JP4005953B2 - 熱伝導スペーサ - Google Patents

熱伝導スペーサ Download PDF

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Publication number
JP4005953B2
JP4005953B2 JP2003298623A JP2003298623A JP4005953B2 JP 4005953 B2 JP4005953 B2 JP 4005953B2 JP 2003298623 A JP2003298623 A JP 2003298623A JP 2003298623 A JP2003298623 A JP 2003298623A JP 4005953 B2 JP4005953 B2 JP 4005953B2
Authority
JP
Japan
Prior art keywords
heat
sheet
heat sink
support sheet
generating electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003298623A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004040127A (ja
JP2004040127A5 (enExample
Inventor
晃生 山口
康雄 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Priority to JP2003298623A priority Critical patent/JP4005953B2/ja
Publication of JP2004040127A publication Critical patent/JP2004040127A/ja
Publication of JP2004040127A5 publication Critical patent/JP2004040127A5/ja
Application granted granted Critical
Publication of JP4005953B2 publication Critical patent/JP4005953B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003298623A 1997-07-09 2003-08-22 熱伝導スペーサ Expired - Fee Related JP4005953B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003298623A JP4005953B2 (ja) 1997-07-09 2003-08-22 熱伝導スペーサ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18385197 1997-07-09
JP2003298623A JP4005953B2 (ja) 1997-07-09 2003-08-22 熱伝導スペーサ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP28055297A Division JP3479206B2 (ja) 1997-07-09 1997-10-14 熱伝導スペーサ

Publications (3)

Publication Number Publication Date
JP2004040127A JP2004040127A (ja) 2004-02-05
JP2004040127A5 JP2004040127A5 (enExample) 2005-05-26
JP4005953B2 true JP4005953B2 (ja) 2007-11-14

Family

ID=31719097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003298623A Expired - Fee Related JP4005953B2 (ja) 1997-07-09 2003-08-22 熱伝導スペーサ

Country Status (1)

Country Link
JP (1) JP4005953B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816036B2 (ja) * 2005-12-01 2011-11-16 株式会社Ｉｈｉ インバータ装置
JP2009076657A (ja) * 2007-09-20 2009-04-09 Nitto Shinko Kk 熱伝導シート
JP5463203B2 (ja) * 2010-05-24 2014-04-09 日立オートモティブシステムズ株式会社 電子制御装置
JP2012200071A (ja) * 2011-03-22 2012-10-18 Yaskawa Electric Corp モータ制御装置
JP5901233B2 (ja) * 2011-11-07 2016-04-06 三菱電機株式会社 電子部品の冷却構造
US9509023B2 (en) 2011-12-09 2016-11-29 Honda Motor Co., Ltd. Structure for securing battery
JP2015079560A (ja) * 2015-01-07 2015-04-23 株式会社バッファロー ネットワーク接続ストレージ
EP3327767B1 (en) 2015-07-24 2020-04-29 Nec Corporation Mount structure, method of manufacturing mount structure, and wireless device
JP6194997B2 (ja) * 2016-09-06 2017-09-13 株式会社バッファロー ネットワーク接続ストレージ

Also Published As

Publication number Publication date
JP2004040127A (ja) 2004-02-05

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