US11456285B2 - Semiconductor device and method of manufacturing semiconductor device - Google Patents
Semiconductor device and method of manufacturing semiconductor device Download PDFInfo
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- US11456285B2 US11456285B2 US16/909,975 US202016909975A US11456285B2 US 11456285 B2 US11456285 B2 US 11456285B2 US 202016909975 A US202016909975 A US 202016909975A US 11456285 B2 US11456285 B2 US 11456285B2
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the embodiments discussed herein relate to a semiconductor device and a method of manufacturing a semiconductor device.
- semiconductor devices include semiconductor elements and a control integrated circuit that realizes driving control and the like of the semiconductor elements.
- the semiconductor elements referred to here may be IGBT (Insulated Gate Bipolar Transistors) and power MOSFETs (Metal Oxide Semiconductor Field Effect Transistors).
- This type of semiconductor device includes a substrate on which the semiconductor elements are mounted and a case that houses the substrate, and is sealed using sealing resin. Main terminals that are electrically connected to the main electrodes of the semiconductor elements and control terminals that are electrically connected to the control integrated circuit are insert molded into the case.
- the control integrated circuit is provided in the region of the case where the control terminals are disposed.
- a molding step of integrally molding the main terminals and control terminals on the case and a bonding step that bonds the substrate to this type of case are needed.
- a further step of electrically connecting circuit patterns provided on the semiconductor elements and the main terminals integrally molded to the case using bonding wires is also needed. In this way, when manufacturing a semiconductor device, many manufacturing steps and members are needed, which raises the manufacturing cost. There is also demand for improvements to the electrical and thermal characteristics.
- a semiconductor device including: a substrate including an insulating layer and a plurality of circuit patterns formed on the insulating layer, the substrate having a principal surface on which an element region is set; a plurality of semiconductor elements provided on the plurality of circuit patterns in the element region; a plurality of main terminals that each have a first end joined to one of the plurality of circuit patterns in the element region and a second end extending out of the substrate from a first side of the substrate; a plurality of control terminals disposed in a control region that is adjacent to a second side of the substrate opposite the first side; and a sealing member that seals the principal surface and the control region.
- FIGS. 1A and 1B are views depicting an external appearance of a semiconductor device according to the present embodiments
- FIG. 2 is a side sectional view of the semiconductor device according to the present embodiments.
- FIG. 3 is a plan sectional view of the semiconductor device according to the present embodiments.
- FIG. 4 is a flowchart depicting a method of manufacturing a semiconductor device according to the present embodiments.
- FIG. 5 is a diagram useful in explaining a step of joining external connection terminals, which is included in the method of manufacturing a semiconductor device according to the present embodiments;
- FIG. 6 is a diagram useful in explaining a step of joining hanger terminals, which is included in the method of manufacturing a semiconductor device according to the present embodiments;
- FIG. 7 is a diagram useful in explaining a step of joining semiconductor elements and electronic components and a step of connecting with bonding wires in the method of manufacturing a semiconductor device according to the present embodiments.
- FIG. 8 is a diagram useful in explaining a step of sealing in the method of manufacturing a semiconductor device according to the present embodiments.
- the expressions “front surface” and “upper surface” refer to the surface of the semiconductor device 10 that faces upward in FIG. 2 .
- the expression “up” refers to the upward direction for the semiconductor device 10 in FIG. 2 .
- the expressions “rear surface” and “lower surface” refer to the surface of the semiconductor device 10 that faces downward in FIG. 2 .
- the expression “down” refers to the downward direction for the semiconductor device 10 in FIG. 2 .
- front surface “upper surface”, “up”, “rear surface”, “lower surface”, “down”, and “side surface” are merely convenient expressions used to specify relative positional relationships, and are not intended to limit the technical scope of the present embodiments.
- “up” and “down” do not necessarily mean directions that are perpendicular to the ground. That is, the “up” and “down” directions are not limited to the direction of gravity.
- FIGS. 1A and 1B depict the external appearance of a semiconductor device according to the present embodiments.
