KR20080023350A - Exposing method and device - Google Patents

Abstract

An exposing method and an exposing device for transferring a pattern written on a photomask to a substrate. The photomask is arranged at a position covering a substrate. The photomask and the substrate touch each other uniformly to create a state of being deformed concavely or convexly to each other. Under that state, a photosensitive layer on the substrate is irradiated with light through the photomask, thus transferring a pattern having substantially changed dimensions onto the substrate. ® KIPO & WIPO 2008

Description

Exposure method and exposure device {EXPOSING METHOD AND DEVICE}

The present invention relates to an exposure method and an exposure apparatus for transferring a pattern onto a substrate by arranging a photo mask on which a pattern is drawn and a substrate on which a photosensitive layer is formed, and irradiating light to the substrate through the photo mask. More specifically, the present invention relates to a method of aligning a photomask and a substrate.

Conventionally, in order to shape a conductive pattern or the like on a surface of a printed circuit board, a pattern is formed by overlapping a substrate having a photosensitive layer formed thereon with a photomask on which a pattern is drawn, and irradiating light onto the substrate through the photomask. Exposure methods for transferring to the photosensitive layer on the substrate surface have been widely used.

In this exposure method, in order to transfer the pattern drawn on the photomask to the substrate, it is necessary to align the plurality of conductive holes formed in advance on almost the entire surface of the substrate with the position of the pattern drawn on the photomask. For the alignment, a plurality of alignment marks are attached to positions of the photomask and the substrate, respectively.

The alignment mark attached to each of the photo mask and the substrate is read by an optical sensor such as a CCD camera. Based on the read data, either the substrate or the photo mask is moved in the X.Y.θ direction to align the position of the photomask and the substrate.

After aligning the positions of the photomask and the substrate, light is irradiated onto the substrate through the photomask, the pattern drawn on the photomask is transferred to the photosensitive layer on the surface of the substrate, and the exposure treatment is completed.

By the way, since a board | substrate undergoes heat processing etc. until an exposure process, it has a size shrink | contracted from the beginning in an exposure process.

Generally, the board | substrate is designed by taking into account the shrinkage resulting from said heat processing etc. from the beginning. However, not all substrates shrink as expected. As a result, the distance between the plurality of alignment marks attached to the substrate, that is, the size of the pitch between the alignment marks varies for each substrate.

Moreover, in both a photomask and a board | substrate, a fluctuation | variation arises in the magnitude | size of the pitch of a alignment mark according to manufacture error, a change of temperature, and humidity.

For this reason, an error occurs in the pitch between the plurality of alignment marks attached to each of the photomask and the substrate.

As a result, it becomes difficult to completely align both the alignment mark of the photomask and the alignment mark of the substrate.

Therefore, in aligning the substrate and the photomask, the "position displacement (shift) amount" between the alignment marks in each pair of the plurality of pairs of alignment marks attached to the positions corresponding to the photomask and the substrate is averaged. It was made. That is, the size error of the pitch between the alignment marks was distributed on average from the center of the substrate toward the outer circumferential direction.

Hereinafter, with reference to the drawings, the alignment method between the photomask and the substrate will be described. 1 and 2 are plan views illustrating a state in which a photomask and a substrate overlap with each other. The alignment marks 3 (circles) of the substrate 1 and the alignment marks 4 (dots) of the photo mask 2 are positioned on four corners of the substrate 1 and on the photo masks corresponding to these corners, respectively. Is placed on. 1 shows an ideal position alignment state. In FIG. 1, there is no difference in scale (scale) between the substrate 1 and the photomask 2, and therefore, the pitch between the marks of the alignment marks 3 on all the substrates 1 and the photomask 2. There is no error in the pitch between the marks of the alignment marks 4, which shows an ideal alignment state in which the centers of the corresponding marks coincide with each other.

