KR102333943B1 - Exposure apparatus, stage calibration system, and stage calibration method - Google Patents

Abstract

The driving precision of the stage is corrected by using a reference plate smaller than the stage driving area.
An exposure apparatus comprising a calibration unit for generating movement precision calibration information of a moving stage by using a reference plate, wherein the first calibration information is created using a reference plate loaded in a first measurement area of the moving stage, and the first measurement and a calibration unit for creating second calibration information using a reference plate mounted on at least one second measurement area having an overlapping area with the area.

Description

Exposure apparatus, stage calibration system, and stage calibration method {EXPOSURE APPARATUS, STAGE CALIBRATION SYSTEM, AND STAGE CALIBRATION METHOD}

The present invention relates to an exposure apparatus, a stage calibration system, and a stage calibration method, and more particularly, to an exposure apparatus for creating calibration information of a movable stage using a reference plate and correcting the driving precision of the movable stage, a stage calibration system; It relates to a stage calibration method and a calibration jig used for calibration.

In the conventional lithography process for manufacturing semiconductor package substrates and the like, a reduction projection exposure apparatus of a step-and-repeat method, a projection exposure apparatus of a step-and-scan method, and the like are mainly used.

In such an exposure apparatus, high precision is required for positioning, ie, overlapping, of a circuit pattern already formed on a substrate and a circuit pattern overlapped and exposed thereon.

Conventional exposure apparatuses have achieved high-precision superposition by measuring the position of a substrate stage holding a substrate to be exposed using a laser interferometer. change cannot be ignored.

Therefore, the position measurement of the wafer stage is performed using an encoder that is less affected by air fluctuations than an interferometer, and a plurality of marks while positioning the substrate stage using a reference wafer to which a plurality of marks in an existing positional relationship are assigned. An exposure apparatus has been developed that detects , and creates calibration information for correcting the driving precision of the substrate stage from the detected positioning position and target position (for example, Patent Document 1).

Although the conventional semiconductor package substrate uses a wafer, use of a spherical board|substrate larger than a wafer is attempted in recent years. More specifically, conventionally, a package technology that individualizes after formation of a redistribution, an insulating film, and a post on a semiconductor wafer called a so-called FAN-IN WLP has been used. A package technology for reconfiguring on top of and forming a redistribution, an insulating film, and a post is used.

As the size of the substrate increases, the substrate stage of the exposure apparatus is enlarged, and the substrate stage driving area during exposure is also increasing. Therefore, there is a demand for an enlargement of the reference plate used for the calibration of the substrate stage (a plate to which a plurality of marks are provided in the same positional relationship as that of the reference wafer). The same applies to the reticle stage, and since the reticle stage is enlarged in accordance with the enlargement or reduction of the exposure area and higher magnification of the projection optical system, an enlargement of the reference plate for calibration is required.

Japanese Patent Laid-Open No. 2009-164306

Although a photolithography process is used when forming a plurality of marks on a reference plate, a large plate-shaped member tends to be distorted under the influence of thermal expansion or the like. In addition, since the photolithography equipment also uses a large stage, the positional error of the mark depicted on the reference plate is likely to increase. Therefore, the large reference plate is more likely to cause an error in the arrangement of the reference marks compared to the small reference plate.

Therefore, it is preferable to correct the driving precision of the entire driving region of the moving stage by using a reference plate smaller than the driving region of the moving stage (stage) to be calibrated.

The exposure apparatus of the present invention is an exposure apparatus comprising a calibration unit for generating calibration information of movement precision (driving accuracy) of a movable stage using a reference plate, using the reference plate placed in the first measurement area of the movable stage. and a calibration unit that creates first calibration information and creates second calibration information using a reference plate mounted on at least one second measurement area having an overlapping area with the first measurement area. Preferably, it has a plurality of second measurement areas in which a mounting surface (a surface on which a reference plate, a substrate, a reticle, etc. are mounted) of the moving stage is divided (eg, divided into quadrants). Further, the exposure apparatus of the present invention includes a detection unit that detects a plurality of mark positions of the reference plate mounted on the moving stage as the moving stage moves, and the mark position detected by the calibration unit is A correction map for correcting the movement precision of the moving stage in relation to each other is created. Further, the calibration unit creates calibration information corresponding to the area in which the first measurement area and the second measurement area of the movable stage are combined based on the first calibration information and the second calibration information.

