JP3931749B2 - 突起電極を有する半導体装置の製造方法 - Google Patents

突起電極を有する半導体装置の製造方法 Download PDF

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Publication number
JP3931749B2
JP3931749B2 JP2002199714A JP2002199714A JP3931749B2 JP 3931749 B2 JP3931749 B2 JP 3931749B2 JP 2002199714 A JP2002199714 A JP 2002199714A JP 2002199714 A JP2002199714 A JP 2002199714A JP 3931749 B2 JP3931749 B2 JP 3931749B2
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JP
Japan
Prior art keywords
protruding electrode
electrode
semiconductor device
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002199714A
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English (en)
Japanese (ja)
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JP2003086620A (ja
JP2003086620A5 (https=
Inventor
隆 大塚
和彦 松村
哲郎 河北
博昭 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2002199714A priority Critical patent/JP3931749B2/ja
Publication of JP2003086620A publication Critical patent/JP2003086620A/ja
Publication of JP2003086620A5 publication Critical patent/JP2003086620A5/ja
Application granted granted Critical
Publication of JP3931749B2 publication Critical patent/JP3931749B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Wire Bonding (AREA)
JP2002199714A 1996-02-23 2002-07-09 突起電極を有する半導体装置の製造方法 Expired - Fee Related JP3931749B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002199714A JP3931749B2 (ja) 1996-02-23 2002-07-09 突起電極を有する半導体装置の製造方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP3642996 1996-02-23
JP11608496 1996-05-10
JP8-116084 1996-05-10
JP8-116083 1996-05-10
JP11608396 1996-05-10
JP8-36429 1996-05-10
JP2002199714A JP3931749B2 (ja) 1996-02-23 2002-07-09 突起電極を有する半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP9016103A Division JPH1027824A (ja) 1996-02-23 1997-01-30 突起電極を有する半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2003086620A JP2003086620A (ja) 2003-03-20
JP2003086620A5 JP2003086620A5 (https=) 2004-12-02
JP3931749B2 true JP3931749B2 (ja) 2007-06-20

Family

ID=27460261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002199714A Expired - Fee Related JP3931749B2 (ja) 1996-02-23 2002-07-09 突起電極を有する半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP3931749B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4533804B2 (ja) 2005-06-02 2010-09-01 セイコーエプソン株式会社 半導体装置及びその製造方法
JP4821187B2 (ja) * 2005-06-30 2011-11-24 トヨタ自動車株式会社 燃料電池システム
JP5385471B2 (ja) * 2011-08-10 2014-01-08 新光電気工業株式会社 半導体装置の製造方法
JP5357241B2 (ja) 2011-08-10 2013-12-04 新光電気工業株式会社 半導体装置及び半導体装置の製造方法
CN103208501B (zh) * 2012-01-17 2017-07-28 奥林巴斯株式会社 固体摄像装置及其制造方法、摄像装置、基板、半导体装置
JP6021383B2 (ja) * 2012-03-30 2016-11-09 オリンパス株式会社 基板および半導体装置
KR102397018B1 (ko) * 2017-08-29 2022-05-17 한국전자통신연구원 반도체 패키지의 제조 방법
US12354988B2 (en) * 2022-05-16 2025-07-08 Northrop Grumman Systems Corporation Bump structures for low temperature chip bonding

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JP2003086620A (ja) 2003-03-20

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