JP4084929B2 - フッ化水素ガスを用いる高純度溶液の調製方法 - Google Patents

フッ化水素ガスを用いる高純度溶液の調製方法 Download PDF

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Publication number
JP4084929B2
JP4084929B2 JP2000607921A JP2000607921A JP4084929B2 JP 4084929 B2 JP4084929 B2 JP 4084929B2 JP 2000607921 A JP2000607921 A JP 2000607921A JP 2000607921 A JP2000607921 A JP 2000607921A JP 4084929 B2 JP4084929 B2 JP 4084929B2
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Japan
Prior art keywords
hydrogen fluoride
gas
water
purity
solution
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000607921A
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English (en)
Japanese (ja)
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JP2002540257A (ja
JP2002540257A5 (https=
Inventor
ジーヴェルト,ヴォルフガング
Original Assignee
ハネウェル・スペシャルティ・ケミカルズ・ゼールツェ・ゲーエムベーハー
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Publication of JP2002540257A publication Critical patent/JP2002540257A/ja
Publication of JP2002540257A5 publication Critical patent/JP2002540257A5/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B7/00Halogens; Halogen acids
    • C01B7/19Fluorine; Hydrogen fluoride
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B7/00Halogens; Halogen acids
    • C01B7/09Bromine; Hydrogen bromide
    • C01B7/093Hydrogen bromide
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B7/00Halogens; Halogen acids
    • C01B7/01Chlorine; Hydrogen chloride
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B7/00Halogens; Halogen acids
    • C01B7/19Fluorine; Hydrogen fluoride
    • C01B7/191Hydrogen fluoride
    • C01B7/195Separation; Purification
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/60Wet etching
    • H10P50/64Wet etching of semiconductor materials
    • H10P50/642Chemical etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Hydrogen, Water And Hydrids (AREA)
  • Gas Separation By Absorption (AREA)
  • ing And Chemical Polishing (AREA)
JP2000607921A 1999-03-29 2000-03-29 フッ化水素ガスを用いる高純度溶液の調製方法 Expired - Fee Related JP4084929B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19914243.2 1999-03-29
DE19914243A DE19914243A1 (de) 1999-03-29 1999-03-29 Verfahren zur Herstellung hochreiner Lösungen unter Verwendung von gasförmigem Fluorwasserstoff
PCT/EP2000/002763 WO2000058208A2 (de) 1999-03-29 2000-03-29 Verfahren zur herstellung hochreiner lösungen unter verwendung von gasförmigem fluorwasserstoff

Publications (3)

Publication Number Publication Date
JP2002540257A JP2002540257A (ja) 2002-11-26
JP2002540257A5 JP2002540257A5 (https=) 2006-01-05
JP4084929B2 true JP4084929B2 (ja) 2008-04-30

Family

ID=7902836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000607921A Expired - Fee Related JP4084929B2 (ja) 1999-03-29 2000-03-29 フッ化水素ガスを用いる高純度溶液の調製方法

Country Status (13)

Country Link
EP (1) EP1171379B1 (https=)
JP (1) JP4084929B2 (https=)
KR (1) KR100742575B1 (https=)
CN (1) CN1319851C (https=)
AT (1) ATE321009T1 (https=)
AU (1) AU4291300A (https=)
BR (1) BR0009387A (https=)
CA (1) CA2368441A1 (https=)
DE (2) DE19914243A1 (https=)
HK (1) HK1045977A1 (https=)
IL (1) IL145623A0 (https=)
MX (1) MXPA01009861A (https=)
WO (1) WO2000058208A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8153095B2 (en) * 1999-03-29 2012-04-10 Honeywell International Inc. Method for producing highly pure solutions using gaseous hydrogen fluoride
EP1509476A1 (en) * 2002-06-05 2005-03-02 Honeywell International Inc. Method for producing highly pure anhydrous solutions containing hydrogen fluoride
US7192860B2 (en) 2002-06-20 2007-03-20 Honeywell International Inc. Highly selective silicon oxide etching compositions
TWI282814B (en) * 2002-09-13 2007-06-21 Daikin Ind Ltd Etchant and etching method
CN1326771C (zh) * 2005-10-18 2007-07-18 自贡市金典化工有限公司 碘化铵的生产方法
CN102774813A (zh) * 2011-05-12 2012-11-14 特力生有限公司 氢氟酸制造方法
CN110369126B (zh) * 2019-08-05 2020-06-23 潍坊奇为新材料科技有限公司 一种高饱和磁通量导磁介质

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2520947A (en) * 1946-04-08 1950-09-05 Phillips Petroleum Co Recovery of hydrogen halides
US2537076A (en) * 1948-08-25 1951-01-09 Standard Oil Co Hydrogen fluoride recovery
FR1477742A (fr) * 1966-03-11 1967-04-21 Pechiney Saint Gobain Procédé d'extraction et de concentration de l'acide fluorhydrique gazeux par des solvants aminés
US3979241A (en) * 1968-12-28 1976-09-07 Fujitsu Ltd. Method of etching films of silicon nitride and silicon dioxide
US4269654A (en) * 1977-11-18 1981-05-26 Rca Corporation Silicon nitride and silicon oxide etchant
US4230523A (en) * 1978-12-29 1980-10-28 International Business Machines Corporation Etchant for silicon dioxide films disposed atop silicon or metallic silicides
US4629610A (en) * 1985-05-10 1986-12-16 Dow Chemical Co. Hydrogen fluoride recovery process
CH664978A5 (en) * 1985-06-25 1988-04-15 Industrieorientierte Forsch Etching oxidic material - with hydrogen fluoride soln. in organic cpd. including nitrogen cpd. forming complex, esp. pyridine, useful in optical industry
DD254373A1 (de) * 1986-12-09 1988-02-24 Nuenchritz Chemie Verfahren zur gewinnung hochreiner fluorwasserstoffsaeure
DD281173A5 (de) * 1989-04-04 1990-08-01 Nuenchritz Chemie Verfahren zur herstellung von hochreinem, kristallisierten ammoniumfluorid
JP2896268B2 (ja) * 1992-05-22 1999-05-31 三菱電機株式会社 半導体基板の表面処理装置及びその制御方法
US5320709A (en) * 1993-02-24 1994-06-14 Advanced Chemical Systems International Incorporated Method for selective removal of organometallic and organosilicon residues and damaged oxides using anhydrous ammonium fluoride solution
CA2141492C (en) * 1994-04-28 1999-07-27 Bruce B. Randolph Transportation of hydrogen fluoride
WO1997002958A1 (en) * 1995-07-10 1997-01-30 Advanced Chemical Systems International Organic amine/hydrogen fluoride etchant composition and method
TW434196B (en) * 1997-06-25 2001-05-16 Ibm Selective etching of silicate

Also Published As

Publication number Publication date
WO2000058208A3 (de) 2001-04-26
ATE321009T1 (de) 2006-04-15
AU4291300A (en) 2000-10-16
KR100742575B1 (ko) 2007-08-02
HK1045977A1 (zh) 2002-12-20
DE50012445D1 (de) 2006-07-13
IL145623A0 (en) 2002-06-30
JP2002540257A (ja) 2002-11-26
CN1346331A (zh) 2002-04-24
CA2368441A1 (en) 2000-10-05
DE19914243A1 (de) 2000-10-05
BR0009387A (pt) 2002-01-29
MXPA01009861A (es) 2003-06-24
KR20020024577A (ko) 2002-03-30
EP1171379A2 (de) 2002-01-16
CN1319851C (zh) 2007-06-06
EP1171379B1 (de) 2006-03-22
WO2000058208A2 (de) 2000-10-05

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