In addition, even if there is no error in the pitch between the marks for the alignment marks 3 of all the substrates 1 and the alignment marks 4 of the photomask 2, in practice, a control system for alignment Due to the drive mechanism and the like, a positional alignment error occurs. However, such an error can be suppressed within the allowable range as compared with the positional alignment error due to the scale difference of the pitch between the alignment marks with the progress of the technology.

FIG. 2 shows the substrate 1 and the photomask when the pitch between the marks of the alignment marks 3 of the substrate 1 is shorter than the pitch between the marks of the alignment marks 4 of the photomask 2. 2) A plan view showing the alignment of the liver. In the substrate 1 and the photo mask 2, the " position displacement amount " between the alignment mark pairs 3 and 4 corresponding to each other is aligned so as to be equal in each pair.

In this way, if there is a difference in the pitch length between the alignment marks between the substrate 1 and the photo mask 2, even if the alignment error caused by the above-described control system or the like is suppressed within the allowable range, the photo mask 2 It is difficult to accurately transfer the pattern 5 drawn on the predetermined position of the substrate 1.

In the conventional board | substrate, even if the alignment error resulting from such a scale difference arises, since the required precision was low, it did not become a problem. However, as miniaturization of semiconductors and fine patterning of substrates progress, the error becomes a problem.

Therefore, it was desired to transfer the pattern 5 drawn on the photomask 2 to a predetermined position with high precision with the scale difference between the substrate 1 and the photomask 2 as small as possible.

In order to accurately transfer the pattern drawn on the photo mask to a predetermined position on the substrate, the main mark is to adjust the scale of the pitch between the marks of the alignment marks attached to the photo masks. Photomasks that have been changed to fit the scale have been created and coped.

Of course, if the scale of the pitch between the marks of the alignment mark attached to the photo mask is changed, the scale of the pattern drawn at the same time as the alignment mark is also changed proportionally, and as a result, if the pitch difference between the alignment mask of the photo mask and the substrate becomes smaller, The pattern of the photomask can be transferred to a predetermined position of the substrate with higher accuracy.

However, even if a photo mask in which the pitch of the mark of the alignment mark attached to the photo mask is changed and made to cope with it is used, the scale of the substrate also changes due to the above-described reasons. It was necessary to prepare a plurality of photo masks having different scales and replace the photo mask so that the alignment accuracy between the photo mask and the substrate falls within the allowable range.

In the conventional exposure method described above, even if acceptable transfer accuracy is maintained, there are many problems such as an increase in cost due to the production of a plurality of photo masks and a decrease in production amount due to an increase in the replacement time of the photo masks.

The present invention is to solve such a conventional problem. An object of the present invention is to provide a photomask and a substrate that can be aligned with a higher precision than in the prior art, and provide a high-exposure exposure method and exposure apparatus at low cost.

According to the invention,

A photomask having a pattern is disposed on a surface of the substrate on which the photosensitive layer is formed, and the photomask and the substrate are brought into uniform contact with each other, and then the photomask is applied to the photosensitive layer of the substrate through the photomask. An exposure method for transferring the pattern to the substrate by irradiating light,

By irradiating light to the photosensitive layer through the photomask while the photomask and the substrate are in uniform contact with each other and the photomask and the substrate are deformed into a concave or convex shape with respect to each other, An exposure method is provided which transfers the pattern having a substantially changed size to the substrate.

In one aspect of the exposure method, the photomask and the substrate are brought into uniform contact with each other, and then either one of the photomask and the substrate is deformed into a concave or convex shape with respect to the other side, and accordingly, the other side is also The pattern having a substantially changed size may be transferred to the substrate by deforming to a convex shape or a concave shape along the one side and irradiating light to the photosensitive layer through the photo mask in that state.

In another aspect of the exposure method, after either one of the photomask and the substrate is deformed into a concave shape or convex shape with respect to the other side, the photomask and the substrate are brought into uniform contact with each other. The pattern may be transferred to the substrate by changing the convex shape or the concave shape along one side, and irradiating light to the photosensitive layer through the photo mask in such a state.

