TWI758281B - Exposure device, stage calibration system, stage calibration method, and calibration jig - Google Patents

Abstract

Use a reference plate that is smaller than the stage drive area to calibrate the drive accuracy of the stage accuracy.

with the accuracy of movement to build a mobile platform with a reference board The exposure device of the calibration section for calibration information includes creating first calibration information with a reference plate placed on a first measurement area of a mobile platform, and using at least one second calibration plate placed in an area overlapping with the first measurement area The reference plate of the measurement area establishes the calibration part of the second calibration information.

Description

Exposure device, stage calibration system, stage calibration method, and calibration jig

The present invention relates to an exposure device, a platform calibration system, and a platform calibration method, and more particularly, to an exposure device, a platform calibration system, a platform calibration method, and a calibration method for establishing calibration information using a reference plate and correcting the driving accuracy of a mobile platform. Correction jig used.

Conventionally, in the lithography process of manufacturing semiconductor packaging substrates, the step-and-repeat method of reduction projection exposure device and the step-and-scan method of projection exposure are mainly used device etc.

In these exposure apparatuses, the alignment between the circuit pattern formed on the substrate and the circuit pattern to be superimposed and exposed thereon, that is, superposition, requires high precision.

In the current exposure devices, although a laser interferometer is used to measure the position of the substrate platform that holds the substrate to be exposed to achieve high-precision superposition, the temperature fluctuations of the atmosphere on the beam path of the laser interferometer cannot be ignored. Short-term changes in measured values due to (air fluctuations).

Therefore, an encoder that is less susceptible to air fluctuations than an interferometer is developed to measure the position of the wafer stage, and to position the substrate stage with a reference wafer that is assigned a plurality of marks in a known positional relationship, and simultaneously detect Each of the plurality of marks establishes a corrected substrate plane based on the detected positioning position and the target position Exposure apparatus for correcting information of the drive accuracy of the stage (for example, Patent Document 1).

Conventional semiconductor packaging substrates use wafers, but in recent years, attempts have been made to use rectangular substrates larger than wafers. More specifically, conventionally, a packaging technology called FAN-IN WLP is used to form rewiring, insulating film, and post on a semiconductor wafer, and then dicing and separation, but in recent years, it is called FAN-IN WLP. For FAN-OUT WLP, the diced and separated chips are reconstructed onto the substrate and the packaging technology to form rewiring, insulating films, and rods. In this case, the substrate for reconstruction not only uses chips, but also tries to use larger Rectangular base plate.

Due to the enlargement of the substrate, the size of the substrate stage of the exposure apparatus is increased, and the driving area of the substrate stage at the time of exposure also increases. Therefore, the reference plate used for basic stage calibration (same as the reference wafer, the plate that is assigned a plurality of marks in a known positional relationship) needs to be enlarged. In addition, the same is true for the reticle stage. With the enlargement or reduction of the exposure area and the high magnification of the projection optical system, the reticle stage becomes larger, so the reference plate used for calibration needs to be enlarged.

【Prior technical literature】

【Patent Literature】

Patent Document 1 Japanese Patent Laid-Open No. 2009-164306

Although a photolithography process is used to form a plurality of marks on the reference plate, large plate-shaped parts are easily distorted due to thermal expansion and the like. In addition, since the photolithography apparatus also uses a large stage, the positional error of the marks drawn on the reference plate tends to increase. Therefore, a large reference board is more prone to configuration errors of the reference board than a small reference board.

Therefore, it is desired to correct the driving accuracy of the entire driving area of the moving platform by using a reference plate that is smaller than the driving area of the moving platform (platform) to be calibrated.

