Claims (1)
1330517 . ；. ----------j}(A半) -- 十、中請專利範圍： 丨參·’月 修⑻正餘乂 «------ 1、—種記憶體模組，包括： 衩數記憶體，每一記憶體各具有至少一個熱源；及 /一散熱裴置，係包括一散熱片及複數導熱部，該散熱 片係/、有複數個貫穿其頂面及底面的插槽，每一個導熱部 有基片及兩連接片，該兩連接片係延伸自該基片且 、刀別牙過"亥散熱片的插槽而連接到相對應之記憶體的熱 •源，該基片係貼靠於該散熱片的頂面。 、、2如申睛專利範圍第丨項所述之記憶體模組，其中該 3接片係分別向内傾斜一角度使呈内縮狀供夾設於該記 3如申睛專利範圍第丨項所述之記憶體模組，其中該 相分別向外傾斜一角度使呈外擴狀供分別頂於兩 相砷的記憶體。. 4、—如申請專利範圍第卜2或3項所述之記憶體模組， :片;:部分別具有一結合結構，該結合結構包括 兩:二 片扣片係平行設於其中一連接片上，另 片皆二m連接片的相對應位置，且該些扣 熱片的底面。a些扣片的頂端可彈性頂於該散 3、—種記憶體模組，包括： 啜數記憶體，每一記憶體各具有埶 一埤也壯职 土夕個熱源；及 .…、裝置，係包括一散熱片及複 锻数導熱部，該散熱 12 〜丄/ 有個貫穿其頂面及底面的插槽，每-個導熱部 連接片，該連接片係延伸自該基片且穿 片槽而連接到相對應的記憶體的熱源，該基 月係貼罪於該散熱片的頂面。 各、曾细申明專利轨圍第5項所述之記憶體模組’並中該 母-導熱部分別具有一結合結…：：亥 片’該兩扣片係平杆„认分、由 I°構包括兩扣 度，使詨此i h'm °又；。連接片上，且並向外傾斜一角 Μ二扣片的頂端可彈性頂於該散熱片的底面。 包括I、二申請專利範圍第1或5項所述之記憶體模組，更 =至少一個風扇’該散熱片上具有 】 些風扇係結合於該散埶 狀.、、、札4 散熱孔吹向該記憶體。 〃斤產生之乳流可經該些 8、一種散熱裝置，包括： 至少—導熱部，係具有一基片及兩連接片 伸自該基片且分別穿過該散熱片= 、罪於該散熱片的頂面。 連接9Η,ψ ®第8項所述之散熱裝置 遷接片係分別向内傾斜—角度使呈内縮狀。 10、如ΐ請專利範圍第δ項所述之 兩連接片係分別向外傾斜一角度使呈外擴狀、裝置’其中 其^導如^請專利範圍第8、9或10項所述之散熱農置 月二兩、有一結合結構，該結合結構包括四^ 係平行設於其連接另兩^ ::熱：，係具有至少兩個貫穿其頂面及底面的插槽； 該兩連, 該基片/ 其申該li 13 片亦平行设於另一連接片 外傾斜-角度，使該些扣片位置，且該些扣片皆向 底面。 、頁k可彈性頂於該散熱片的 12、—種散熱襞置，包括： 一散熱片，係具有至少—I 至少一導熱部，係具有一其貝面及底面的插槽； 係延伸自該美片'、且办巧兮j 土片及一連接片，該連接片 該軸f散熱片的插槽，該基“貼靠於 導熱:::/4:=第二項所述之散熱裝置，”該 二=行設於該連接片上，且並向外傾斜一角度中使 該二扣片的頂端可雜頂於該散熱片的底面。 14如申明專利範圍第8或12項所述 包括有至少-個風扇，該散熱片上具㈣數個散 些風扇係結合於該散熱片上，且其所產生的氣流可流經該 些散熱孔吹。1330517 . ;. ----------j} (A half) -- Ten, the scope of the patent: 丨 · · '月修(8)正余乂«------ 1, - species The memory module includes: a plurality of memories each having at least one heat source; and/or a heat dissipating device comprising a heat sink and a plurality of heat conducting portions, the heat sinking system having a plurality of The top and bottom slots, each of the heat conducting portions has a substrate and two connecting pieces, the two connecting pieces extending from the substrate, and the teeth of the blade are connected to the corresponding slots of the heat sink A heat source of the memory that abuts against the top surface of the heat sink. 2. The memory module of claim 2, wherein the three tabs are respectively inclined at an angle to be inwardly folded for clamping in the note 3, for example, the scope of the patent application. The memory module of the present invention, wherein the phases are respectively inclined outwardly by an angle to be expanded outwardly for the memory of the two phases of arsenic. 4. The memory module as described in claim 2 or 3 of the patent application, the film: the parts have a combined structure, and the combined structure comprises two: two pieces of the buckle are arranged in parallel to one of the connections. On the chip, the other pieces are the corresponding positions of the m connecting pieces, and the bottom faces of the heat-insulating sheets. a top of the buckle can be elastically attached to the three-dimensional memory module, including: a number of memory, each memory has a heat source of each other; and ...., device The utility model comprises a heat sink and a forging heat conducting portion, wherein the heat dissipating 12 丄 / has a slot penetrating the top surface and the bottom surface thereof, and each of the heat conducting portions is connected to the sheet, and the connecting sheet extends from the substrate and wears The chip slot is connected to the heat source of the corresponding memory, and the base moon is attached to the top surface of the heat sink. Each of the memory modules described in the fifth aspect of the patent track is characterized in that the mother-heat conducting portion has a bonding knot respectively::: a piece of flat piece, the two pieces are flat rods, „recognition, by I The structure includes two buckles so that the i h'm ° is further connected to the sheet and is inclined outwardly by a corner. The top end of the buckle can be elastically placed on the bottom surface of the heat sink. The memory module according to the first or fifth aspect, wherein the at least one fan has a fan system coupled to the heat dissipation hole of the heat dissipation hole, and the heat dissipation hole of the device 4 is blown toward the memory. The milk flow can pass through the eight, a heat dissipating device, comprising: at least a heat conducting portion having a substrate and two connecting pieces extending from the substrate and passing through the heat sink respectively, sinning the top of the heat sink The connection of the heat sinks of the 散热 ψ 第 第 第 第 第 第 迁 迁 迁 迁 迁 迁 迁 迁 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 An external angle of inclination causes the device to be expanded, and the device is as described in paragraphs 8, 9 or 10 of the patent scope. The thermal farmer has a combined structure, and the combined structure comprises four parallel lines arranged in parallel with the other two: :: heat: having at least two slots running through the top and bottom surfaces thereof; The substrate/the substrate of the li 13 is also disposed in parallel with the tilt-angle of the other connecting piece, so that the buckles are positioned, and the buckles are all directed to the bottom surface. The page k can be elastically attached to the heat sink. 12. A heat dissipating device comprising: a heat sink having at least one of at least one heat conducting portion, having a slot having a top surface and a bottom surface; extending from the piece of the film; a piece and a connecting piece, the connecting piece of the shaft f of the heat sink, the base "abuts against the heat conduction:::/4:= the heat sink of the second item," the second = line is set in the connection The top surface of the two fastening pieces may be misaligned with the bottom surface of the heat dissipating fins. The invention includes at least one fan as described in claim 8 or 12, and the heat dissipating plate has (4) A plurality of loose fans are coupled to the heat sink, and the generated airflow can flow through the heat dissipation holes.