JP2004022844A5 - - Google Patents

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Publication number
JP2004022844A5
JP2004022844A5 JP2002176367A JP2002176367A JP2004022844A5 JP 2004022844 A5 JP2004022844 A5 JP 2004022844A5 JP 2002176367 A JP2002176367 A JP 2002176367A JP 2002176367 A JP2002176367 A JP 2002176367A JP 2004022844 A5 JP2004022844 A5 JP 2004022844A5
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JP
Japan
Prior art keywords
power module
free
semiconductor chip
wheeling diodes
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002176367A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004022844A (ja
JP4016384B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2002176367A priority Critical patent/JP4016384B2/ja
Priority claimed from JP2002176367A external-priority patent/JP4016384B2/ja
Publication of JP2004022844A publication Critical patent/JP2004022844A/ja
Publication of JP2004022844A5 publication Critical patent/JP2004022844A5/ja
Application granted granted Critical
Publication of JP4016384B2 publication Critical patent/JP4016384B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002176367A 2002-06-17 2002-06-17 パワーモジュールおよびこれを用いたモータ制御装置 Expired - Fee Related JP4016384B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002176367A JP4016384B2 (ja) 2002-06-17 2002-06-17 パワーモジュールおよびこれを用いたモータ制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002176367A JP4016384B2 (ja) 2002-06-17 2002-06-17 パワーモジュールおよびこれを用いたモータ制御装置

Publications (3)

Publication Number Publication Date
JP2004022844A JP2004022844A (ja) 2004-01-22
JP2004022844A5 true JP2004022844A5 (enExample) 2005-10-06
JP4016384B2 JP4016384B2 (ja) 2007-12-05

Family

ID=31174726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002176367A Expired - Fee Related JP4016384B2 (ja) 2002-06-17 2002-06-17 パワーモジュールおよびこれを用いたモータ制御装置

Country Status (1)

Country Link
JP (1) JP4016384B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004032371A1 (de) * 2004-06-30 2006-01-26 Robert Bosch Gmbh Elektronische Schaltungseinheit
JP4583191B2 (ja) 2005-01-28 2010-11-17 三菱電機株式会社 回転電機
US7554188B2 (en) * 2006-04-13 2009-06-30 International Rectifier Corporation Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes
WO2009125779A1 (ja) 2008-04-09 2009-10-15 富士電機デバイステクノロジー株式会社 半導体装置及び半導体装置の製造方法
WO2009150875A1 (ja) * 2008-06-12 2009-12-17 株式会社安川電機 パワーモジュールおよびその制御方法
WO2011145219A1 (ja) * 2010-05-21 2011-11-24 三菱電機株式会社 パワー半導体モジュール
KR101343199B1 (ko) 2011-12-07 2013-12-19 삼성전기주식회사 반도체 패키지
WO2015005181A1 (ja) * 2013-07-08 2015-01-15 株式会社 村田製作所 電力変換部品
JP6417947B2 (ja) * 2015-01-09 2018-11-07 株式会社デンソー 三相インバータ回路の実装構造
JP6497286B2 (ja) * 2015-09-18 2019-04-10 株式会社デンソー 半導体モジュール
JP6972686B2 (ja) * 2017-06-15 2021-11-24 株式会社ジェイテクト 半導体装置
DE112018003182T5 (de) * 2017-06-21 2020-03-05 Sumitomo Electric Industries, Ltd. Elektronische Schaltungsvorrichtung
CN116033702A (zh) * 2021-10-27 2023-04-28 国网上海市电力公司 一种igbt功率器件的压装结构
CN115621224A (zh) * 2022-08-23 2023-01-17 北京萃锦科技有限公司 一种无键合的双面散热模块及其制造方法
CN115763270B (zh) * 2022-11-28 2026-08-07 株洲中车时代半导体股份有限公司 Igbt模块贴装焊接方法

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