JP3904737B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP3904737B2
JP3904737B2 JP23174098A JP23174098A JP3904737B2 JP 3904737 B2 JP3904737 B2 JP 3904737B2 JP 23174098 A JP23174098 A JP 23174098A JP 23174098 A JP23174098 A JP 23174098A JP 3904737 B2 JP3904737 B2 JP 3904737B2
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JP
Japan
Prior art keywords
input
output
signal
circuit
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23174098A
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English (en)
Japanese (ja)
Other versions
JP2000065900A (ja
JP2000065900A5 (enExample
Inventor
香織 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP23174098A priority Critical patent/JP3904737B2/ja
Priority to US09/233,209 priority patent/US6329669B1/en
Priority to KR10-1999-0013814A priority patent/KR100490495B1/ko
Publication of JP2000065900A publication Critical patent/JP2000065900A/ja
Publication of JP2000065900A5 publication Critical patent/JP2000065900A5/ja
Application granted granted Critical
Publication of JP3904737B2 publication Critical patent/JP3904737B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318566—Comparators; Diagnosing the device under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318572—Input/Output interfaces

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
JP23174098A 1998-08-18 1998-08-18 半導体装置及びその製造方法 Expired - Fee Related JP3904737B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP23174098A JP3904737B2 (ja) 1998-08-18 1998-08-18 半導体装置及びその製造方法
US09/233,209 US6329669B1 (en) 1998-08-18 1999-01-20 Semiconductor device able to test changeover circuit which switches connection between terminals
KR10-1999-0013814A KR100490495B1 (ko) 1998-08-18 1999-04-19 반도체 장치 및 반도체 장치의 테스트 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23174098A JP3904737B2 (ja) 1998-08-18 1998-08-18 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2000065900A JP2000065900A (ja) 2000-03-03
JP2000065900A5 JP2000065900A5 (enExample) 2005-09-29
JP3904737B2 true JP3904737B2 (ja) 2007-04-11

Family

ID=16928305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23174098A Expired - Fee Related JP3904737B2 (ja) 1998-08-18 1998-08-18 半導体装置及びその製造方法

Country Status (3)

Country Link
US (1) US6329669B1 (enExample)
JP (1) JP3904737B2 (enExample)
KR (1) KR100490495B1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101365956A (zh) * 2006-01-09 2009-02-11 Nxp股份有限公司 可测试的集成电路及集成电路的测试方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5772341A (en) * 1980-10-24 1982-05-06 Toshiba Corp Semiconductor integrated circuit device
JPH01111364A (ja) * 1987-10-24 1989-04-28 Nec Corp 半導体集積回路装置の信号切換回路
JP2672408B2 (ja) * 1991-03-19 1997-11-05 シャープ株式会社 半導体集積回路
JPH05264647A (ja) 1992-03-18 1993-10-12 Nec Corp 半導体装置のテスト回路
JP2869314B2 (ja) 1992-11-25 1999-03-10 松下電器産業株式会社 バウンダリースキャンセル回路，バウンダリースキャンテスト回路及びその使用方法
JP3099739B2 (ja) 1996-06-21 2000-10-16 日本電気株式会社 半導体記憶装置
JPH10303366A (ja) * 1997-04-30 1998-11-13 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
KR20000016855A (ko) 2000-03-25
US6329669B1 (en) 2001-12-11
KR100490495B1 (ko) 2005-05-19
JP2000065900A (ja) 2000-03-03

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