By making the clearance space between the photomask and the substrate more depressurized than other regions, the photomask and the substrate can be brought into uniform contact with each other.

When the alignment marks are provided at positions corresponding to each other of the photo mask and the substrate, the alignment marks are detected by mark detection means, and based on the detected data, the alignment of the photo mask and the substrate is performed. The amount of positional displacement between the marks can be calculated, and the amount of deformation for deforming the photomask and the substrate into a concave or convex shape can be controlled according to the calculation result.

As one form of deformation, the substrate may be deformed into a concave or convex shape with respect to the photomask.

The substrate is supported on the main surface of the plate-shaped substrate support member, and the substrate support member is placed on the substrate support with the outer periphery held on the frame-shaped base member, and the substrate support is the substrate. In the case of having a deformation mechanism for deforming the support member, the substrate can be deformed into a concave or convex shape with respect to the photomask side by operating the deformation mechanism to deform the substrate support member.

The deformation mechanism may cause the substrate to deform into a concave or convex shape with respect to the photo mask side by pushing or pulling the central region of the substrate support member with respect to the photo mask side.

When the alignment marks are provided at positions corresponding to each other of the photo mask and the substrate, the alignment marks are detected by mark detection means, and based on the detected data, the alignment of the photo mask and the substrate is performed. The displacement amount between the marks can be calculated, and the deformation amount of the substrate by the deformation mechanism can be controlled according to the calculation result.

In the exposure method of this invention, the board | substrate and photomask from which thickness differs can be used.

According to the invention,

A photomask having a pattern is disposed on a surface of the substrate having a photosensitive layer formed thereon, the photomask and the substrate are brought into uniform contact with each other, and then the photosensitive layer of the substrate is formed through the photomask. An exposure apparatus used in an exposure method for transferring the pattern onto the substrate by irradiating light to the substrate,

A contact mechanism for uniformly contacting the photomask and the substrate with each other;

A deformation mechanism for deforming the photomask and the substrate into a concave shape or a convex shape with respect to each;

The photomask and the substrate are in uniform contact with each other by the contact mechanism and the deformation mechanism, and the photomask and the substrate are deformed into a concave shape or a convex shape with respect to each of the photomask and the substrate. It is provided with a light irradiation device for irradiating light to the photosensitive layer,

An exposure apparatus is also provided which is configured to transfer the pattern having a substantially changed size to the substrate.

In one aspect of the exposure apparatus, after the contact mechanism makes the photomask and the substrate contact each other uniformly,

By the deformation mechanism, either one of the photomask or the substrate is deformed into a concave shape or convex shape with respect to the other side, and thus the other side is also deformed into a convex shape or concave shape along the one side,

In this state, the light irradiation device may irradiate light to the photosensitive layer through the photomask, thereby transferring the pattern having a substantially changed size to the substrate.

As another aspect of the exposure apparatus, after deforming one side of the photomask and the substrate into a concave or convex shape with respect to the other side by the deformation mechanism,

By the contact mechanism, the photomask and the substrate are brought into uniform contact with each other, whereby the other side is deformed into a convex or concave shape along the one side,

In this state, the light irradiation device may irradiate light to the photosensitive layer through the photomask, thereby transferring the pattern having a substantially changed size to the substrate.

The contact mechanism may include a pressure reducing mechanism that makes the gap space between the photomask and the substrate to be reduced in pressure than other regions.

When the alignment marks are provided at positions corresponding to each other of the photo mask and the substrate, the alignment marks are detected by mark detection means, and based on the detected data, the alignment of the photo mask and the substrate is performed. The amount of positional displacement between the marks can be calculated, and the amount of deformation for deforming the photomask and the substrate into a concave or convex shape can be controlled according to the calculation result.

The said deformation | transformation mechanism can be made into the mechanism which deform | transforms the said board | substrate into concave shape or convex shape with respect to the said photo mask.