With such an exposure apparatus, even when the reference plate is small with respect to the surface on which the plate-shaped object of the moving stage is mounted (that is, the driving range of the moving stage), the moving precision of the moving stage can be corrected.

In addition, in the exposure apparatus of the present invention, the calibration unit corrects the position error of the reference plate loaded in the second measurement area according to the position of the mark located in the overlapping area of the reference plate loaded in the second measurement area to perform the second calibration Write the information. Due to the exposure apparatus, an error caused by loading the reference plate in different measurement areas can be corrected, and calibration information corresponding to the other measurement areas can be created based on the first measurement area.

The stage calibration system of the present invention is a stage calibration system that calibrates a movable stage using a reference plate, and creates first calibration information using a reference plate loaded in a first measurement area of the movable stage, and performs the first measurement and a calibration unit for creating second calibration information using a reference plate mounted on at least one second measurement area having an overlapping area with the area. Due to this stage calibration system, even when the reference plate is small with respect to the moving stage, it is possible to correct the moving precision of the moving stage.

In addition, the stage calibration method of the present invention comprises the steps of: loading a reference plate on a first measurement area of a moving stage; detecting the plurality of mark positions of the reference plate by a detecting means according to the movement of the moving stage; creating first calibration information corresponding to the first measurement area at the plurality of mark positions; and loading a reference plate in at least one second measurement area having an overlapping area partially overlapping with the first measurement area; and detecting, by the detecting means, the plurality of mark positions according to the movement of the moving stage; and creating calibration information for correcting the movement precision of the moving stage based on the first calibration information and the second calibration information.

With this calibration method, calibration information corresponding to an area wider than the size of the reference plate can be created.

In addition, in the step of loading the reference plate in the second measurement area, if a plurality of reference plates are loaded in the loading part, work efficiency can be further improved.

In addition, the calibration method of the present invention comprises the steps of: detecting, by the detecting means, the positions of the marks located in the overlapping areas of the plurality of second measurement areas; and finding a mark position error of each reference plate. Accordingly, it is possible to correct the mark position error (including the installation error of the reference plate) of each reference plate, and to create calibration information corresponding to another measurement area based on the first measurement area.

In addition, instead of loading a plurality of reference plates in the second measurement area, a plate-shaped substrate and a plurality of reference plates are provided, and a plurality of measurement areas (second measurement area) are provided when the substrate is loaded on the loading unit. A calibration jig in which the reference plate is fixed to the substrate may be used so that the reference plates are respectively positioned at positions according to . By using such a jig, workability can be further improved.

According to the present invention, it is possible to precisely create calibration information for correcting the driving precision of the moving stage by using a reference plate smaller than the driving area of the moving stage, and to correct the driving precision of the substrate stage.

1 is a schematic block diagram of an exposure apparatus of the present invention.
Fig. 2 is a view showing a reference plate SP and a reference mark Mij arranged on the reference plate SP in the first embodiment.
Fig. 3 is a diagram showing the substrate stage 40 and measurement areas AS1 to AS5 of the first embodiment.
Fig. 4 is a diagram showing a state in which the reference plate SP is mounted on the measurement area AS1 of the substrate stage 40 of the first embodiment.
5 : is a table|surface which shows partial data of correction map CM1 of measurement area AS1 of 1st Example.
6 is a diagram showing a state in which the reference plate SP is mounted on the measurement area AS2 of the substrate stage 40 of the first embodiment.
7 is a flowchart showing a method of calibrating the driving precision of the substrate stage 40 according to the first embodiment.
Fig. 8 is a diagram showing a state in which reference plates SPa to SPd are arranged on the substrate stage 40 of the second embodiment.
9 is a flowchart showing a method of calibrating the driving precision of the substrate stage 40 according to the second embodiment.
Fig. 10 is a view showing the second reference plate SP2 of the third embodiment.
11 is a flowchart showing a method of calibrating the driving precision of the substrate stage 40 according to the third embodiment.
12 is a diagram showing an example in which the entire area AS of the substrate stage 40 is divided into a plurality of measurement areas.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

<Outline of exposure apparatus 10>

1 is a block diagram of an exposure apparatus 10 according to the present embodiment.