- FIG. 1A is a side view of a semiconductor device 10 (as viewed from above or below in FIG. 1B ), and FIG. 1B is a plan view of the semiconductor device 10 .
- FIG. 2 is a side sectional view of the semiconductor device according to the present embodiments and FIG. 3 is a plan sectional view of the semiconductor device according to the present embodiments.
- FIG. 2 is a cross-sectional view taken along a dot-dash line X-X in FIG. 3
- FIG. 3 is a cross-sectional view taken along a dot-dash line X-X in FIG. 2 .
- FIG. 3 corresponds to the plan view in FIG. 1B .
- the entire structure of the semiconductor device 10 is sealed by a sealing member 60 to form a three-dimensional shape.
- the sealing member 60 of the semiconductor device 10 may be cubic but have rounded corners.
- a plurality of control terminals 30 and a plurality of main terminals 40 extend out from the respective side surfaces along the long edges of the sealing member 60 . Note that in the present embodiments, when not distinguishing between individual terminals, the control terminals and the main terminals are collectively described as the “control terminals 30 ” and the “main terminals 40 ”.
- the semiconductor device 10 includes six pairs of a first semiconductor element 21 a and a second semiconductor element 21 b , a metal base substrate 22 , control terminals 30 (including control terminals 31 to 33 ), main terminals 40 (including main terminals 41 a to 41 d ), and electronic components 50 .
- the control terminals 30 , the electronic components 50 , the first semiconductor elements 21 a , the second semiconductor element 21 b , and the main terminals 40 are electrically connected by appropriate bonding wires 26 . Note that the bonding wires connected to the electronic components 50 have been omitted from FIG. 3 .
- the bonding wires 26 are made of a metal, such as aluminum or copper, with superior electrical conductivity, or an alloy including at least one of these metals.
- the diameter of the bonding wires 26 is preferably at least 100 ⁇ m but not greater than 1 mm.
- the first semiconductor elements 21 a include switching elements, such as IGBT or power MOSFETs.
- a first semiconductor element 21 a is an IGBT
- the collector electrode is provided on the rear surface as a main electrode
- a gate electrode and an emitter electrode as a main electrode are provided on the front surface.
- a first semiconductor element 21 a is a power MOSFET
- a drain electrode as a main electrode is provided on the rear surface
- a gate electrode and a source electrode as a main electrode are provided on the front surface.
- the rear surface of each first semiconductor element 21 a described above is joined by solder (not illustrated) to circuit patterns 24 a , 24 b , 24 c , and 24 d of the metal base substrate 22 .
- the second semiconductor elements 21 b include diodes such as SBD (Schottky Barrier Diodes) and FWD (FreeWheeling Diodes). These second semiconductor elements 21 b each have an output electrode (cathode electrode) as a main electrode on the rear surface and an input electrode (anode electrode) as a main electrode on the front surface.
- the rear surface of each second semiconductor element 21 b described above is joined by solder (not illustrated) to the circuit patterns 24 a , 24 b , 24 c , and 24 d .
- FIG. 3 merely depicts an example case where six pairs of the first semiconductor element 21 a and the second semiconductor element 21 b are provided. The number of pairs is not limited to six, and a number of pairs in keeping with the specification of the semiconductor device 10 or the like may be provided.
- the metal base substrate 22 includes an insulating layer 23 , the circuit patterns 24 a , 24 b , 24 c , and 24 d and fixing patterns 24 e , 24 f , and 24 g formed on the insulating layer 23 , and a heat dissipating plate 25 formed on the rear surface of the insulating layer 23 .
- the insulating layer 23 is made of any of: epoxy resin; epoxy resin mixed with inorganic filler; polyimide; and polytetrafluoroethylene. Note that the thickness of the insulating layer 23 is preferably at least 0.09 mm but not greater than 0.15 mm.