A plate-shaped substrate supporting member for supporting the substrate on the main surface, the plate-shaped substrate supporting member holding an outer periphery on a frame-shaped base member;

A substrate support for supporting a substrate support member deformation mechanism for deforming the substrate support member into a concave shape or a convex shape with respect to the photomask side;

By operating the substrate support member deforming mechanism, the substrate may be deformed into a concave or convex shape with respect to the photomask.

The substrate support member deforming mechanism may include a screw and a motor.

Alternatively, the substrate support member deforming mechanism may be a mechanism driven by air pressure.

The substrate support member deforming mechanism may be a mechanism for pushing or pulling the central region of the substrate support member with respect to the photomask side.

When the alignment marks are provided at positions corresponding to each other of the photo mask and the substrate, the alignment marks are detected by mark detection means, and based on the detected data, the alignment of the photo mask and the substrate is performed. The displacement amount between the marks can be calculated, and the deformation amount of the substrate by the deformation mechanism can be controlled according to the calculation result.

The mark detection means can be a CCD camera.

In addition, the substrate and the photomask having different thicknesses may be used.

1 shows an ideal alignment state of the substrate and the photomask, in which the substrate and the photomask are prepared on the same scale, and there is no error in the pitch between the marks in both alignment marks. It is a top view which shows.

FIG. 2 is a plan view showing the alignment state between the substrate and the photo mask when the pitch between marks of the alignment mark of the substrate is shorter than the pitch between marks of the alignment mark of the photomask.

3 is a first cross-sectional view of a substrate and a photo mask superimposed on each other for explaining the principle of the present invention.

4 is a second cross-sectional view of the substrate and the photo mask superimposed on each other for explaining the principle of the present invention.

5 is a third cross-sectional view of the substrate and the photo mask superimposed on each other for explaining the principle of the present invention.

6 is a schematic side view showing an exposure apparatus based on one embodiment of the present invention.

FIG. 7 is a diagram of a first state for explaining an exposure method using an exposure apparatus based on one embodiment of the present invention. FIG.

8 is a diagram of a second state for explaining an exposure method using an exposure apparatus based on one embodiment of the present invention.

9 is a schematic side view showing an exposure apparatus based on another embodiment of the present invention.

3 shows a state where the substrate 1 and the photomask 2 of the same length L are in contact with each other in a planar shape and overlapped with each other. A pattern is drawn on one side main surface 2A of the photomask 2. The thickness T2 of the glass photomask 2 used normally is about 5 mm, and when the board | substrate 1 is a printed circuit board, the thickness T1 is 1 mm or less in many cases. In addition, the centerline 2C of the thickness T2 of the photomask 2 is shown by the dashed-dotted line.

FIG. 4 shows a state where the substrate 1 and the photo mask 2 are in uniform contact with each other and overlapped with each other. The substrate 1 side of the photo mask 2 is concave, and the photo mask 2 and the photo mask 2 are concave. The state in which the substrate 1 is bent together is shown. As shown, since the thickness T2 of the photomask 2 is relatively thick, the photomask 2 in the bent state has the centerline 2C of the thickness T2 as the boundary line, so that the substrate 1 side It is contracted and the other side is extended. On the other hand, since the thickness T1 of the board | substrate 1 is considerably thin compared with the thickness T2 of the photomask 2, the difference in expansion and contraction of the front surface and the back surface side is small. In addition, you may use what made the film mask which the pattern was drawn contacted to the glass plate as the photomask 2.

As can be seen from FIG. 4, the length of the photomask 2 in contact with the substrate 1 is reduced by the value indicated by S1 relative to the length of the substrate 1. That is, the length of the pattern (refer to the pattern 5 of FIG. 1) drawn on the main surface 2A of the photomask 2 in contact with the substrate 1 is also reduced in proportion to the value.

In addition, FIG. 5 has shown the state in which the photomask 2 and the board | substrate 1 were bent contrary to FIG. The length of the photomask 2 in contact with the substrate 1 is extended by the value indicated by S2 with respect to the length of the substrate 1.

