JP2000254771A5 - - Google Patents

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Publication number
JP2000254771A5
JP2000254771A5 JP1999060899A JP6089999A JP2000254771A5 JP 2000254771 A5 JP2000254771 A5 JP 2000254771A5 JP 1999060899 A JP1999060899 A JP 1999060899A JP 6089999 A JP6089999 A JP 6089999A JP 2000254771 A5 JP2000254771 A5 JP 2000254771A5
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JP
Japan
Prior art keywords
ladle
lining
granular
particle size
skull
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999060899A
Other languages
English (en)
Japanese (ja)
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JP2000254771A (ja
JP4087000B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP06089999A priority Critical patent/JP4087000B2/ja
Priority claimed from JP06089999A external-priority patent/JP4087000B2/ja
Priority to US09/520,158 priority patent/US6284044B1/en
Publication of JP2000254771A publication Critical patent/JP2000254771A/ja
Publication of JP2000254771A5 publication Critical patent/JP2000254771A5/ja
Application granted granted Critical
Publication of JP4087000B2 publication Critical patent/JP4087000B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP06089999A 1999-03-08 1999-03-08 レードル及びレードルのライニング方法 Expired - Lifetime JP4087000B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP06089999A JP4087000B2 (ja) 1999-03-08 1999-03-08 レードル及びレードルのライニング方法
US09/520,158 US6284044B1 (en) 1999-03-08 2000-03-07 Film forming method and film forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06089999A JP4087000B2 (ja) 1999-03-08 1999-03-08 レードル及びレードルのライニング方法

Publications (3)

Publication Number Publication Date
JP2000254771A JP2000254771A (ja) 2000-09-19
JP2000254771A5 true JP2000254771A5 (https=) 2005-06-23
JP4087000B2 JP4087000B2 (ja) 2008-05-14

Family

ID=13155675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06089999A Expired - Lifetime JP4087000B2 (ja) 1999-03-08 1999-03-08 レードル及びレードルのライニング方法

Country Status (2)

Country Link
US (1) US6284044B1 (https=)
JP (1) JP4087000B2 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551403B1 (en) * 2000-05-25 2003-04-22 Nec Electronics, Inc. Solvent pre-wet system for wafers
JP3754322B2 (ja) * 2001-05-24 2006-03-08 東京エレクトロン株式会社 塗布膜形成方法及びその装置
JP2004322168A (ja) * 2003-04-25 2004-11-18 Disco Abrasive Syst Ltd レーザー加工装置
CN100380596C (zh) * 2003-04-25 2008-04-09 株式会社半导体能源研究所 液滴排出装置、图案的形成方法及半导体装置的制造方法
US7713841B2 (en) * 2003-09-19 2010-05-11 Micron Technology, Inc. Methods for thinning semiconductor substrates that employ support structures formed on the substrates
KR100564582B1 (ko) * 2003-10-28 2006-03-29 삼성전자주식회사 전자 소자 기판의 표면 처리 장치 및 이를 이용한 표면처리 방법
TWI240952B (en) * 2003-10-28 2005-10-01 Samsung Electronics Co Ltd System for rinsing and drying semiconductor substrates and method therefor
JP2005161168A (ja) * 2003-12-01 2005-06-23 Tokyo Ohka Kogyo Co Ltd 被膜形成方法
US7244665B2 (en) * 2004-04-29 2007-07-17 Micron Technology, Inc. Wafer edge ring structures and methods of formation
KR100596783B1 (ko) * 2004-05-03 2006-07-04 주식회사 하이닉스반도체 감광액 도포장치
JP4343022B2 (ja) * 2004-05-10 2009-10-14 東京エレクトロン株式会社 基板の処理方法及び基板の処理装置
US8088438B2 (en) * 2004-06-03 2012-01-03 Shibaura Mechatronics Corporation Resin layer formation method, resin layer formation device, and disk manufacturing method
US8158517B2 (en) * 2004-06-28 2012-04-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing wiring substrate, thin film transistor, display device and television device
JP4531502B2 (ja) * 2004-09-14 2010-08-25 東京エレクトロン株式会社 塗布処理装置
JP4216238B2 (ja) * 2004-09-24 2009-01-28 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
DE102004053139A1 (de) * 2004-11-03 2006-06-01 Süss Microtec Lithography Gmbh Drehbare Vorrichtung zum Halten eines Substrats
CN100592208C (zh) * 2006-07-03 2010-02-24 元太科技工业股份有限公司 防止静电聚集的光刻胶涂布机承载盘
US20080176004A1 (en) * 2007-01-19 2008-07-24 Tokyo Electron Limited Coating treatment apparatus, substrate treatment system, coating treatment method, and computer storage medium
JP5262117B2 (ja) * 2007-04-11 2013-08-14 株式会社リコー スピンコート装置及びその温度制御方法、並びに光ディスク製造装置及び光ディスク製造方法
CN109676839B (zh) * 2018-12-11 2022-02-22 上海航天控制技术研究所 一种用于多类型陀螺仪的智能固胶仪器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609995A (en) * 1995-08-30 1997-03-11 Micron Technology, Inc. Method for forming a thin uniform layer of resist for lithography
JP3300624B2 (ja) 1997-01-24 2002-07-08 東京エレクトロン株式会社 基板端面の洗浄方法
US6094965A (en) * 1998-05-29 2000-08-01 Vlsi Technology, Inc. Semiconductor calibration structures and calibration wafers for ascertaining layer alignment during processing and calibrating multiple semiconductor wafer coating systems
US6121130A (en) * 1998-11-16 2000-09-19 Chartered Semiconductor Manufacturing Ltd. Laser curing of spin-on dielectric thin films

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