JP4016384B2 - パワーモジュールおよびこれを用いたモータ制御装置 - Google Patents

パワーモジュールおよびこれを用いたモータ制御装置 Download PDF

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Publication number
JP4016384B2
JP4016384B2 JP2002176367A JP2002176367A JP4016384B2 JP 4016384 B2 JP4016384 B2 JP 4016384B2 JP 2002176367 A JP2002176367 A JP 2002176367A JP 2002176367 A JP2002176367 A JP 2002176367A JP 4016384 B2 JP4016384 B2 JP 4016384B2
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JP
Japan
Prior art keywords
semiconductor chip
metal wiring
power module
lower arm
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002176367A
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English (en)
Japanese (ja)
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JP2004022844A (ja
JP2004022844A5 (enExample
Inventor
国浩 竹中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP2002176367A priority Critical patent/JP4016384B2/ja
Publication of JP2004022844A publication Critical patent/JP2004022844A/ja
Publication of JP2004022844A5 publication Critical patent/JP2004022844A5/ja
Application granted granted Critical
Publication of JP4016384B2 publication Critical patent/JP4016384B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2002176367A 2002-06-17 2002-06-17 パワーモジュールおよびこれを用いたモータ制御装置 Expired - Fee Related JP4016384B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002176367A JP4016384B2 (ja) 2002-06-17 2002-06-17 パワーモジュールおよびこれを用いたモータ制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002176367A JP4016384B2 (ja) 2002-06-17 2002-06-17 パワーモジュールおよびこれを用いたモータ制御装置

Publications (3)

Publication Number Publication Date
JP2004022844A JP2004022844A (ja) 2004-01-22
JP2004022844A5 JP2004022844A5 (enExample) 2005-10-06
JP4016384B2 true JP4016384B2 (ja) 2007-12-05

Family

ID=31174726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002176367A Expired - Fee Related JP4016384B2 (ja) 2002-06-17 2002-06-17 パワーモジュールおよびこれを用いたモータ制御装置

Country Status (1)

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JP (1) JP4016384B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004032371A1 (de) * 2004-06-30 2006-01-26 Robert Bosch Gmbh Elektronische Schaltungseinheit
JP4583191B2 (ja) 2005-01-28 2010-11-17 三菱電機株式会社 回転電機
US7554188B2 (en) * 2006-04-13 2009-06-30 International Rectifier Corporation Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes
WO2009125779A1 (ja) 2008-04-09 2009-10-15 富士電機デバイステクノロジー株式会社 半導体装置及び半導体装置の製造方法
WO2009150875A1 (ja) * 2008-06-12 2009-12-17 株式会社安川電機 パワーモジュールおよびその制御方法
WO2011145219A1 (ja) * 2010-05-21 2011-11-24 三菱電機株式会社 パワー半導体モジュール
KR101343199B1 (ko) 2011-12-07 2013-12-19 삼성전기주식회사 반도체 패키지
WO2015005181A1 (ja) * 2013-07-08 2015-01-15 株式会社 村田製作所 電力変換部品
JP6417947B2 (ja) * 2015-01-09 2018-11-07 株式会社デンソー 三相インバータ回路の実装構造
JP6497286B2 (ja) * 2015-09-18 2019-04-10 株式会社デンソー 半導体モジュール
JP6972686B2 (ja) * 2017-06-15 2021-11-24 株式会社ジェイテクト 半導体装置
DE112018003182T5 (de) * 2017-06-21 2020-03-05 Sumitomo Electric Industries, Ltd. Elektronische Schaltungsvorrichtung
CN116033702A (zh) * 2021-10-27 2023-04-28 国网上海市电力公司 一种igbt功率器件的压装结构
CN115621224A (zh) * 2022-08-23 2023-01-17 北京萃锦科技有限公司 一种无键合的双面散热模块及其制造方法
CN115763270B (zh) * 2022-11-28 2026-08-07 株洲中车时代半导体股份有限公司 Igbt模块贴装焊接方法

Also Published As

Publication number Publication date
JP2004022844A (ja) 2004-01-22

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