- the circuit patterns 24 a , 24 b , 24 c , and 24 d and the fixing patterns 24 e , 24 f , and 24 g are made of a metal with superior electrical conductivity, such as copper or a copper alloy. Note that the shapes of the circuit patterns 24 a , 24 b , 24 c , and 24 d and the fixing patterns 24 e , 24 f , and 24 g in FIGS. 2 and 3 are mere examples.
- circuit patterns 24 a , 24 b , 24 c , and 24 d and the fixing patterns 24 e , 24 f , and 24 g are produced by etching a conductive plate or foil formed on one surface of the insulating layer 23 , or by sticking a conductive plate to one surface of the insulating layer 23 .
- the thickness of the circuit patterns 24 a , 24 b , 24 c , and 24 d and the fixing patterns 24 e , 24 f , and 24 g is preferably at least 0.10 mm but not greater than 1.00 mm, and more preferably at least 0.20 mm and not greater than 0.50 mm.
- the circuit patterns 24 a , 24 b , 24 c , and 24 d are formed in an element region 22 a on the principal surface of the metal base substrate 22 , as depicted in FIGS. 2 and 3 .
- the first semiconductor elements 21 a and the second semiconductor elements 21 b are joined by solder (not illustrated) to the circuit patterns 24 a , 24 b , 24 c , and 24 d .
- the shapes, disposed positions, and numbers of the circuit patterns 24 a , 24 b , 24 c , and 24 d , and the disposed positions of the first semiconductor elements 21 a and the second semiconductor elements 21 b are mere examples, are not limited to FIGS. 2 and 3 , and are set as appropriate according to the design, specification, and the like.
- the fixing patterns 24 e , 24 f , and 24 g are not electrically connected to other components.
- the shape and number of the fixing patterns 24 e , 24 f , and 24 g are not limited to the examples depicted in FIGS. 2 and 3 , and are set as appropriate according to the design, specification, and the like.
- the heat dissipating plate 25 is made of aluminum, iron, silver, or copper, which have superior thermal conductivity, or an alloy including at least one of these metals.
- a material such as nickel may also be formed on the surface of the heat dissipating plate by plating or the like.
- a nickel-phosphorus alloy, a nickel-boron alloy, or the like may be used.
- a radiator (not illustrated) may be attached to the rear side of the heat dissipating plate 25 via solder, silver solder, or the like to improve the dissipation of heat.
- the radiator used here is made of aluminum, iron, silver, or copper, which have superior thermal conductivity, or an alloy including at least one of these metals.
- a cooling device including a fin or a heat sink with a plurality of fins and a cooling device that uses water cooling or the like may also be used as the radiator.
- the heat dissipating plate may be integrally formed with this type of radiator.
- the heat dissipating plate is made of aluminum, iron, silver, or copper that have superior thermal conductivity, or an alloy including at least one of these materials.
- a material such as nickel may be formed by plating or the like on the surface of the heat dissipating plate that is integrated with the cooler.
- a nickel-phosphorus alloy, a nickel-boron alloy, or the like may be used. Note that the thickness of the heat dissipating plate 25 is preferably at least 0.1 mm but not greater than 2.0 mm.
- Each of the plurality of main terminals 40 has one end provided on the right side in FIG. 3 of the metal base substrate 22 , and another end that extends out from a side surface (or “first side surface”) on the right side of the semiconductor device 10 in FIG. 3 .
- the main terminals 41 b , 41 a , 41 c , and 41 d out of the plurality of main terminals 40 are respectively joined to the circuit patterns 24 a , 24 b , 24 c , and 24 d of the metal base substrate 22 .
- the main terminal 41 a includes a joining portion 41 a 1 , a linking portion 41 a 2 , and a terminal portion 41 a 3 .
- the joining portion 41 a 1 is parallel to the front surface of the metal base substrate 22 and is joined to the circuit pattern 24 b .
- the linking portion 41 a 2 is inclined and integrally connects the joining portion 41 a 1 and the terminal portion 41 a 3 .
