JP3983278B2 - 露光方法および露光装置 - Google Patents

露光方法および露光装置 Download PDF

Info

Publication number
JP3983278B2
JP3983278B2 JP2007502722A JP2007502722A JP3983278B2 JP 3983278 B2 JP3983278 B2 JP 3983278B2 JP 2007502722 A JP2007502722 A JP 2007502722A JP 2007502722 A JP2007502722 A JP 2007502722A JP 3983278 B2 JP3983278 B2 JP 3983278B2
Authority
JP
Japan
Prior art keywords
substrate
photomask
support member
convex shape
concave shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2007502722A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2006137396A1 (ja
Inventor
博信 橋本
俊博 高木
健 三宅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Sanei Giken Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Sanei Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd, Sanei Giken Co Ltd filed Critical Shinko Electric Industries Co Ltd
Application granted granted Critical
Publication of JP3983278B2 publication Critical patent/JP3983278B2/ja
Publication of JPWO2006137396A1 publication Critical patent/JPWO2006137396A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2007502722A 2005-06-21 2006-06-20 露光方法および露光装置 Active JP3983278B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2005180085 2005-06-21
JP2005180085 2005-06-21
JP2006031178 2006-02-08
JP2006031178 2006-02-08
PCT/JP2006/312319 WO2006137396A1 (ja) 2005-06-21 2006-06-20 露光方法および露光装置

Publications (2)

Publication Number Publication Date
JP3983278B2 true JP3983278B2 (ja) 2007-09-26
JPWO2006137396A1 JPWO2006137396A1 (ja) 2009-01-22

Family

ID=37570425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007502722A Active JP3983278B2 (ja) 2005-06-21 2006-06-20 露光方法および露光装置

Country Status (5)

Country Link
JP (1) JP3983278B2 (zh)
KR (1) KR101435123B1 (zh)
CN (1) CN101194210B (zh)
TW (1) TW200707137A (zh)
WO (1) WO2006137396A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013035854A1 (ja) * 2011-09-09 2013-03-14 Ｎｓｋテクノロジー株式会社 密着露光装置及び密着露光方法
JP2016081503A (ja) * 2014-10-14 2016-05-16 鴻海精密工業股▲ふん▼有限公司 曲面タッチ装置及びその製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008139643A1 (ja) * 2007-05-10 2008-11-20 Sanei Giken Co., Ltd. 露光方法および露光装置
JP6399093B2 (ja) * 2014-08-01 2018-10-03 株式会社村田製作所 直描型露光装置
JP6663252B2 (ja) * 2016-03-01 2020-03-11 株式会社アドテックエンジニアリング プリント基板用露光装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211231A (ja) * 1985-06-25 1987-01-20 Hitachi Electronics Eng Co Ltd ウエハとマスクとの密着方法
JPH11194507A (ja) * 1998-01-05 1999-07-21 Adtec Engineeng:Kk 露光装置
JPH11312635A (ja) * 1998-04-28 1999-11-09 Ushio Inc コンタクト露光方法
JP2000315638A (ja) * 1999-04-28 2000-11-14 Teosu Kk アライメント方法とその装置
JP2002091010A (ja) * 2000-09-13 2002-03-27 Dainippon Printing Co Ltd 密着露光装置
JP2002367895A (ja) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd フォトレジストの露光方法および装置並びに基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013035854A1 (ja) * 2011-09-09 2013-03-14 Ｎｓｋテクノロジー株式会社 密着露光装置及び密着露光方法
JP2013070042A (ja) * 2011-09-09 2013-04-18 Nsk Technology Co Ltd 密着露光装置及び密着露光方法
JP2016081503A (ja) * 2014-10-14 2016-05-16 鴻海精密工業股▲ふん▼有限公司 曲面タッチ装置及びその製造方法

Also Published As

Publication number Publication date
KR20080023350A (ko) 2008-03-13
CN101194210A (zh) 2008-06-04
KR101435123B1 (ko) 2014-08-27
JPWO2006137396A1 (ja) 2009-01-22
WO2006137396A1 (ja) 2006-12-28
CN101194210B (zh) 2010-06-16
TW200707137A (en) 2007-02-16

Similar Documents

Publication Publication Date Title
JP4917835B2 (ja) 基板チャック平坦度維持手段を備える露光装置
JP2010080630A (ja) 押印装置および物品の製造方法
WO2015100775A1 (zh) 一种液晶显示器的玻璃基板的曝光方法
TWI225212B (en) Distortion measurement method and exposure apparatus
JP2010080631A (ja) 押印装置および物品の製造方法
JP3983278B2 (ja) 露光方法および露光装置
JP6555868B2 (ja) パターン形成方法、および物品の製造方法
JP4744954B2 (ja) 基板製造方法および露光装置
TW419720B (en) The method of monitoring the overlay accuracy of the stepper and the device using the same
JP2022078075A (ja) 露光システムアライメントおよび較正方法
JP2005148531A (ja) 基板伸縮に対応したプリント配線基板用露光装置
TWI454860B (zh) 影像對位裝置
WO2006129652A1 (ja) 液晶パネルの製造方法
KR101319634B1 (ko) 포토마스크용 기판, 포토마스크, 포토마스크의 제조 방법 및 패턴 전사 방법
JP5053929B2 (ja) 分割露光方法および分割露光装置
JP3345178B2 (ja) 露光における位置合わせ装置
JP2007311374A (ja) 基板ホルダ、露光装置及びデバイスの製造方法
JP4401834B2 (ja) 露光装置及び位置合わせ方法
KR101805953B1 (ko) 포토마스크용 기판 세트, 포토마스크 세트 및 패턴 전사 방법
JPH1152545A (ja) レチクルおよびそれによって転写されたパターンならびにレチクルと半導体ウエハとの位置合わせ方法
JP2006047881A (ja) 露光装置および積層基板の製造方法
TW201250377A (en) Photomask substrate, photomask, and pattern transfer method
JP4591919B2 (ja) 液晶パネル用対向基板の製造方法
KR102333943B1 (ko) 노광장치, 스테이지 교정 시스템, 및 스테이지 교정방법
JP2020190638A (ja) パターン形成方法

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070604

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070703

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100713

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 3983278

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110713

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110713

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120713

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120713

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130713

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250