JP4067819B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP4067819B2 JP4067819B2 JP2001382483A JP2001382483A JP4067819B2 JP 4067819 B2 JP4067819 B2 JP 4067819B2 JP 2001382483 A JP2001382483 A JP 2001382483A JP 2001382483 A JP2001382483 A JP 2001382483A JP 4067819 B2 JP4067819 B2 JP 4067819B2
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- JP
- Japan
- Prior art keywords
- film
- signal line
- tft
- source signal
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims description 45
- 238000007639 printing Methods 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000002923 metal particle Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 169
- 238000000034 method Methods 0.000 description 112
- 239000012535 impurity Substances 0.000 description 81
- 239000000758 substrate Substances 0.000 description 61
- 238000007747 plating Methods 0.000 description 59
- 239000004020 conductor Substances 0.000 description 58
- 239000004065 semiconductor Substances 0.000 description 58
- 238000005530 etching Methods 0.000 description 54
- 150000002894 organic compounds Chemical class 0.000 description 46
- 239000011229 interlayer Substances 0.000 description 35
- 239000007789 gas Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 238000009713 electroplating Methods 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 14
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 14
- 239000011521 glass Substances 0.000 description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 11
- 238000002425 crystallisation Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 11
- 239000011159 matrix material Substances 0.000 description 11
- 229910052698 phosphorus Inorganic materials 0.000 description 11
- 239000011574 phosphorus Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- 238000001994 activation Methods 0.000 description 9
- 239000000460 chlorine Substances 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 230000008025 crystallization Effects 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 230000004913 activation Effects 0.000 description 8
- 239000002585 base Substances 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- 239000007769 metal material Substances 0.000 description 8
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 239000000956 alloy Substances 0.000 description 6
- 238000000137 annealing Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 238000009616 inductively coupled plasma Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- -1 polyphenylene vinylene Polymers 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 230000010355 oscillation Effects 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000005224 laser annealing Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000005407 aluminoborosilicate glass Substances 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000005281 excited state Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000005499 laser crystallization Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 150000005072 1,3,4-oxadiazoles Chemical class 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910052775 Thulium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- VBVAVBCYMYWNOU-UHFFFAOYSA-N coumarin 6 Chemical compound C1=CC=C2SC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 VBVAVBCYMYWNOU-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Thin Film Transistor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001382483A JP4067819B2 (ja) | 2000-12-21 | 2001-12-17 | 発光装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000388378 | 2000-12-21 | ||
| JP2000-388378 | 2000-12-21 | ||