The exposure apparatus of the present invention is an exposure apparatus including a calibration section that uses a reference plate to establish calibration information for the movement accuracy of the moving platform, and includes establishing the first calibration information using a reference plate placed on a first measurement area of the moving platform, and using The calibration section for establishing the second calibration information is placed on the reference plate in at least one second measurement area that overlaps with the first measurement area. It is preferable to have a plurality of second measurement regions obtained by dividing the mounting surface of the mobile stage (surface on which the reference plate, substrate, reticle, etc. are mounted) into plural (for example, quarters). In addition, the exposure apparatus of the present invention includes a detection unit that detects the positions of a plurality of marks placed on the reference plate of the mobile platform based on the movement of the mobile platform, and the correction unit measures the distance between the detected mark position and the current position of the mobile platform. relationship, creating a correction map that corrects the movement accuracy of the mobile platform. Furthermore, the calibration unit establishes calibration information corresponding to the combined area of the first measurement area and the second measurement area of the mobile platform according to the first calibration information and the second calibration information.

With this exposure device, even when the reference plate is small relative to the surface on which the plate-like body is placed (ie, the driving range of the moving platform), the movement accuracy of the moving platform can be corrected.

In addition, in the exposure apparatus of the present invention, the correction section corrects the positional error of the reference plate placed in the second measurement area based on the position of the mark located in the overlapping area of the reference plate placed in the second measurement area to establish the second measurement area. 2 Correction information. With this exposure device, errors caused by placing the reference plate in different measurement areas can be corrected, and correction information corresponding to other measurement areas can be established with the first measurement area as a reference.

The platform calibration system of the present invention uses the reference plate to calibrate the mobile platform The platform calibration system includes establishing first calibration information with a reference plate placed in the first measurement area of the mobile platform, and using a reference plate placed in at least one second measurement area that overlaps with the first measurement area. The reference plate establishes a calibration part of the second calibration information. With this platform correction system, even when the reference plate is small relative to the mobile platform, the movement accuracy of the mobile platform can be corrected.

In addition, the platform calibration method of the present invention includes: a step of placing a reference plate in the first measurement area of the mobile platform; a step of detecting the position of a plurality of marks on the reference plate by a detection unit according to the movement of the mobile platform; a calibration unit The step of establishing the first calibration information corresponding to the first measurement area from the positions of the plurality of marks; the step of placing the reference board in at least one second measurement area which overlaps with the first measurement area; the step of detecting The unit detects the positions of the plurality of marks according to the movement of the mobile platform; the calibration unit establishes the second calibration information corresponding to the second measurement area from the positions of the plurality of marks; and the calibration unit is based on the first calibration information and the second The calibration information is a step of creating calibration information for revising the movement accuracy of the mobile platform.

With this calibration method, calibration information corresponding to an area wider than the size of the reference plate can be created.

In addition, in the step of placing the reference plate on the second measurement area, if a plurality of reference plates are placed on the above-mentioned placing portion, the work efficiency can be further improved.

In addition, the calibration method of the present invention further includes: the detection unit detects the position of the mark located in the overlapping area of the plurality of second measurement areas; and the calibration unit obtains the position of the mark placed on the 2. The step of measuring the mark position error of each reference plate in the area. Thereby, the mark position error of each reference plate (including the setting error of the reference plate) can be corrected, and the calibration information corresponding to other measurement regions can be established with the first measurement region as a reference.

In addition, instead of placing a plurality of reference plates on the second measurement area, a plate-shaped base material and a plurality of reference plates may be used, and when the base material is placed on the moving platform, they may be placed corresponding to a plurality of amounts respectively. The calibration jig for fixing the above-mentioned reference plates to the base material by means of the position of the measuring area (second measuring area). By using such a calibration jig, workability can be further improved.

According to the present invention, the correction information for correcting the driving accuracy of the mobile platform can be more accurately established by using the reference plate smaller than the driving area of the mobile platform, and the driving accuracy of the mobile platform can be corrected.

10: Exposure device

20‧‧‧Light source

21‧‧‧Light Driver

22, 26‧‧‧Mirror

24‧‧‧Integrator

28‧‧‧Collimating Lens

30‧‧‧Reticle Platform

32, 42‧‧‧Platform Drive Department

34‧‧‧Projection Optical System

36, 37‧‧‧Photography Department

38‧‧‧Image Processing Department

40‧‧‧Substrate platform

43‧‧‧Measurement Department

50‧‧‧Control Department

51‧‧‧Memory Department

52‧‧‧Correction Department

AS‧‧‧Overall area

AS1~AS5‧‧‧Measurement area

M11, M1n, Mm1, Mmn, Mij, M2ij‧‧‧reference marks

PB‧‧‧Substrate

PSP1~PSP4‧‧‧Reference Board Components

Px, Py‧‧‧spacing

R‧‧‧Reticles

SP, SP, 2SPa~SPd‧‧‧reference board

W‧‧‧Substrate

Fig. 1 is a schematic block diagram of the exposure apparatus of the present invention.

