262117B2 (ja) * 2007-04-11 2013-08-14 株式会社リコー スピンコート装置及びその温度制御方法、並びに光ディスク製造装置及び光ディスク製造方法
CN109676839B (zh) * 2018-12-11 2022-02-22 上海航天控制技术研究所 一种用于多类型陀螺仪的智能固胶仪器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609995A (en) * 1995-08-30 1997-03-11 Micron Technology, Inc. Method for forming a thin uniform layer of resist for lithography
JP3300624B2 (ja) 1997-01-24 2002-07-08 東京エレクトロン株式会社 基板端面の洗浄方法
US6094965A (en) * 1998-05-29 2000-08-01 Vlsi Technology, Inc. Semiconductor calibration structures and calibration wafers for ascertaining layer alignment during processing and calibrating multiple semiconductor wafer coating systems
US6121130A (en) * 1998-11-16 2000-09-19 Chartered Semiconductor Manufacturing Ltd. Laser curing of spin-on dielectric thin films

Also Published As

Publication number Publication date
JP2000254771A (ja) 2000-09-19
US6284044B1 (en) 2001-09-04

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