| JP2001382483A JP4067819B2 (ja) | 2000-12-21 | 2001-12-17 | 発光装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007307801A Division JP4741569B2 (ja) | 2000-12-21 | 2007-11-28 | 発光装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002318555A JP2002318555A (ja) | 2002-10-31 |
| JP2002318555A5 JP2002318555A5 (enExample) | 2005-07-28 |
| JP4067819B2 true JP4067819B2 (ja) | 2008-03-26 |
Family
ID=26606250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001382483A Expired - Fee Related JP4067819B2 (ja) | 2000-12-21 | 2001-12-17 | 発光装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4067819B2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005032704A (ja) * | 2003-06-18 | 2005-02-03 | Sharp Corp | 表示素子および表示装置 |
| KR100659532B1 (ko) | 2003-11-28 | 2006-12-19 | 삼성에스디아이 주식회사 | 평판표시장치 및 그의 제조방법 |
| KR100642491B1 (ko) * | 2003-12-26 | 2006-11-02 | 엘지.필립스 엘시디 주식회사 | 유기전계발광 소자 |
| JP4654581B2 (ja) * | 2004-01-30 | 2011-03-23 | セイコーエプソン株式会社 | Tft基板の製造方法 |
| JP4583776B2 (ja) * | 2004-02-13 | 2010-11-17 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| US7753751B2 (en) * | 2004-09-29 | 2010-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating the display device |
| KR100583139B1 (ko) * | 2004-10-08 | 2006-05-23 | 삼성에스디아이 주식회사 | 발광 표시장치 |
| JP2006164737A (ja) * | 2004-12-07 | 2006-06-22 | Sharp Corp | 表示素子、若しくはそれを備えた表示パネル及び表示装置 |
| EP1717789B1 (en) * | 2005-04-26 | 2016-04-13 | LG Display Co., Ltd. | Electro luminescence display device |
| JP2007187981A (ja) * | 2006-01-16 | 2007-07-26 | Toshiba Matsushita Display Technology Co Ltd | 表示装置 |
| KR20070082685A (ko) * | 2006-02-17 | 2007-08-22 | 삼성전자주식회사 | 표시 장치 및 그 제조 방법 |
| JP4403430B2 (ja) | 2007-03-14 | 2010-01-27 | ソニー株式会社 | 表示パネル及び電子機器 |
| US20120138904A1 (en) * | 2007-09-21 | 2012-06-07 | Takahisa Shimizu | Organic electroluminescence display and production method thereof |
| JP4853882B2 (ja) * | 2009-01-28 | 2012-01-11 | 東北パイオニア株式会社 | 有機el表示装置及びその製造方法 |
| US8741677B2 (en) | 2010-11-30 | 2014-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of the same |
| JP2013057726A (ja) * | 2011-09-07 | 2013-03-28 | Sony Corp | 表示パネル、表示装置および電子機器 |
| KR101818033B1 (ko) | 2011-11-01 | 2018-01-16 | 한국전자통신연구원 | 플렉시블 전극 기판의 제조방법 |
| JP5427253B2 (ja) * | 2012-02-06 | 2014-02-26 | シャープ株式会社 | 有機el素子、若しくはそれを備えた表示パネル及び表示装置 |
| JP5642841B2 (ja) * | 2013-05-28 | 2014-12-17 | シャープ株式会社 | 有機el素子、若しくはそれを備えた表示パネル及び表示装置 |
| JPWO2017158946A1 (ja) * | 2016-03-18 | 2019-01-17 | コニカミノルタ株式会社 | 有機エレクトロルミネッセンス素子のパターニング方法及びパターニング装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028821A (ja) * | 1988-06-28 | 1990-01-12 | Sharp Corp | アクティブマトリックス基板 |
| JP2846028B2 (ja) * | 1990-01-18 | 1999-01-13 | シチズン時計株式会社 | 液晶表示パネル基板の製造方法 |
| JPH07110495A (ja) * | 1993-10-14 | 1995-04-25 | Hitachi Ltd | アクティブマトリクス型液晶表示装置 |
| JPH07140475A (ja) * | 1993-11-16 | 1995-06-02 | Rohm Co Ltd | 液晶表示装置の配線構造 |
| JP3297666B2 (ja) * | 1994-06-02 | 2002-07-02 | 株式会社半導体エネルギー研究所 | アクティブマトリクス表示装置 |
| JPH0945930A (ja) * | 1995-07-28 | 1997-02-14 | Sony Corp | 薄膜トランジスタ及びその製造方法 |
| JPH09106887A (ja) * | 1995-08-09 | 1997-04-22 | Citizen Watch Co Ltd | 有機エレクトロルミネセンス素子およびその駆動方法 |
| JP2776336B2 (ja) * | 1995-09-26 | 1998-07-16 | 日本電気株式会社 | 薄膜トランジスタおよび薄膜トランジスタの製造方法 |
| JPH09318975A (ja) * | 1996-05-30 | 1997-12-12 | Nec Corp | 薄膜電界効果型トランジスタ素子アレイおよびその製造 方法 |
| JP4472064B2 (ja) * | 1998-08-31 | 2010-06-02 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| KR100290913B1 (ko) * | 1999-03-04 | 2001-05-15 | 김영환 | 고전압 소자 및 그 제조방법 |
| JP4578611B2 (ja) * | 1999-03-26 | 2010-11-10 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3480697B2 (ja) * | 1999-05-10 | 2003-12-22 | ナノックス株式会社 | Cog型液晶表示装置の製造方法 |
| JP4552239B2 (ja) * | 1999-05-12 | 2010-09-29 | ソニー株式会社 | 表示用薄膜半導体素子及び表示装置 |
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