FIG. 2 is a diagram showing the reference plate SP according to the first embodiment, and the reference marks Mij arranged on the reference plate SP.

FIG. 3 is a diagram showing the substrate stage 40 and the measurement areas AS1 to AS5 of the first embodiment.

FIG. 4 is a diagram showing a state in which the reference board SP is placed on the measurement area AS1 of the substrate stage 40 in the first embodiment.

FIG. 5 is a table showing a part of data of the correction map CM1 of the measurement area AS1 in the first embodiment.

FIG. 6 is a diagram showing a state in which the reference board SP is placed on the measurement area AS2 of the substrate stage 40 in the first embodiment.

FIG. 7 is a flowchart showing a driving accuracy calibration method of the substrate stage 40 according to the first embodiment.

FIG. 8 is a diagram showing a state in which the reference boards SPa to SPd are arranged on the substrate stage 40 in the second embodiment.

FIG. 9 is a flowchart showing a driving accuracy calibration method of the substrate stage 40 according to the second embodiment.

FIG. 10 is a diagram showing the second reference plate SP2 of the third embodiment.

FIG. 11 is a flowchart showing a driving accuracy calibration method of the substrate stage 40 according to the third embodiment.

FIG. 12 is a diagram showing an example of dividing the entire area AS of the substrate stage 40 into a plurality of measurement areas.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Overview of Exposure Device 10 >

FIG. 1 is a block diagram of the exposure apparatus 10 of this embodiment.

The exposure apparatus 10 is a projection exposure apparatus for transferring a mask pattern formed on a reticle R serving as a photomask to a substrate (working substrate) W according to a step-and-repeat method, and includes a light source 20 such as a discharge lamp, a projection Optical system 34 . The reticle R is made of quartz material and forms a mask pattern with a light-shielding area. Here, as the substrate W, a substrate made of silicon, ceramics, glass, or resin is suitable.

The illumination light emitted from the light source 20 is incident on the integrator 24 through the mirror 22, and the illumination light amount is made uniform. The uniform illumination light is incident on a collimator lens 28 through the mirror 26 . Thereby, the parallel light is incident on the reticle R. The light source 20 is driven and controlled via the lamp driving unit 21 .

On the reticle stage 30 on which the reticle R is mounted and the substrate stage 40 on which the substrate W is mounted, a three-axis coordinate system of X-Y-Z that are perpendicular to each other is defined. reticle The stage 30 is movable in the X-Y direction to move the reticle R along the focal plane, and is driven by the driving portion 32 . In addition, the reticle stage 30 can also be rotated in the X-Y coordinate plane. The position coordinates of the reticle stage 30 are measured by a laser interferometer (not shown in the figure) or a linear encoder (not shown in the figure).

The light transmitted through the reticle R is projected onto the substrate W as pattern light through the projection optical system 34 . The substrate W is mounted on the substrate stage 40 so that the exposure surface of the substrate W coincides with the image-side focal position of the projection optical system 34 .

The substrate stage 40 (moving stage) is movable in the X-Y direction to move the substrate W along the focal plane, and is driven by the stage driving section 42 (driving section). In addition, the substrate stage 40 can be moved in the Z-axis direction perpendicular to the focal plane (X-Y direction), and can also be rotated in the X-Y coordinate plane. The position coordinate system of the substrate stage 40 is measured by a measuring part 43 composed of a laser interferometer or a linear encoder.

