JP3998993B2 - ウェブに実装されたｉｃチップへのアンテナパターン形成方法と印刷回路形成方法、およびｉｃタグ付き包装体 - Google Patents

ウェブに実装されたｉｃチップへのアンテナパターン形成方法と印刷回路形成方法、およびｉｃタグ付き包装体 Download PDF

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JP3998993B2
JP3998993B2 JP2002036190A JP2002036190A JP3998993B2 JP 3998993 B2 JP3998993 B2 JP 3998993B2 JP 2002036190 A JP2002036190 A JP 2002036190A JP 2002036190 A JP2002036190 A JP 2002036190A JP 3998993 B2 JP3998993 B2 JP 3998993B2
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chip
web material
antenna pattern
tag
concave hole
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JP2003242472A5 (enExample
JP2003242472A (ja
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和幸 高澤
茂 中野
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Dai Nippon Printing Co Ltd
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Dai Nippon Printing Co Ltd
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JP2002036190A 2002-02-14 2002-02-14 ウェブに実装されたｉｃチップへのアンテナパターン形成方法と印刷回路形成方法、およびｉｃタグ付き包装体 Expired - Fee Related JP3998993B2 (ja)

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JP2002036190A JP3998993B2 (ja) 2002-02-14 2002-02-14 ウェブに実装されたｉｃチップへのアンテナパターン形成方法と印刷回路形成方法、およびｉｃタグ付き包装体

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JP2002036190A JP3998993B2 (ja) 2002-02-14 2002-02-14 ウェブに実装されたｉｃチップへのアンテナパターン形成方法と印刷回路形成方法、およびｉｃタグ付き包装体

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JP2003242472A5 JP2003242472A5 (enExample) 2005-08-25
JP3998993B2 true JP3998993B2 (ja) 2007-10-31

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160072183A1 (en) * 2014-09-09 2016-03-10 Max Echo Technology Corporation Method of Making a Double-Sided Flexible Printed Circuit Type Antenna Device

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006511969A (ja) * 2002-12-18 2006-04-06 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 液体の小滴でのマイクロメートル寸法の電子物体の操作
JP2005097345A (ja) * 2003-09-22 2005-04-14 Konica Minolta Medical & Graphic Inc インクジェットインクおよびこれを用い作製した非接触通信機能を有するｉｃ基体
JP2005157661A (ja) * 2003-11-25 2005-06-16 Brother Ind Ltd 無線タグ作成装置及びカートリッジ
JP4593195B2 (ja) * 2004-01-30 2010-12-08 トッパン・フォームズ株式会社 スレッドの製造方法及びｉｃチップ入りシートの製造方法
JP4588381B2 (ja) * 2004-06-18 2010-12-01 トッパン・フォームズ株式会社 シート基材及びその製造方法
JP2006031336A (ja) 2004-07-15 2006-02-02 Fujitsu Ltd Ｒｆｉｄタグの製造方法
JP4750492B2 (ja) * 2005-07-20 2011-08-17 富士通株式会社 Ｉｃチップ実装方法
JP4616719B2 (ja) 2005-07-20 2011-01-19 富士通株式会社 Ｉｃチップ実装方法
JP4484834B2 (ja) * 2006-03-13 2010-06-16 トッパン・フォームズ株式会社 粘着テープ印刷装置
JP2008134694A (ja) 2006-11-27 2008-06-12 Philtech Inc Ｒｆパウダーの付加方法およびｒｆパウダー付加基体シート
JP2008134695A (ja) 2006-11-27 2008-06-12 Philtech Inc 基体データ管理システム
JP2008135446A (ja) 2006-11-27 2008-06-12 Philtech Inc Ｒｆパウダーの製造方法
JP2008134815A (ja) * 2006-11-28 2008-06-12 Philtech Inc Ｒｆパウダーの提供方法およびｒｆパウダー含有液
JP2008134816A (ja) 2006-11-28 2008-06-12 Philtech Inc Ｒｆパウダー粒子、ｒｆパウダー、およびｒｆパウダーの励起方法
JP2008135951A (ja) 2006-11-28 2008-06-12 Philtech Inc Ｒｆパウダー粒子、ｒｆパウダー、およびｒｆパウダー含有基体
JP2008161837A (ja) 2006-12-28 2008-07-17 Ricoh Co Ltd 搬送システム
WO2008081699A1 (ja) 2006-12-28 2008-07-10 Philtech Inc. 基体シート
WO2013160454A2 (en) * 2012-04-27 2013-10-31 Dsm Ip Assets B.V. Electrically conductive polyamide substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160072183A1 (en) * 2014-09-09 2016-03-10 Max Echo Technology Corporation Method of Making a Double-Sided Flexible Printed Circuit Type Antenna Device

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