As described above, when the photomask 2 and the substrate 1 are in uniform contact with each other and overlapped and bent, the scale of the pattern drawn on the photomask 2 is relatively changed with respect to the scale of the substrate 1. Able to know.

The present invention is intended to transfer the pattern drawn on the photomask to a predetermined position of the substrate with high accuracy by exposing the pattern drawn on the photomask 2 in a state in which the scale of the pattern drawn on the photomask 2 is changed to match the scale of the substrate. will be.

Next, the exposure method and exposure apparatus in one Embodiment of this invention are demonstrated, referring FIGS. FIG. 6 is a view showing an exposure apparatus 100 according to one embodiment of the present invention, showing a state where the photomask 2 and the substrate 1 are arranged in a planar shape so as to face each other with a gap therebetween. . In this state, the alignment marks 3, 4 (see FIGS. 1 and 2) attached to the substrate 1 and the photo mask 2 are read by the CCD camera 11 serving as mark detection means, and the data thereof. Based on the above, any one of the substrate 1 and the photomask 2 is moved in the X.Y.θ direction to align the positions of the substrate 1 and the photomask 2.

When the scale of the pitch between the marks of the alignment marks 3 and 4 attached to the substrate 1 and the photo mask 2 is different, the alignment is made to equalize the displacement amount between the corresponding alignment marks of each pair. At the same time, data on the scale difference between the substrate 1 and the photo mask 2 is obtained.

Next, with reference to FIG. 6, the support structure and the mechanism of the board | substrate 1 and the photomask 2 are demonstrated. First, the board | substrate 1 is sucked by the suction hole 9 provided in the board | substrate support member 15 in the upper surface (main surface) of the plate-shaped board | substrate support member 15. As shown in FIG. The suction hole 9 is connected to a negative pressure source (not shown).

As shown, the plate-shaped substrate support member 15 is held around the frame-shaped base member 6 and placed on the substrate support 7 via the frame-shaped base member 6. The substrate support member 7 is supported by a substrate support member deforming mechanism 8 for deforming the central region of the plate-shaped substrate support member 15 into a concave or convex shape with respect to the photomask 2 side. In addition, the frame base member 6, the substrate support 7, the substrate support member deformation mechanism 8, and the substrate support member 15 constitute the substrate support structure 100A.

The screw 8a and the motor 8b are used for the board | substrate support member deformation | transformation mechanism 8 as an example. By rotating the screw 8a around the shaft using the motor 8b, the plate-shaped substrate support member 15 can be deformed into a concave shape or a convex shape with respect to the photomask 2 side. In addition, in this embodiment, although the case where the male screw was rotated was shown, you may rotate the female screw which meshes with the said male screw. In addition, as another structure of the board | substrate support member deformation | transformation mechanism 8, it is also possible to employ the cylinder mechanism 8A driven by air pressure as shown in FIG. Moreover, as long as it is a mechanism which can deform the plate-shaped board | substrate support member 15 to concave shape and convex shape with respect to the photomask 2 side, it is also possible to employ | adopt another well-known mechanism.

Next, in FIG. 7, the board | substrate 1 and the plate-shaped board | substrate supporting member 15 which support the board | substrate 1 are convex with respect to the photomask 2 by the board | substrate support member deformation | transformation mechanism 8. Next, as shown in FIG. The bent state is shown. The degree to which the substrate 1 and the plate-shaped substrate supporting member 15 supporting the substrate 1 are bent in a convex shape, that is, the amount of deformation is determined by the substrate 1 and the photo mask 2 described in FIG. 6. The data relating to the scale difference is determined by a value calculated by inputting a predetermined calculation formula so that the scales of the substrate 1 and the photo mask 2 coincide with each other as much as possible. That is, the deformation amount of the substrate 1 is controlled and determined by controlling the movement amount of the plate-shaped substrate support member 15 by the substrate support member deformation mechanism 8 in accordance with the calculation result. As described above, the substrate support member deforming mechanism 8 refers to a deforming mechanism for deforming the substrate 1 in a broad sense.