The control section 50 controls the stage driving sections 32 and 42 to position the reticle R and the substrate W and controls the lamp driving section 21 at the same time. Then, the exposure action is performed based on the step-and-repeat method. At this time, along with the movement of the substrate stage 40 , the measurement unit 43 measures the movement amount, and outputs it to the control unit 50 . The memory unit 51 of the control unit 50 stores the position coordinates of the mask pattern of the reticle R, the position coordinates of the shot area design formed on the substrate W, the step movement amount, and the like. Moreover, the control part 50 is provided with the correction means (correction part) 52 which calculates correction information mentioned later.

The imaging unit 36 is a camera or an optical sensor that captures an alignment mark formed on the substrate W, and captures the alignment mark before irradiation exposure. In addition, the imaging unit 37 is a camera or an optical sensor that captures the alignment marks formed on the reticle R, and is mounted so as to be movable in the X direction in FIG. 1 by a movement mechanism not shown. The image processing unit 38 is based on the image sent from the photographing unit 36 or the The position coordinates of the alignment marks are calculated from the video signal of the section 37 . In addition, the photographing unit 36, the photographing unit 37, and the video processing unit 38 are collectively referred to as mark position detection means.

The exposure device 10 sequentially transfers the mask pattern of the reticle R to each of the irradiation areas formed on the substrate W according to the step-and-repeat method. That is, the control part 50 moves the substrate stage 40 intermittently through the stage driving part 42 according to the interval of the irradiation area, and when the irradiation area of the exposure object is positioned at the projection position of the mask pattern, the light source 20 is driven to project the pattern light onto the irradiation area .

During the alignment measurement, the measurement unit 43 calculates the position (X, Y, θz) of the substrate stage 40 in the XY plane.

Next, a method of creating calibration information for correcting the driving accuracy of the substrate stage 40 will be described. Before the description of the method, the reference plate used for the method is described.

FIG. 2 is a diagram showing an example of the reference plate SP. The reference plate SP is a plate-like member smaller than the substrate stage 40 . As the components of the reference board SP, glass, silicon, ceramics, or the like is used. Although the example of a rectangle is shown in FIG. 2, it may be circular or polygonal.

As shown in FIG. 2, m×n reference marks Mij are assigned to the reference plate SP. These reference marks have a two-dimensional matrix-like positional relationship in which a row of m reference marks arranged in the X direction and a row of n reference marks arranged in the Y direction are perpendicular to each other.

The reference mark Mij is formed on the surface of the reference plate Sp as a pattern having different contrasts (having a light reflectance different from that of the surface of the reference plate SP) when the photographing section 36 takes pictures. The reference mark Mij is a pattern shape (for example, a circle, a rectangle, a cross, etc.) that the image processing unit 38 can recognize as a mark. In addition, the size of the reference mark Mij is appropriately set based on the size of the imaging field of view of the imaging unit 36 .

The pitches Px and Py of the reference mark array are appropriately set according to the design specification of the substrate stage 40 or the substrate to be exposed. For example, if the packaging substrate is made of For this purpose, the reference marks Mij can be set with the same pitch as the array pitch of the wafers. At this time, the center of the reference mark Mij can be set at a position close to the center of the wafer, or can also be set at a position corresponding to the alignment mark set on the package to be exposed. Alternatively, the reference marks may be uniformly set at a distance of, for example, 10 mm regardless of the substrate to be exposed.

<first embodiment>

Next, a first embodiment of creating calibration information for calibrating the drive accuracy of the substrate stage 40 will be described using the schematic diagrams of FIGS. 3 to 6 and the flowchart of FIG. 7 .

The configuration of the first embodiment will be described below.

FIG. 3 is a diagram showing the measurement area of the substrate stage 40 . A measurement area AS1 is provided in the central portion of the substrate stage 40 , and measurement areas AS2 to AS5 are provided that divide the entire area AS of the substrate stage 40 into four and have areas that overlap with the measurement area AS1 . In addition, although the measurement area represents the area within the range of the measurement mark position, at the same time, it also represents the drive area when the moving stage is driven for the measurement of the mark position.

The steps of the calibration method according to the first embodiment will be described below (refer to FIG. 7 ).