The exposure apparatus 10 is a projection exposure apparatus that transfers a mask pattern formed on a reticle R as a photomask to a substrate (work substrate) W according to a step-and-repeat method, and includes a light source 20 such as a discharge lamp; A projection optical system 34 is provided. The reticle R is made of a quartz material or the like, and a mask pattern having a light-shielding region is formed. As the substrate W, a substrate made of silicon, ceramic, glass, or resin is applied here.

The illumination light emitted from the light source 20 is incident on the integrator 24 through the mirror 22 so that the amount of illumination light becomes uniform. The uniformized illumination light enters the collimator lens 28 through the mirror 26 . Accordingly, the parallel light is incident on the reticle R. The light source 20 is driven and controlled by the lamp driver 21 .

In the reticle stage 30 on which the reticle R is mounted and the substrate stage 40 on which the substrate W is mounted, a three-axis coordinate system of X-Y-Z orthogonal to each other is prescribed. The reticle stage 30 is movable in the X-Y direction to move the reticle R along the focal plane, and is driven by the driving unit 32 . Also, the reticle stage 30 can be rotated in the X-Y coordinate plane. The position coordinates of the reticle stage 30 are measured here by a laser interferometer (not shown) or a linear encoder (not shown).

The light transmitted through the reticle R is projected onto the substrate W as pattern light by the projection optical system 34 . The substrate W is mounted on the substrate stage 40 so that its exposure surface coincides with the image-side focal position of the projection optical system 34 .

The substrate stage 40 (moving stage) is movable in the X-Y direction so as to move the substrate W along the focal plane, and is driven by the stage driver 42 (driver). In addition, the substrate stage 40 is movable in the Z-axis direction (optical-axis direction of the projection optical system 34) perpendicular to the focal plane (X-Y direction), and can also rotate in the X-Y coordinate plane. The positional coordinates of the substrate stage 40 are measured by the measuring unit 43 by means of a laser interferometer or a linear encoder.

The controller 50 controls the stage driver 42 to position the reticle R and the substrate W, and simultaneously controls the lamp driver 21 . Then, the exposure operation according to the step & repeat method is performed. At this time, according to the movement of the substrate stage 40 , the measurement unit 43 measures the amount of movement and outputs it to the control unit 50 . The storage unit 51 provided in the control unit 50 stores the mask pattern position coordinates of the reticle R, the design position coordinates of the shot region formed on the substrate W, the step movement amount, and the like. In addition, the control unit 50 is provided with calibration means (calibration unit) 52 for calculating calibration information to be described later.

The imaging part 36 is a camera or an optical sensor which images the alignment mark formed in the board|substrate W, and images an alignment mark before a short exposure. Further, the imaging unit 37 is a camera or an optical sensor for imaging the alignment marks formed on the reticle R, and is provided so as to be movable in the X direction in FIG. 1 by a moving mechanism (not shown). The image processing unit 38 calculates the positional coordinates of the alignment marks based on the image signal transmitted from the image capturing unit 36 or the image capturing unit 37 . Here, the imaging unit 36, the imaging unit 37, and the image processing unit 38 are all referred to as mark position detecting means.

The exposure apparatus 10 sequentially transfers the mask pattern of the reticle R to each shot region formed on the substrate W according to the step & repeat method. That is, the control unit 50 intermittently moves the substrate stage 40 according to the shot space interval through the stage driver 42 , and when the shot region to be exposed is positioned at the projection position of the mask pattern, the light source 20 ) to project the pattern light onto the shot area.

In the alignment measurement, the measurement unit 43 calculates the positions (X, Y, θz) of the substrate stage 40 in the XY plane.

Next, a method of creating calibration information for correcting the driving precision of the substrate stage 40 will be described. Before describing the method, a reference plate used in the method will be described.

2 shows an example of the reference plate SP. The reference plate SP is a plate-shaped member smaller than the substrate stage 40 . Glass, silicon, ceramic, etc. are used as a member of the reference plate SP. 2 shows an example of a spherical shape, but may be circular or polygonal.

As shown in FIG. 2, the reference plate SP is provided with m×n reference marks Mij. These reference marks are in a positional relationship in the form of a two-dimensional matrix in which m reference mark columns lined up in the X direction and n reference mark columns lined up in the Y direction are orthogonal to each other.

