JP4061531B2 - 活性エネルギー線硬化型ポリイミド樹脂組成物 - Google Patents

活性エネルギー線硬化型ポリイミド樹脂組成物 Download PDF

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Publication number
JP4061531B2
JP4061531B2 JP2002158418A JP2002158418A JP4061531B2 JP 4061531 B2 JP4061531 B2 JP 4061531B2 JP 2002158418 A JP2002158418 A JP 2002158418A JP 2002158418 A JP2002158418 A JP 2002158418A JP 4061531 B2 JP4061531 B2 JP 4061531B2
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Japan
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compound
polyimide resin
group
meth
acid
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Japanese (ja)
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JP2003221429A (ja
JP2003221429A5 (enrdf_load_stackoverflow
Inventor
栄寿 一ノ瀬
洋三 山科
英宣 石川
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DIC Corp
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Dainippon Ink and Chemicals Co Ltd
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Priority to JP2002158418A priority Critical patent/JP4061531B2/ja
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Publication of JP2003221429A5 publication Critical patent/JP2003221429A5/ja
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  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2002158418A 2001-06-28 2002-05-31 活性エネルギー線硬化型ポリイミド樹脂組成物 Expired - Fee Related JP4061531B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002158418A JP4061531B2 (ja) 2001-06-28 2002-05-31 活性エネルギー線硬化型ポリイミド樹脂組成物

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2001-196548 2001-06-28
JP2001196548 2001-06-28
JP2001-231122 2001-07-31
JP2001231121 2001-07-31
JP2001231122 2001-07-31
JP2001-231121 2001-07-31
JP2001357519 2001-11-22
JP2001-357519 2001-11-22
JP2002158418A JP4061531B2 (ja) 2001-06-28 2002-05-31 活性エネルギー線硬化型ポリイミド樹脂組成物

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JP2003221429A JP2003221429A (ja) 2003-08-05
JP2003221429A5 JP2003221429A5 (enrdf_load_stackoverflow) 2005-01-06
JP4061531B2 true JP4061531B2 (ja) 2008-03-19

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JP (1) JP4061531B2 (enrdf_load_stackoverflow)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4716073B2 (ja) * 2001-07-03 2011-07-06 日立化成工業株式会社 感光性樹脂組成物、これを用いたパターン製造法及び電子部品
JP2007121742A (ja) * 2005-10-28 2007-05-17 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物及び積層体
TW201035680A (en) * 2008-12-25 2010-10-01 Ajinomoto Kk Photosensitive resin composition
JP5472693B2 (ja) * 2009-07-06 2014-04-16 日立化成株式会社 感光性樹脂組成物及びそれを用いた感光性フィルム
JP5545529B2 (ja) * 2010-03-05 2014-07-09 Ｄｉｃ株式会社 活性エネルギー線硬化型樹脂組成物およびその硬化物
JP2011186042A (ja) * 2010-03-05 2011-09-22 Dic Corp 活性エネルギー線硬化型樹脂組成物
KR102351942B1 (ko) * 2016-06-21 2022-01-18 디아이씨 가부시끼가이샤 알코올 변성 폴리아미드이미드 수지 및 그 제조 방법
TW201905017A (zh) * 2017-06-14 2019-02-01 日商迪愛生股份有限公司 含有酸基之（甲基）丙烯酸酯樹脂及阻焊劑用樹脂材料
JP7172555B2 (ja) * 2018-12-19 2022-11-16 Dic株式会社 酸基含有（メタ）アクリレート樹脂組成物、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
JP7188053B2 (ja) * 2018-12-19 2022-12-13 Dic株式会社 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
JP7228093B2 (ja) * 2018-12-19 2023-02-24 Dic株式会社 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
JP7183761B2 (ja) * 2018-12-19 2022-12-06 Dic株式会社 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
JP7196587B2 (ja) * 2018-12-19 2022-12-27 Dic株式会社 酸基含有（メタ）アクリレート樹脂、硬化性樹脂組成物、硬化物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
CN114341734A (zh) 2019-09-06 2022-04-12 太阳油墨制造株式会社 固化性树脂组合物、其干膜和固化物、和包含该固化物的电子部件
JP7258004B2 (ja) * 2020-11-27 2023-04-14 株式会社タムラ製作所 感光性組成物
JP2022178422A (ja) * 2021-05-20 2022-12-02 Dic株式会社 樹脂、活性エネルギー線硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
JP2023003576A (ja) * 2021-06-24 2023-01-17 Dic株式会社 樹脂、硬化性樹脂組成物、硬化物、絶縁材料及びレジスト部材
CN114702672B (zh) * 2022-04-29 2024-02-27 深圳市志邦科技有限公司 可溶性uv固化聚酰亚胺丙烯酸树脂的制备方法及应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000039710A (ja) * 1998-07-24 2000-02-08 Hitachi Chem Co Ltd 感光性樹脂組成物及びレリーフパターンの製造法
JP4997661B2 (ja) * 1999-03-30 2012-08-08 Ｄｉｃ株式会社 イミド（アミド）樹脂の製造方法及びその樹脂を使用したエネルギー線硬化型樹脂組成物
JP2001296658A (ja) * 2000-04-17 2001-10-26 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP4111654B2 (ja) * 2000-04-19 2008-07-02 日本化薬株式会社 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2001316436A (ja) * 2000-05-11 2001-11-13 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2001323036A (ja) * 2000-05-16 2001-11-20 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2002151832A (ja) * 2000-11-10 2002-05-24 Ube Ind Ltd 感光性ポリイミドを用いた高密度フレキシブル基板の製造法

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