FIG. 8 shows an exposure step in a state where the substrate 1 shown in FIG. 7 and the plate-shaped substrate supporting member 15 supporting the substrate 1 are bent in a convex shape. By means of a suitable contact mechanism (not shown), the photomask 2 is pressed firmly so as to make uniform contact over the entire surface of the substrate 1. Then, the photomask 2 is also bent in the same shape as the substrate 1 along the substrate 1. As a result, the surface of the side on which the photosensitive layer of the substrate 1 is formed and the scale of the pattern 5 on the photomask 2 coincide with each other based on the principle shown in FIGS. When irradiated to the board | substrate 1 through the photomask 2 by the light irradiation apparatus (not shown), the pattern drawn on the photomask 2 is faithfully transferred to the board | substrate 1 with high precision.

In addition, the alignment of the substrate 1 and the photo mask 2 in a state where the photo mask 2 and the substrate 1 shown in FIG. 6 overlap with a gap in a planar shape is not necessarily necessary. In a state where the illustrated substrate 1 is bent in a convex shape, the positions of the photomask 2 and the substrate 1 may be aligned.

Further, an annular seal member (not shown) in contact with the opposing surface of the photo mask 2 is provided on the substrate support member 15 or on the substrate support member 15 so as to surround the substrate 1 and the substrate 1 and the photo mask. The clearance space between (2), more specifically, the closed space formed by the annular seal member, the substrate support member 15, and the photo mask 2 is made to be in a reduced pressure state than the outside area of the substrate 1. You may make the photomask 2 contact uniformly over the whole surface. In this case, a pressure reducing mechanism including a negative pressure source (not shown) in communication with the gap space serves as a contact mechanism for bringing the photomask 2 and the substrate 1 into uniform contact with each other.

As a contact mechanism of another aspect, a mechanism for moving the frame 10 supporting the circumference of the photomask 2 up and down may be employed.

In addition, in the structure of the apparatus shown in FIGS. 6-9, the board | substrate support member deformation | transformation mechanism which deform | transforms the board | substrate support member 15 into concave shape or convex shape is provided in the center area | region of the board | substrate support member 15 only. Although the case is shown, the position and the number are not limited.

In addition, in this embodiment, the pattern drawn on the photomask 2 is faithful to the board | substrate 1 in the state which contacted the board | substrate 1 and the photomask 2 uniformly, and deform | transformed into concave shape or convex shape. Although it is supposed to transfer, the specific shape of the concave shape or the convex shape is preferably a spherical surface or a shape close to the spherical surface.

That is, when the mechanism for deforming is provided in the center position of the board | substrate 1, and the board | substrate support member 15, the board | substrate 1, and the photo mask 2 are deformed to spherical shape, it will be outward from the center position of the board | substrate 1 This is because the scale can be changed uniformly in the direction.

In addition, the board | substrate support member 15 which becomes a base which deform | transforms the board | substrate 1 and the photomask 2 into spherical shape is plate-shaped in embodiment of FIGS. It is shown in a supported state. However, as a more effective support method for deforming the substrate support member 15 into a spherical shape, the upper or circumference of the continuous region constituting the circumference centering on the center position of the substrate 1 provided with the deforming mechanism is provided. It is preferable to support the substrate support member 15 to the frame-shaped base member 6 at a plurality of positions near the circumference or at an upper portion of the plurality of regions arranged at intervals from each other.

In addition, in order to deform | transform the board | substrate support member 15 into spherical shape favorable, you may make it the rigidity of the board | substrate support member 15 vary with parts. The stiffness variation may be achieved by changing the thickness.

In the said embodiment, although the exposure process in the state which bent the board | substrate 1 and the plate-shaped board | substrate supporting member 15 which supports the board | substrate 1 in the convex shape is shown, the board-shaped board | substrate which supports the board | substrate 1 is shown. The same applies to the exposure process in a state where the support member 15 is bent in a concave shape. 6 to 8 show the case where the substrate 1 and the photo mask 2 are arranged almost horizontally, the arrangement of the apparatus for arranging the substrate 1 and the photo mask 2 to be substantially vertical. Even with this, the same effect can be obtained.