The reference mark Mij is formed on the surface of the reference plate SP in a pattern different in contrast (having a light reflectance different from that of the surface of the reference plate SP) when imaged by the imaging unit 36 . The reference mark Mij is a pattern shape recognizable as a mark by the image processing unit 38 (for example, circular, spherical, cross-shaped, etc.). In addition, the size of the reference mark Mij is appropriately set according to the size of the imaging field of the imaging unit 36 .

The pitches (Px, Py) of the reference mark arrangement are appropriately set according to the design specifications of the substrate stage 40 or the substrate to be exposed. For example, in the case of manufacturing a package substrate, a pitch reference mark Mij equal to the arrangement pitch of the chips may be provided. In this case, the center of the reference mark Mij may be provided at a position close to the chip center, or may be provided at a position according to an alignment mark provided in a package to be exposed. Alternatively, the reference marks may be uniformly provided regardless of the substrate to be exposed, for example, at a pitch of 10 mm.

<First embodiment>

Next, a first embodiment in which calibration information for calibrating the driving precision of the substrate stage 40 is created will be described with reference to the schematic diagrams of Figs. 3 to 6 and the flowchart of Fig. 7 .

Hereinafter, the configuration of the first embodiment will be described.

3 : is a figure which shows the measurement area|region of the substrate stage 40. As shown in FIG. A measurement area AS1 is provided in the central portion of the substrate stage 40 , and the measurement areas AS2 to AS5 are further divided into 4 to have an area overlapping the measurement area AS1 by dividing the entire area AS of the substrate stage 40 . ) is provided. Here, the measurement area is an area indicating the range for measuring the mark position, but is also an area indicating the driving area when the movable stage is driven to measure the mark position at the same time.

Next, the procedure of the calibration method according to the first embodiment will be described (see Fig. 7).

Step S101. First, as shown in FIG. 4 , the reference plate SP is installed in the central measurement area AS1 on the substrate stage 40 . At this time, it is installed on the substrate stage 40 in a state in which the direction (rotation) of the reference plate SP is approximately aligned so that the X-direction column and the Y-direction column of the reference mark arrangement are parallel to the X-axis and the Y-axis, respectively. At this time, according to a method to be described later, the positions of two reference marks of the reference plate SP may be obtained, and the XYθ of the reference plate SP may be corrected. In addition, the reference plate SP may be moved onto the substrate stage 40 through a transfer device (not shown), or an operator may directly install it on the substrate stage 40 .

Step S102. Next, by the stage driving unit 42 , the imaging unit 36 moves the substrate stage 40 to a position where a predetermined reference mark (for example, the reference mark M11) is imaged. Next, the imaging unit 36 images the reference plate SP, and the image processing unit 38 calculates the position of the reference mark Mij. The control unit 50 stores the position information of the reference mark Mij transmitted from the image processing unit 38 in the storage unit 51 . Next, the control unit 50 controls the stage driving unit 42 while referring to the current position of the substrate stage 40 measured by the measurement unit 43 , and sets the substrate stage 40 to the reference mark ( Mij) is moved a predetermined distance (design pitch (Px) or (Py) of reference mark arrangement) according to the arrangement. In the same manner as in the previous step, the imaging unit 36 images the reference plate SP, and the image processing unit 38 calculates the position of the reference mark Mij and stores it in the storage unit 51 . In this way, the step movement of the substrate stage 40 is repeated to measure the positions of all the reference marks on the reference plate SP, and the position information is stored in the storage unit 51 .

In addition, since the measurement area AS1 is a reference measurement area when measuring other measurement areas, it is necessary to measure particularly precisely. Therefore, the step S102 may be repeated several times (for example, three times), and the average of the measured values for each reference mark Mij may be used as position information of the reference mark arrangement.

Step S103. Next, after the calibration means 52 connected to the control unit 50 moves the design coordinate data of the reference mark arrangement stored in advance in the storage unit 51 and the actual step movement of the reference mark Mij measured in step S102 Find the difference between the position coordinate data. The difference becomes the stage movement error Dij(ΔXij, ΔYij) at the position of the reference mark Mij. Next, the correction unit 52 calculates a correction value Rij(-ΔXij, -ΔYij) that is a value obtained by inverting the sign of the stage movement error Dij. This Rij is calculated for each reference mark Mij, and then the correction values Rij are arranged according to the reference mark arrangement to create a correction map CM1 of the measurement area AS1 and stored in the storage unit 51 do.

