TW200707137A - Exposing method and device - Google Patents

Exposing method and device

Info

Publication number
TW200707137A
TW200707137A TW095122309A TW95122309A TW200707137A TW 200707137 A TW200707137 A TW 200707137A TW 095122309 A TW095122309 A TW 095122309A TW 95122309 A TW95122309 A TW 95122309A TW 200707137 A TW200707137 A TW 200707137A
Authority
TW
Taiwan
Prior art keywords
substrate
photomask
transferring
state
exposing method
Prior art date
Application number
TW095122309A
Other languages
Chinese (zh)
Inventor
Hironobu Hashimoto
Toshihiro Takagi
Ken Miyake
Original Assignee
Sanei Giken Co Ltd
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co Ltd, Shinko Electric Ind Co filed Critical Sanei Giken Co Ltd
Publication of TW200707137A publication Critical patent/TW200707137A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces

Abstract

An exposing method and an exposing device for transferring a pattern written on a photomask to a substrate. The photomask is arranged at a position covering a substrate. The photomask and the substrate touch each other uniformly to create a state of being deformed concavely or convexly to each other. Under that state, a photosensitive layer on the substrate is irradiated with light through the photomask, thus transferring a pattern having substantially changed dimensions onto the substrate.
TW095122309A 2005-06-21 2006-06-21 Exposing method and device TW200707137A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005180085 2005-06-21
JP2006031178 2006-02-08

Publications (1)

Publication Number Publication Date
TW200707137A true TW200707137A (en) 2007-02-16

Family

ID=37570425

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122309A TW200707137A (en) 2005-06-21 2006-06-21 Exposing method and device

Country Status (5)

Country Link
JP (1) JP3983278B2 (en)
KR (1) KR101435123B1 (en)
CN (1) CN101194210B (en)
TW (1) TW200707137A (en)
WO (1) WO2006137396A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694540B (en) * 2016-03-01 2020-05-21 日商牛尾電機股份有限公司 Exposure device for printed circuit board

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101663619B (en) * 2007-05-10 2012-03-07 三荣技研股份有限公司 Exposure method and exposure apparatus
JP6142450B2 (en) * 2011-09-09 2017-06-07 株式会社ブイ・テクノロジー Contact exposure apparatus and contact exposure method
CN106575086B (en) * 2014-08-01 2018-05-18 株式会社村田制作所 Direct write type exposure device
TW201614446A (en) * 2014-10-14 2016-04-16 Hon Hai Prec Ind Co Ltd Curved surface touch device and manufacturing method for curved surface touch device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211231A (en) * 1985-06-25 1987-01-20 Hitachi Electronics Eng Co Ltd Bonding method for wafer and mask
JPH11194507A (en) * 1998-01-05 1999-07-21 Adtec Engineeng:Kk Exposure system
JPH11312635A (en) * 1998-04-28 1999-11-09 Ushio Inc Contact exposure method
JP2000315638A (en) * 1999-04-28 2000-11-14 Teosu Kk Alignment method and device thereof
JP2002091010A (en) * 2000-09-13 2002-03-27 Dainippon Printing Co Ltd Contact aligner
JP2002367895A (en) * 2001-06-11 2002-12-20 Fuji Photo Film Co Ltd Method and apparatus for exposing photoresist as well as substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694540B (en) * 2016-03-01 2020-05-21 日商牛尾電機股份有限公司 Exposure device for printed circuit board

Also Published As

Publication number Publication date
CN101194210A (en) 2008-06-04
WO2006137396A1 (en) 2006-12-28
CN101194210B (en) 2010-06-16
KR101435123B1 (en) 2014-08-27
KR20080023350A (en) 2008-03-13
JP3983278B2 (en) 2007-09-26
JPWO2006137396A1 (en) 2009-01-22

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