In addition to the method of bending the substrate 1 in a concave or convex shape, and then bending the photo mask 2 to conform to the shape of the substrate 1 while making the photo mask 2 uniformly contact with the substrate, the photo mask 2 is reversed. The method and device therefor for bending the concave shape or the convex shape and then bending the substrate 1 to conform to the shape of the photomask 2 while making the substrate 1 uniformly contact the substrate are also embodiments of the present invention.

Further, a method and an apparatus therefor for bringing the substrate 1 and the photo mask 2 into uniform contact with each other and then bending both of them together in a concave or convex shape are also embodiments of the present invention.

As mentioned above, the said embodiment disclosed this time is only an illustration in all the points, and is not a basis of a limited interpretation. Therefore, the technical scope of this invention is not interpreted only by said embodiment, but is defined by description of a claim. In addition, all changes within the meaning and range equivalent to the claims are included in the present invention.

According to the exposure method and the exposure apparatus of the present invention, even if the substrate and the photomask have a change in size due to the heat treatment or the like received until the exposure process, the pattern drawn on the photomask can be transferred to the substrate with high accuracy. .

Claims (23)

A photomask having a pattern is disposed on a surface of the substrate on which the photosensitive layer is formed, and the photomask and the substrate are brought into uniform contact with each other, and then the photomask is applied to the photosensitive layer of the substrate through the photomask. An exposure method for transferring the pattern to the substrate by irradiating light, By irradiating light to the photosensitive layer through the photomask while the photomask and the substrate are in uniform contact with each other and the photomask and the substrate are deformed into a concave or convex shape with respect to each other, And transferring the pattern having a substantially changed size to the substrate. The method of claim 1, After uniformly contacting the photomask and the substrate, one side of the photomask and the substrate is deformed into a concave shape or convex shape with respect to the other side, and thus the other side is also convex or concave along the one side. And deforming into a shape, and irradiating light to the photosensitive layer through the photo mask in such a state, thereby transferring the pattern having a substantially changed size to the substrate. The method of claim 1, After deforming one side of the photomask and the substrate into a concave shape or convex shape with respect to the other side, the photomask and the substrate are brought into uniform contact with each other, so that the other side is also convex or concave along the one side. And deforming into a shape, and irradiating light to the photosensitive layer through the photo mask in such a state, thereby transferring the pattern having a substantially changed size to the substrate. The method of claim 2 or 3, And making the space between the photomask and the substrate more depressurized than other regions so that the photomask and the substrate are in uniform contact with each other. The method according to any one of claims 1 to 4, Position alignment marks are provided at positions corresponding to each other of the photo mask and the substrate, and the position alignment marks are detected by mark detection means, and based on the detected data, the position alignment marks of the photo mask and the substrate. An amount of position displacement of the liver and an amount of deformation for deforming the photomask and the substrate into a concave or convex shape in accordance with the calculation result. The method according to any one of claims 1 to 5, And deforming the substrate into a concave or convex shape with respect to the photomask. The method of claim 6, The substrate is supported on the main surface of the plate-shaped substrate support member, and the substrate support member is placed on the substrate support with its outer circumference held by the frame base member, and the substrate support is the substrate support. And a deformation mechanism for deforming the member, wherein the substrate is deformed into a concave shape or a convex shape with respect to the photomask side by operating the deformation mechanism to deform the substrate support member. The method of claim 7, wherein And the deformation mechanism deforms the substrate into a concave or convex shape with respect to the photo mask side by pushing or pulling the central region of the substrate support member with respect to the photo mask side. The method according to any one of claims 6 to 8, Position alignment marks are provided at positions corresponding to each other of the photo mask and the substrate, and the position alignment marks are detected by mark detection means, and based on the detected data, the position alignment marks of the photo mask and the substrate. And an amount of displacement of the liver and calculating the amount of deformation of the substrate by