- the terminal portion 41 a 3 is separated from the front surface of the metal base substrate 22 in keeping with the inclination of the linking portion 41 a 2 , and extends from the metal base substrate 22 to the outside in parallel with the front surface.
- the main terminals 41 b , 41 c , and 41 d have the same configuration as the main terminal 41 a.
- the hanger terminals 42 , 43 , and 44 each have one end respectively joined to the fixing patterns 24 e , 24 f , and 24 g described above, with the other end facing outward from the metal base substrate 22 .
- the other end of the hanger terminal 42 is exposed from the side surface (or “third side surface”) of the semiconductor device 10 at the top in FIG. 3
- the other end of the hanger terminal 43 is exposed from the side surface (or “fourth side surface”) of the semiconductor device 10 at the bottom in FIG. 3
- the other end of the hanger terminal 44 is exposed from the side surface (or “first side surface”) of the semiconductor device 10 on the right in FIG. 3 .
- the hanger terminals 42 , 43 , and 44 As described later, the parts of the hanger terminals 42 , 43 , and 44 that extend from the semiconductor device 10 are removed, so that the other ends of the hanger terminals 42 , 43 , and 44 do not protrude from the side surfaces of the semiconductor device 10 .
- the hanger terminals 42 and 43 include joining portions 42 al and 43 a 1 , linking portions 42 a 2 and 43 a 2 , and hanger portions 42 a 3 and 43 a 3 .
- the hanger terminal 44 has the same configuration as the hanger terminals 42 and 43 .
- the plurality of control terminals 30 (including the control terminals 31 , 32 , and 33 ) are provided in a control region 30 a that is adjacent to the other side of the metal base substrate 22 that is opposite the first side of the metal base substrate 22 to which the plurality of main terminals 40 are joined.
- the control region 30 a is located at a higher position than the front surface of the metal base substrate 22 .
- the control terminals 30 extend outward from the side surface (or “second side surface”) of the semiconductor device 10 on the left in FIG. 3 .
- the plurality of control terminals 30 further include a control wiring portion 34 .
- the control wiring portion 34 is disposed in the control region 30 a , with the electronic components 50 being mounted via solder (not illustrated).
- the control wiring portion 34 is positioned at the same height as the parts of the control terminals 30 that extend to the outside from the side surface.
- the control wiring portion 34 is positioned higher than the parts of the main terminals 40 that are joined to the circuit patterns 24 a , 24 b , 24 c , and 24 d and the parts of the hanger terminals 42 , 43 , and 44 that are joined to the fixing patterns 24 e , 24 f , and 24 g .
- the control terminals 30 , the terminal portion 41 a 3 of the main terminals 41 a , 41 b , 41 c and 41 d (the terminal portions of the main terminals 41 b , 41 c and 41 d are not depicted), and the hanger portions 42 a 3 and 43 a 3 of the hanger terminals 42 , 43 and 44 (the hanger portion of the hanger terminal 44 is not depicted) are positioned at the same height.
- the plurality of main terminals 40 , the hanger terminals 42 , 43 , and 44 , and the control terminals 30 are made of a metal that has superior electrical conductivity, such as copper or a copper alloy. In addition, these terminals may be coated with a metal, such as nickel or nickel alloy.
- a suitable number of electronic components 50 are joined to the control wiring portion 34 via solder (not illustrated).
- control ICs, thermistors, capacitors, resistors, and the like are used as appropriate to provide the semiconductor device 10 with the desired functions.
- the sealing member 60 seals the configuration described above.
- This sealing member 60 includes a thermosetting resin, such as maleimide-modified epoxy resin, maleimide-modified phenol resin, or maleimide resin, and a filler contained in the thermosetting resin.
- a specific example is epoxy resin, which includes a filler such as silicon oxide, aluminum oxide, boron nitride, or aluminum nitride.
- FIG. 4 is a flowchart depicting a method of manufacturing a semiconductor device according to the present embodiments.
- FIG. 5 is a diagram useful in explaining a step of joining external connection terminals, which is included in the method of manufacturing a semiconductor device according to the present embodiments.