Step S101 : First, as shown in FIG. 4 , set the reference plate SP on the measurement area AS1 of the central portion of the substrate stage 40 . At this time, the reference plate SP is set on the substrate stage 40 in a state where the directions (rotations) of the reference plate SP are substantially matched so that the X-direction row and the Y-direction row of the reference mark array are parallel to the X-axis and the Y-axis, respectively. At this time, the positions of the two reference marks of the reference plate SP may be obtained by a method described later, and the XYθ of the reference plate SP may be manipulated. In addition, the reference board SP can be moved on the substrate stage 40 by a conveying device (not shown in the figure), or can be directly set on the substrate stage 40 by an operator.

Step S102 : Next, the substrate is moved by the stage driving unit 42 The platform 40 to the photographing unit 36 captures the position of a predetermined reference mark (eg, the reference mark M11). Next, the photographing unit 36 photographs the reference panel SP, and the image processing unit 38 calculates the position of the reference mark Mij. The control unit 50 stores the position information of the reference mark Mij sent from the image processing unit 38 in the memory unit 51 . Next, the control part 50 refers to the current position of the substrate stage 40 measured by the measuring part 43 and simultaneously controls the stage driving part 42 to move along the array of reference marks Mij of the reference plate SP at a predetermined distance (the design pitch of the reference mark array Px or Py) Move the substrate stage 40 . Like the previous time, the photographing unit 36 photographs the reference plate SP, and the image processing unit 38 calculates the position of the reference mark Mij, and stores it in the memory unit 51 . Accordingly, the step movement of the substrate stage 40 is repeated to measure the positions of all the reference marks on the reference plate SP, and the position information is stored in the memory unit 51 .

In addition, since the measurement area AS1 is a reference measurement area when measuring other measurement areas, it is necessary to perform a particularly high-precision measurement. Here, this step S102 can also be repeated several times (for example, 3 times), and the average of the measured values of each reference mark Mij is taken as the position information of the reference mark array.

Step S103: Next, the calibration unit 52 connected to the control unit 50 obtains the difference between the design coordinate data of the reference mark array stored in the memory unit 51 in advance and the position coordinate data of the reference mark Mij measured in step S102 after the actual step movement. difference between. This difference is the step movement error Dij (ΔXij, ΔYij) at the position of the reference mark Mij. Next, the correction unit 52 calculates a correction value Rij (-ΔXij, -ΔYij) corresponding to a value obtained by inverting the sign of the step movement error Dij. The Rij is calculated for each reference mark Mij respectively, and then the correction values Rij are arranged corresponding to the reference mark array to create a correction map CM1 of the measurement area AS1 and store it in the memory 51 .

FIG. 5 is a table showing an example of the correction map CM1. This table exemplifies the correction of the range of the reference marker arrays M11 to M35 in the map CM1 Correction value (-△X,-△Y). For example, the correction value R11 (-ΔX, -ΔY) in the reference mark M11 is (0.24, -0.12) [μm] according to the table. In addition, the position of M11 on the substrate stage 40 is represented by stage coordinates (X, Y), and is (187.0, 112.0) [mm].

Step S104 : Next, as shown in FIG. 6 , set the reference plate SP on the measurement area AS2 on the substrate stage 40 .

Step S105: Next, the stage driving unit 42 moves the substrate stage 40 to a position where the imaging unit 36 captures a predetermined reference mark (for example, reference mark M11). Next, according to the design coordinates of the reference mark array stored in the memory section 51 in advance, the control section 50 drives the substrate stage 40 through the stage driving section 42, and the imaging section 36 captures the image of the overlapping area AS2a existing in the measurement area AS1 and the measurement area AS2 At least 2 points (at least 1 point in the case of a mark with a clear attitude angle such as a cross mark) of the reference mark, and the image processing unit 38 measures the position thereof. At this time, if the positions of a plurality of reference marks in pairs in the X direction or the Y direction are measured, the measurement accuracy can be improved, so it is suitable. For example, in Fig. 5, two groups of M11 and M41, and M12 and M42 correspond to paired reference marks in the X direction. In addition, four groups of M11 and M12, M21 and M22, M31 and M32, and M41 and M42 correspond to paired reference marks in the Y direction.