Fig. 5 shows an example of the correction map CM1 in a table. In this table, correction values ΔX, -ΔY in the range of the reference mark arrays M11 to M35 among the correction map CM1 are shown as examples. For example, the correction value R11 (-?X11, -?Y11) in the reference mark M11 is (0.24, -0.12) [μm] according to the table. Further, the position of M11 on the substrate stage 40 is expressed by stage coordinates (X, Y), and is (187.0, 112.0) [mm].

Step S104. Next, as shown in FIG. 6 , the reference plate SP is installed in the measurement area AS2 on the substrate stage 40 .

Step S105. Next, the stage driving unit 42 moves the substrate stage 40 to a position where the imaging unit 36 images a predetermined reference mark (for example, the reference mark M11). Then, according to the design coordinates of the reference mark arrangement stored in advance in the storage unit 51, the control unit 50 drives the substrate stage 40 through the stage driving unit 42, and the imaging unit 36 moves the measurement area ( A reference mark of at least two points (at least one point in the case of a mark with a clear posture angle such as a cross mark) existing in the overlapping area AS2a of the AS1) and the measurement area AS2 is imaged, and the image processing unit 38 moves the position measure At this time, it is preferable to measure the positions of a plurality of reference marks forming a pair in the X-direction or the Y-direction because the measurement accuracy can be improved. For example, in FIG. 5 , two pairs of M11 and M41 and M12 and M42 correspond to reference marks forming a pair in the X direction. In addition, four pairs of M11 and M12, M21 and M22, M31 and M32, and M41 and M42 correspond to reference marks forming a pair in the Y direction.

At the time of measurement in step S105, an existing interpolation process (for example, linear interpolation) is performed based on the correction map CM1 to calculate a correction value according to the current position of the substrate stage 40, and using the correction value The driving precision of the substrate stage 40 is corrected. Here, the calibration of the driving precision is to correct the measurement result of the measurement unit 43 by the control unit 50 (that is, to correct the measurement amount) or the control unit 50 moves the substrate stage 40 to the stage driving unit 42 . When , it means to correct the target value (that is, to correct the driving amount). Although any correction method may be used, the description will be made on the premise that correction of the driving amount is performed.

Step S106. Next, the control unit 50 calculates the angle of the line segment connecting the plurality of reference marks. Next, an installation angle and an installation position of the reference plate SP with respect to the X and Y axes of the substrate stage 40 are calculated in the line segments in the X and Y directions. After that, the control unit 50 based on the design coordinate data of the reference mark arrangement stored in the storage unit 51 and the installation angle and position of the reference plate, the movement target of the substrate stage 40 used in the next step S107. Correction of the coordinate data (that is, the design coordinate data of the reference mark arrangement) is performed.

Step S107. Next, in the same manner as described in step S102, the positions of all the reference marks on the reference plate SP are measured, and the position information is stored in the storage unit 51 .

Step S108. Next, as demonstrated in step S103, the calibration means 52 connected to the control part 50 creates the correction map CM2 of the measurement area AS2, and memorize|stores it in the memory|storage part 51. FIG.

Steps S109, S110. The same processing is performed for the measurement areas AS3 to AS5. That is, it is determined whether the creation of the correction map for all measurement areas is completed (step S109), and if not completed, the reference plate SP is sequentially measured for the remaining measurement areas as in steps S105 to S108, and the correction map CM3 to CM5) are created and stored in the storage unit 51 (step S110).

Step S111. The control unit 50 creates a correction map of the entire area AS of the substrate stage 40 based on the correction maps CM1 to CM5 . The correction map CM1 is used for the overlapping part of the measurement area. In this case, the boundary portion of the correction map performs non-linear correction of two adjacent correction maps.

As described above, the correction map of the substrate stage 40 is stored in the storage unit 51 . Then, for example, during exposure of the wafer, the driving precision of the substrate stage 40 is corrected using the correction map.

Here, in the above embodiment, a correction map of the entire area AS of the substrate stage 40 was created based on the five correction maps of the correction maps CM1 to CM5, It is possible to create a correction map of the entire area AS of the substrate stage 40 by using the correction map.

<Second embodiment>

In the first embodiment, the stage movement errors in the measurement areas AS1 to AS5 were sequentially measured by changing the mounting position of one reference plate SP on the substrate stage 40 . In the second embodiment, as shown in FIG. 8, the measurement areas AS2 to AS5 using a plurality of reference plates Spa (the reference plate Spa may use the reference plate SP) (SPb, SPc, SPd) ) of the stage movement error is measured continuously.