- FIG. 6 is a diagram useful in explaining a step of joining hanger terminals, which is included in the method of manufacturing a semiconductor device according to the present embodiments. Note that FIGS. 5 and 6 are cross-sectional views corresponding to positions of a dot-dash line X-X and a dot-dash line Y-Y in FIG. 3 .
- FIG. 5 and 6 are cross-sectional views corresponding to positions of a dot-dash line X-X and a dot-dash line Y-Y in FIG. 3 .
- FIG. 5 and 6 are cross-sectional views corresponding to positions of a dot-dash line X-X and a dot-dash line Y-Y in FIG.
- FIG. 7 is a diagram useful in explaining a step of joining semiconductor elements and electronic components and a step of connecting with bonding wires in the method of manufacturing a semiconductor device according to the present embodiments
- FIG. 8 is a diagram useful in explaining a step of sealing in the method of manufacturing a semiconductor device according to the present embodiments. Note that FIGS. 7 and 8 are cross-sectional views corresponding to the position of the dot-dash line X-X in FIG. 3 .
- the components of the semiconductor device 10 such as the first semiconductor elements 21 a , the second semiconductor elements 21 b , the metal base substrate 22 , a lead frame (not illustrated) where the plurality of control terminals 30 , the plurality of main terminals 40 , and the hanger terminals 42 , 43 , and 44 are aligned by tie bars, the electronic components 50 , and the raw materials of the sealing member 60 are prepared (Step S 1 ).
- the lead frame described above is set on the metal base substrate 22 (Step S 2 ).
- the control wiring portion 34 of the control terminals 30 (the control terminals 31 , 32 , and 33 are depicted in FIG.
- the joining portion 41 a 1 of the main terminal 41 a (the main terminals 41 b , 41 c , and 41 d are the same) included in the lead frame (the joining portions of the main terminals 41 b , 41 c , and 41 d are omitted from the drawing) is positioned on the circuit pattern 24 b (or the circuit patterns 24 a , 24 c , and 24 d for the other terminals) of the metal base substrate 22 .
- a predetermined jig or the like (not illustrated) is used so that the control terminals 30 and the control wiring portion 34 are kept in the control region 30 a that is at a higher position than the principal surface of the metal base substrate 22 .
- the joining portion 41 a 1 of the main terminal 41 a included in the lead frame set on the circuit pattern 24 b of the metal base substrate 22 is joined by ultrasonic bonding (in the direction of the dashed arrow) to the circuit pattern 24 b .
- the main terminals 41 b , 41 c , 41 d included in the lead frame set on the circuit patterns 24 a , 24 c , and 24 d of the metal base substrate 22 are joined in the same way by ultrasonic bonding.
- FIG. 5 the joining portion 41 a 1 of the main terminal 41 a included in the lead frame set on the circuit pattern 24 b of the metal base substrate 22 is joined by ultrasonic bonding (in the direction of the dashed arrow) to the circuit pattern 24 b .
- the main terminals 41 b , 41 c , 41 d included in the lead frame set on the circuit patterns 24 a , 24 c , and 24 d of the metal base substrate 22 are joined in the same way by ultrasonic bonding.
- the joining portions 42 a 1 and 43 a 1 of the hanger terminals 42 and 43 included in the lead frame set on the fixing patterns 24 e and 24 f of the metal base substrate 22 are joined (in the direction of the dashed arrow) by ultrasonic bonding.
- the hanger terminal 44 included in the lead frame set on the fixing pattern 24 g of the metal base substrate 22 is similarly joined by ultrasonic bonding (Step S 3 ). By doing so, three out of the four edges of the metal base substrate 22 become suspended by the main terminals 41 a , 41 b , 41 c , and 41 d and the hanger terminals 42 , 43 , and 44 . As a result, the metal base substrate 22 is kept horizontal in the following manufacturing steps.