During the measurement in step S105 , a known interpolation process (eg, linear interpolation) is performed based on the correction map CM1 to calculate a correction value corresponding to the current position of the substrate stage 40 , and use the correction value to correct the driving accuracy of the substrate stage 40 . Here, the correction of the driving accuracy means that the control unit 50 corrects the measurement result of the measurement unit 43 (that is, the correction of the measurement value), or the control unit 50 instructs the stage driving unit 42 to perform the operation of the substrate stage 40 . The target value is corrected during movement (ie, the drive amount is corrected). Although any correction method can be used, it is assumed that correction of the drive amount is performed here.

Step S106: Next, the control unit 50 calculates the linking of a plurality of references The angle of the marked line segment. Next, from the line segments in the X direction and the Y direction, the installation angle and installation position of the reference plate SP with respect to the X axis and the Y axis of the substrate stage 40 are calculated. Next, the control unit 50, based on the design coordinate data of the reference mark array stored in the memory unit 52 and the setting angle and position of the reference plate, performs the movement target coordinate data of the substrate stage 40 (that is, the reference mark array) used in the next step S107. design coordinate data).

Step S107 : Next, as described in Step S102 , measure the positions of all the reference marks on the reference plate SP, and store the position information in the memory unit 51 .

Step S108 : Next, as described in Step S103 , the calibration unit 52 connected to the control unit 50 creates a correction map CM2 of the measurement area AS2 and stores it in the memory unit 51 .

Steps S109, S110: The same processing is also performed on the measurement areas AS3-AS5. In other words, it is determined whether the creation of the correction map of all the measurement areas is completed (step S109 ). If not completed, the measurement of the reference board SP that is the same as in steps S105 to S108 is sequentially performed on the remaining measurement areas to create The corrected maps CM3 to CM5 are stored in the memory unit 51 (step S110).

Step S111 : The control unit 50 creates a correction map of the entire area AS of the substrate stage 40 based on the correction maps CM1 to CM5 . Correction map CM1 is used for repeating parts of the measurement area. At this time, nonlinear correction of two adjacent correction maps is performed for the boundary portion of the correction map.

As described above, the correction map of the substrate stage 40 is stored in the memory unit 51 . Then, for example, during wafer exposure, etc., the driving accuracy of the substrate stage 40 is corrected using this correction map.

In addition, in the above-mentioned embodiment, although it is based on the correction map CM1~ The 5 revision maps of CM5 create the revision map of the entire area AS of the substrate platform 40, but the revision map of the whole area AS of the substrate platform 40 can also be created according to the 4 revision maps of CM2~CM5.

<Second embodiment>

In the first embodiment, the stage movement errors of the measurement areas AS1 to AS5 are sequentially measured by changing the placement position of one reference board SP on the substrate stage 40 . In the second embodiment, by using a plurality of reference plates SPa (the reference plate SP can be used for the reference plate Spa), SPb, SPc, and SPd as shown in FIG. Measure.

In this case, the reference plates SPa to SPd are preferably regarded as having the same characteristics as the reference plate SP on the array of reference marks. In addition, it is desirable to have good flatness under the same material and the same plate thickness, so that there is no individual difference in the reference mark array photographed when placed on the substrate stage 40 .

The method of creating the calibration information for calibrating the driving accuracy of the substrate stage 40 according to the second embodiment is described with reference to FIG. 9 . Steps S201 to S203 are the same procedure as steps S101 to S103 of the first embodiment. Next, the reference boards Spa to SPd are respectively placed on the measurement areas AS2 to AS5 (step S204 ).

Next, as in step S105 to step S110 of the first embodiment, a correction map for each measurement area is created, and a correction map for the entire area AS of the substrate stage 40 is generated as in step S111 (step S205 to step S209 ).

According to the second embodiment, the reference plate placement to the substrate stage 40 is performed in one stage, and the mark position can be continuously measured, thereby improving workability. In addition, the time required for calibration can be shortened.