In this case, it is preferable that the reference plates SPa to SPd have the same characteristics as the reference plates SP in the arrangement of the reference marks. In addition, it is preferable that the flatness is good with the same material and the same plate thickness so that there is no individual difference in the arrangement of reference marks to be imaged when it is mounted on the substrate stage 40 .

A method of creating calibration information for calibrating the driving precision of the substrate stage 40 according to the second embodiment will be described with reference to FIG. 9 . Steps S201 to S203 have the same procedure as steps S101 to S103 of the first embodiment. Next, the reference plates SPa to SPd are respectively loaded in the measurement areas AS2 to AS5 (step S204).

Next, in the same manner as in steps S105 to S110 of the first embodiment, a correction map for each measurement region is created, and in the same manner as in step S111, a correction map for the entire region AS of the substrate stage 40 is created (step S111). S205 to S209).

According to the second embodiment, since the loading of the reference plate on the substrate stage 40 is performed in one process, and the mark position can be continuously measured, workability is improved. In addition, the time required for calibration can be reduced.

<Third embodiment>

In the second embodiment, measurement of the stage movement error in the measurement regions AS2 to AS5 was continuously performed using a plurality of reference plates SPa to SPd, but in the third embodiment, the plurality of reference plates are described as one sheet. Fix it on top and treat it as one reference plate.

10 is an example of the second reference plate SP2. The second reference plate SP2 includes a substrate PB having the same size as the substrate loading surface of the substrate stage 40 and four reference plate members PSP1 to PSP4 attached and fixed to the substrate PB. do.

For the second reference plate SP2 and the substrate PB, a material having a coefficient of thermal expansion close to that of the reference plate members PSP1 to PSP4 may be used. For example, ceramic is used.

The reference plate members PSP1 to PSP4 of the second reference plate SP2 have reference marks M2ij having the same shape at the same pitch as that of the reference plate SP, respectively, in a two-dimensional matrix form. The reference plate members PSP1 to PSP4 of the second reference plate SP2 are preferably manufactured using the same material and the same manufacturing method as the reference plate SP.

As shown in FIG. 10 , different installation errors may occur in the reference plate members PSP1 to PSP4 due to a process such as adhesion. For this reason, the second reference plate SP2 cannot be regarded as a continuous reference plate and used. Therefore, similarly to the second embodiment, each of the loading errors is obtained with the substrate stage 40 for the reference plate members PSP1 to PSP4, and the stage movement error is measured for each reference plate member PSP1 to PSP4 according to each loading error. A correction map of the substrate stage 40 is created.

A method of creating calibration information for calibrating the driving precision of the substrate stage 40 according to the third embodiment will be described with reference to FIG. 11 . Steps S301 to S303 are the same procedures as steps S201 to S203 of the second embodiment. Next, the second reference plates SP2 are respectively loaded on the entire area AS (step S304). Next, in the same manner as in steps S205 to S209 of the second embodiment, a correction map for each measurement area is created, and a correction map for the entire area AS of the substrate stage 40 is created (steps S305 to S309).

According to the third embodiment, since the loading of the reference plate onto the substrate stage 40 can be performed at once, the workability is further improved. In addition, the time required for calibration can be reduced.

As described above, according to the present invention, it is possible to create calibration information for correcting the driving precision of the moving stage even when a reference plate smaller than the stage driving area is used.

In addition, although the case where the moving stage is the substrate stage 40 has been described as an example, the driving precision of the reticle stage 30 can also be corrected in the same way. In this case, the mark of the reference plate mounted on the reticle stage is detected using the imaging unit 37 .

In addition, although the case where the area obtained by dividing the substrate stage 40 into 4 is the second measurement area has been described as an example, the number of divisions or arrangement is not limited thereto. For example, as shown in FIG. 12 , a first measurement area AS1 in the center of the substrate stage 40, second measurement areas AS2 to AS5 partially overlapping the first measurement area, and a second measurement area A third measurement area AS6 to AS13 partially overlapping one may be provided. In this case, the calibration unit 52 creates calibration information for correcting the driving accuracy of the drive unit based on the correction maps CM1 to CM13 corresponding to the measurement areas AS1 to AS2.