the deformation mechanism in accordance with the calculation result. The method according to any one of claims 1 to 9, An exposure method characterized by using a substrate and a photo mask having different thicknesses. A photomask having a pattern is disposed on a surface of the substrate having a photosensitive layer formed thereon, the photomask and the substrate are brought into uniform contact with each other, and then the photosensitive layer of the substrate is formed through the photomask. An exposure apparatus used in an exposure method for transferring the pattern onto the substrate by irradiating light to the substrate, A contact mechanism for uniformly contacting the photomask and the substrate with each other; A deformation mechanism for deforming the photomask and the substrate into a concave shape or a convex shape with respect to each; The photomask and the substrate are in uniform contact with each other by the contact mechanism and the deformation mechanism, and the photomask and the substrate are deformed into a concave shape or a convex shape with respect to each of the photomask and the substrate. It is provided with a light irradiation device for irradiating light to the photosensitive layer, And the pattern having the size substantially changed to be transferred onto the substrate. The method of claim 11, After contacting the photomask and the substrate uniformly by the contact mechanism, By the deformation mechanism, either one of the photomask or the substrate is deformed into a concave shape or convex shape with respect to the other side, and thus the other side is also deformed into a convex shape or concave shape along the one side, In such a state, the exposure apparatus is configured to irradiate light to the photosensitive layer through the photo mask by the light irradiation apparatus, thereby transferring the pattern having a substantially changed size to the substrate. . The method of claim 11, After deforming one side of the photomask and the substrate by the deformation mechanism into a concave or convex shape with respect to the other side, By the contact mechanism, the photomask and the substrate are brought into uniform contact with each other, whereby the other side is deformed into a convex or concave shape along the one side, In such a state, the exposure apparatus is configured to irradiate light to the photosensitive layer through the photo mask by the light irradiation apparatus, thereby transferring the pattern having a substantially changed size to the substrate. . The method according to any one of claims 11 to 13, And the contact mechanism includes a pressure reduction mechanism that makes the gap space between the photo mask and the substrate to be reduced in pressure than other regions. The method according to any one of claims 11 to 14, Position alignment marks are provided at positions corresponding to each other of the photo mask and the substrate, and the position alignment marks are detected by mark detection means, and based on the detected data, the position alignment marks of the photo mask and the substrate. And a displacement amount for calculating the positional displacement amount of the liver and deforming the photomask and the substrate into a concave shape or a convex shape in accordance with the calculation result. The method according to any one of claims 11 to 15, And the deformation mechanism is a mechanism that deforms the substrate into a concave or convex shape with respect to the photomask. The method of claim 16, A plate-shaped substrate supporting member for supporting the substrate on the main surface, the plate-shaped substrate supporting member holding an outer periphery on a frame-shaped base member; A substrate support for supporting a substrate support member deformation mechanism for deforming the substrate support member into a concave shape or a convex shape with respect to the photomask side; And deforming the substrate into a concave or convex shape with respect to the photo mask by operating the substrate support member deforming mechanism. The method of claim 17, And said substrate support member deforming mechanism comprises a screw and a motor. The method of claim 17, And the substrate support member deforming mechanism is a mechanism driven by air pressure. The method according to any one of claims 17 to 19, And the substrate support member deforming mechanism is a mechanism for pushing or pulling the central region of the substrate support member with respect to the photomask side. The method according to any one of claims 16 to 20, Position alignment marks are provided at positions corresponding to each other of the photo mask and the substrate, and the position alignment marks are detected by mark detection means, and based on the detected data, the position alignment marks of the photo mask and the substrate. And an amount of displacement of the liver and calculating the amount of deformation of the substrate by the deformation mechanism in accordance with the calculation result. The method according to any one of claims 15 to 21, And said mark detecting means is a CCD camera. The method according to any one of claims 11 to 22, And the thickness of the substrate and the photomask is different.

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