<The third embodiment>

Although in the second embodiment, the measurement of the platform movement error in the measurement areas AS2 to AS5 is performed continuously by using a plurality of reference plates Spa to SPd, in the third embodiment, the plurality of reference plates Fixed to 1 substrate and used as 1 reference plate.

Fig. 10 shows an example of the second reference board SP2. The second reference board SP2 is composed of a base material PB having the same size as the board placement surface of the board stage 40 , and four reference board parts PSP1 to PSP4 attached and fixed to the base material PB.

For the base material PB of the second reference board SP2, it is preferable to use a material having a thermal expansion coefficient close to that of the reference board members PSP1 to PSP4, such as ceramics.

The reference plate members PSP1 to PSP4 of the second reference plate SP2 are respectively formed with reference marks M2ij of the same shape in a two-dimensional matrix at the same pitch as the reference plate SP. The reference board parts PSP1 to PSP4 of the second reference board SP2 are preferably made of the same material and the same manufacturing method as the reference board SP.

The reference board parts PSP1 to PSP4 shown in Fig. 10 may have different adhesion errors due to procedures such as adhesion. Therefore, the second reference board SP2 cannot be used as a continuous reference board. Here, as in the second embodiment, for the reference board members PSP1 to PSP4, the placement errors on the substrate stage 40 are obtained, respectively, and the stage movement of each of the reference board members PSP1 to PSP4 is measured based on the respective placement errors. errors, thereby creating a correction map of the substrate platform 40 .

The method of creating the calibration information for calibrating the driving accuracy of the substrate stage 40 according to the third embodiment is described with reference to FIG. 11 . Steps S301 to S303 are the same procedure as steps S201 to S203 of the second embodiment. Next, the 2nd reference board SP2 is each mounted in the whole area AS (step S304). Next, as in steps S205 to S211 of the second embodiment, a correction map of each measurement area is created, and a correction map of the entire area AS of the substrate stage 40 is generated (steps S305 to S309 ).

According to the third embodiment, since it is possible to carry out the reference board placement on the substrate stage 40 at one time, workability is further improved. In addition, the time required for calibration can be shortened.

As described above, according to the present invention, using a reference plate smaller than the driving area of the platform, correction information for correcting the driving accuracy of the mobile platform can be established.

In addition, although the case where the moving stage is the substrate stage 40 has been described as an example, even the reticle stage 30 can also correct the driving accuracy in the same way. In this case, the imaging unit 37 is used to detect the mark of the reference plate placed on the reticle stage 30 .

In addition, although the case where the area of the substrate stage 40 divided into four is taken as the second measurement area is described as an example, the number and arrangement of divisions are not limited. For example, as shown in FIG. 12, the substrate stage 40 may be provided with a first measurement area AS1 in the center, second measurement areas AS2-AS5 partially overlapping with the first measurement area, and any of the second measurement areas AS2-AS5 A third measurement area AS6-AS13 is partially repeated. In this case, the calibration part 52 creates calibration information for revising the driving accuracy of the driving part based on the calibration maps CM1 - CM13 corresponding to the measurement areas AS1 - AS13 .

In addition, the application as an exposure apparatus is not limited to the exposure apparatus for semiconductor package manufacture, The exposure apparatus for liquid crystal display panels, the exposure apparatus for printed circuit boards, etc. are also widely applicable.

In addition, the exposure apparatus 10 is not limited to the projection exposure apparatus of embodiment, For example, even if it is a maskless exposure apparatus without a reticle, the present invention can be implemented. In addition, the present invention can also be used as a stage calibration system for devices other than exposure devices.