In addition, the use of the exposure apparatus is not limited to an exposure apparatus for manufacturing a semiconductor package, and can be widely applied to an exposure apparatus for a liquid crystal display panel, an exposure apparatus for a printed circuit board, and the like.

In addition, the exposure apparatus 10 is not limited to the projection exposure apparatus of the embodiment, and, for example, a maskless exposure apparatus without a reticle can also implement the present invention. Further, the present invention can also be used as a stage calibration system for devices other than the exposure apparatus.

10: projection exposure apparatus
38: image processing unit
40: substrate stage
42: stage driving unit
43: measurement unit
50: control unit
51: memory
52: correction means (correction unit)
SP: reference plate
SP2: second reference plate
Mij: reference mark
PSP1 to PSP4: reference plate member
R: Reticle
AS1 to AS13: Measurement area

Claims (10)

An exposure apparatus comprising: a calibration unit for creating calibration information of movement accuracy of a moving stage using a reference plate to which a reference mark having a positional relationship in the form of a two-dimensional matrix in which rows and columns are orthogonal to each other;
First calibration information is created using the reference plate loaded in the first measurement area of the moving stage, and after the creation of the first calibration information is completed, in the first measurement area, the first measurement area and the first measurement area are partially and the calibration unit for creating second calibration information by using the reference plate that has been moved to and loaded into at least one second measurement area having an overlapping area with . According to claim 1,
the calibration unit, based on the position of the reference mark located in the overlapping area, among the plurality of reference marks provided to the reference plate loaded in the second measurement area, of the reference plate loaded in the second measurement area The exposure apparatus according to claim 1, wherein the second correction information is created by correcting the position error. 3. The method of claim 1 or 2,
Exposure characterized in that the calibration unit creates the calibration information corresponding to an area in which the first measurement area and the second measurement area of the moving stage are combined based on the first calibration information and the second calibration information. Device. 3. The method of claim 1 or 2,
The exposure apparatus characterized in that the said calibration part creates the said 2nd calibration information based on the some 2nd measurement area|region which divided|segmented the mounting surface of the said moving stage into a plurality. 3. The method of claim 1 or 2,
a detection unit configured to detect positions of a plurality of reference marks provided to the reference plate mounted on the moving stage according to the movement of the moving stage;
An exposure apparatus characterized by creating a correction map for correcting the movement precision of the moving stage in relation to the mark position detected by the correction unit and the moving stage position at that time. A stage calibration system for calibrating a moving stage using a reference plate to which a reference mark having a positional relationship in the form of a two-dimensional matrix in which rows and columns are orthogonal to each other,
First calibration information is created using the reference plate loaded in the first measurement area of the moving stage, and after the creation of the first calibration information is completed, in the first measurement area, the first measurement area and the first measurement area are partially and a calibration unit configured to create second calibration information using the reference plate loaded and moved to at least one second measurement area having an overlapping overlapping area. loading a reference plate to which a reference mark having a positional relationship in the form of a two-dimensional matrix in which rows and columns are orthogonal to each other is assigned to a first measurement area of the moving stage;
detecting, by a detection means, the positions of a plurality of reference marks provided on the reference plate according to the movement of the moving stage;
creating, by a calibration unit, first calibration information corresponding to the first measurement area at positions of the plurality of reference marks;
After the preparation of the first calibration information is completed, moving the reference plate from the first measurement area to at least one second measurement area having an overlapping area partially overlapping with the first measurement area and loading the reference plate Wow,
detecting, by the detection means, the positions of the plurality of reference marks provided on the reference plate according to the movement of the moving stage;
creating, by the calibration unit, second calibration information corresponding to the second measurement area at positions of the plurality of reference marks;
creating, by the calibration unit, calibration information for correcting the movement precision of the movable stage based on the first calibration information and the second calibration information;
Stage calibration method comprising a. 8. The method of claim 7,
When the moving stage has a plurality of second measurement areas,
loading a plurality of reference plates into each of the plurality of second measurement areas;
Stage calibration method, characterized in that it further comprises. 9. The method of claim 8,
detecting, by the detection means, a position of a reference mark located in the overlapping area among a plurality of reference marks provided to each reference plate loaded on the plurality of second measurement areas;
obtaining, by the calibration unit, a mark position error of each reference plate loaded in the plurality of second measurement areas according to the detected position of the reference mark;
Stage calibration method further comprising a. delete

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