- the thickness of the circuit patterns 24 a , 24 b , 24 c , and 24 d and the fixing patterns 24 e , 24 f , and 24 g is preferably at least 0.10 mm but not greater than 1.00 mm, and more preferably, at least 0.20 mm but not greater than 0.50 mm. This value is at least 10 times or so thicker than the thickness of the insulating layer 23 .
- a first semiconductor element 21 a and a second semiconductor element 21 b are both joined to the circuit pattern 24 b via solder.
- other first semiconductor elements 21 a and second semiconductor elements 21 b are joined to the circuit patterns 24 a , 24 c , and 24 d via solder.
- the electronic components 50 are also joined to the control wiring portion 34 via solder (Step S 4 ).
- the control terminals 30 , the electronic components 50 , the first semiconductor elements 21 a , the second semiconductor elements 21 b , and the main terminals 40 are electrically connected as appropriate by the bonding wires 26 (Step S 5 ).
- the assembly depicted in FIG. 7 is placed between an upper die 81 and a lower die 82 of a molding die 80 .
- the metal base substrate 22 , and the plurality of control terminals 30 , the plurality of main terminals 40 , and the hanger terminals 42 , 43 , and 44 of the lead frame become housed in a cavity 84 formed by the upper die 81 and the lower die 82 .
- the raw material of the sealing member 60 is then injected from a flow path 83 of the lower die 82 so as to fill the inside of the cavity 84 .
- the metal base substrate 22 and the plurality of control terminals 30 , the plurality of main terminals 40 , and the hanger terminals 42 , 43 , and 44 of the lead frame are sealed by the sealing member 60 .
- the metal base substrate 22 is sealed in a state where the metal base substrate 22 is kept horizontal by the main terminals 41 a , 41 b , 41 c , and 41 d and the hanger terminals 42 , 43 , and 44 .
- the upper die 81 and the lower die 82 are separated and the semiconductor device 10 is taken out.
- Step S 6 the semiconductor device 10 depicted in FIGS. 1A to 3 is obtained.
- the semiconductor device 10 described above includes the first and second semiconductor elements 21 a and 21 b , and the metal base substrate 22 , which includes the insulating layer 23 and the circuit patterns 24 a , 24 b , 24 c , and 24 d formed on the insulating layer 23 and which has the first and second semiconductor elements 21 a and 21 b mounted on the circuit patterns 24 a , 24 b , 24 c , and 24 d in the element region 22 a set on the principal surface.
- the semiconductor device 10 is also provided with the main terminals 41 b , 41 a , 41 c , and 41 d , respective first ends of which are joined to the circuit patterns 24 a , 24 b , 24 c , and 24 d in the element region 22 a and respective second ends of which extend outside the metal base substrate 22 from one side of the metal base substrate 22 .
- control terminals 30 which include a control wiring portion 34 disposed in the control region 30 a located adjacent to the other side that is opposite the first side where the main terminals 41 b , 41 a , 41 c , and 41 d of the metal base substrate 22 are joined, and the sealing member 60 that seals the principal surface of the metal base substrate 22 and the control region 30 a.
- the main terminals 41 b , 41 a , 41 c , and 41 d are directly joined to the circuit patterns 24 a , 24 b , 24 c , and 24 d where the first and second semiconductor elements 21 a and 21 b are disposed.
- the metal base substrate 22 is used in the semiconductor device 10 , it is possible for heat produced in the first semiconductor elements 21 a and the second semiconductor elements 21 b to be efficiently dissipated from the heat dissipating plate 25 , which suppresses increases in temperature.
- the control region 30 a where the control wiring portion 34 of the control terminals 30 is disposed is located at a higher position than the element region 22 a of the metal base substrate 22 .
- the semiconductor device 10 does not use a case that is integrally molded with the control terminals 30 , the main terminals 41 b , 41 a , 41 c , and 41 d , and the like. This means that a step of molding this type of case and a step of bonding the metal base substrate 22 to the case are unnecessary. Accordingly, it is possible to simplify the manufacturing process of the semiconductor device 10 and to reduce the manufacturing cost.
Abstract
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