10‧‧‧Exposure device

20‧‧‧Light source

21‧‧‧Light Driver

22, 26‧‧‧Mirror

24‧‧‧Integrator

28‧‧‧Collimating Lens

30‧‧‧Reticle Platform

32, 42‧‧‧Platform Drive Department

34‧‧‧Projection Optical System

36, 37‧‧‧Photography Department

38‧‧‧Image Processing Department

40‧‧‧Substrate platform

43‧‧‧Measurement Department

50‧‧‧Control Department

51‧‧‧Memory Department

52‧‧‧Correction Department

R‧‧‧Reticles

W‧‧‧Substrate

Claims (10)

An exposure device, comprising a calibration part for establishing calibration information of the movement accuracy of a mobile platform with a reference plate, characterized by comprising: establishing first calibration information with the reference plate placed on a first measurement area of the mobile platform, and the calibration part for establishing the second calibration information by using the reference plate placed on at least one second measurement region that overlaps with the first measurement region; A detection part for the position of a plurality of marks on the reference plate of the platform, and the plurality of marks have a two-dimensional matrix-like position in which a row of m reference marks arranged in the X direction and a row of n reference marks arranged in the Y direction are perpendicular to each other relation. The exposure apparatus according to claim 1, wherein the correction section corrects the position of the mark placed in the second measurement area based on the position of the mark located in the overlapping area of the reference plate placed in the second measurement area The position error of the reference plate in the measurement area is measured to establish the second calibration information. The exposure apparatus according to claim 2, wherein the calibration unit establishes the first measurement area and the second measurement area corresponding to the mobile platform according to the first calibration information and the second calibration information The above correction information for the region combined with the region. The exposure apparatus according to claim 3, wherein the calibration section creates the second calibration information based on a plurality of the second measurement regions obtained by dividing the mounting surface of the mobile platform. According to the exposure device described in any one of items 1 to 4 of the scope of the patent application, Here, the correction unit creates a correction map for correcting the movement accuracy of the mobile platform based on the relationship between the detected marker position and the current position of the mobile platform. A platform calibration system, which is a platform calibration system for calibrating a mobile platform with a reference plate, is characterized by comprising: establishing first calibration information with the reference plate placed on the first measurement area of the mobile platform, and using the reference plate placed on the The above-mentioned first measurement area has at least one of the second measurement areas that overlaps the above-mentioned reference plate of the above-mentioned reference plate to establish the calibration part of the second calibration information; A detection unit for the position of a plurality of marks, and the plurality of marks have a two-dimensional matrix-like positional relationship in which a row of m reference marks arranged in the X direction and a row of n reference marks arranged in the Y direction are perpendicular to each other. A platform calibration method, which is characterized by comprising: a step of placing a reference plate on a first measurement area of a mobile platform; a step of detecting a position of a plurality of marks on the reference plate by a detection unit according to the movement of the mobile platform; a calibration unit The step of establishing first calibration information corresponding to the first measurement area from the positions of the plurality of marks; placing the reference plate on at least one second area of the overlapping area that partially overlaps with the first measurement area The step of measuring the area; the step of detecting the position of the above-mentioned plural marks according to the movement of the above-mentioned mobile platform; The calibration unit establishes second calibration information corresponding to the second measurement area from the positions of the plurality of marks; and the calibration unit establishes and corrects the movement accuracy of the mobile platform according to the first calibration information and the second calibration information Steps to correct the information for the degree. The platform calibration method according to claim 7, wherein the mobile platform has a plurality of the second measurement areas; in the step of placing the reference board on the second measurement area, the plurality of the second measurement areas are The reference board is placed on the above-mentioned mobile platform. The platform calibration method according to claim 8, further comprising: the detection unit detecting the position of the mark located in the overlapping area of the plurality of second measurement areas; and the correction unit according to the position of the mark The step of obtaining the mark position error of each reference plate placed in the second measurement area. A calibration jig is characterized by comprising: a plate-shaped base material; and a plurality of reference plates; wherein, the plurality of reference plates include a plurality of marks, and the plurality of marks can be respectively detected by a detection part on a mobile platform, And the above-mentioned plural marks have a 2-dimensional matrix-like positional relationship in which the row of m reference marks juxtaposed in the X direction and the row of n reference marks juxtaposed in the Y direction are perpendicular to each other; wherein when the above-mentioned substrate is placed on the above-mentioned moving platform , fix the plurality of reference plates to the base material in a manner corresponding to a plurality of measurement areas respectively; wherein, the size of the plurality of reference plates is larger than that of the drive of the mobile platform The area is still small.

Images