JP3899319B2 - 液処理装置及び液処理方法 - Google Patents

液処理装置及び液処理方法 Download PDF

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Publication number
JP3899319B2
JP3899319B2 JP2003005839A JP2003005839A JP3899319B2 JP 3899319 B2 JP3899319 B2 JP 3899319B2 JP 2003005839 A JP2003005839 A JP 2003005839A JP 2003005839 A JP2003005839 A JP 2003005839A JP 3899319 B2 JP3899319 B2 JP 3899319B2
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Japan
Prior art keywords
cleaning liquid
substrate
discharge port
liquid
cleaning
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Expired - Fee Related
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JP2003005839A
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English (en)
Japanese (ja)
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JP2004221244A (ja
JP2004221244A5 (enrdf_load_stackoverflow
Inventor
憲 西屋
和生 坂本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2003005839A priority Critical patent/JP3899319B2/ja
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Publication of JP2004221244A5 publication Critical patent/JP2004221244A5/ja
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  • Coating Apparatus (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
JP2003005839A 2003-01-14 2003-01-14 液処理装置及び液処理方法 Expired - Fee Related JP3899319B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003005839A JP3899319B2 (ja) 2003-01-14 2003-01-14 液処理装置及び液処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003005839A JP3899319B2 (ja) 2003-01-14 2003-01-14 液処理装置及び液処理方法

Publications (3)

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JP2004221244A JP2004221244A (ja) 2004-08-05
JP2004221244A5 JP2004221244A5 (enrdf_load_stackoverflow) 2005-07-28
JP3899319B2 true JP3899319B2 (ja) 2007-03-28

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JP2003005839A Expired - Fee Related JP3899319B2 (ja) 2003-01-14 2003-01-14 液処理装置及び液処理方法

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JP (1) JP3899319B2 (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090081810A1 (en) * 2004-10-06 2009-03-26 Ebara Corporation Substrate processing apparatus and substrate processing method
JP4684858B2 (ja) * 2005-11-10 2011-05-18 東京エレクトロン株式会社 リンス処理方法、現像処理方法、現像処理装置、制御プログラムおよびコンピュータ読取可能な記憶媒体
JP2007220956A (ja) * 2006-02-17 2007-08-30 Toshiba Corp 基板処理方法及び基板処理装置
JP4755573B2 (ja) 2006-11-30 2011-08-24 東京応化工業株式会社 処理装置および処理方法、ならびに表面処理治具
KR101253499B1 (ko) 2006-12-26 2013-04-11 주식회사 케이씨텍 약액 도포모듈 및 이를 이용한 약액 도포장치
JP5286857B2 (ja) * 2008-03-18 2013-09-11 トヨタ自動車株式会社 塗工ヘッド、塗工装置、およびメタルセパレータ基板の製造方法
US7849554B2 (en) 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
JP5451662B2 (ja) * 2011-02-15 2014-03-26 東京エレクトロン株式会社 液処理装置及び液処理方法
JP5227441B2 (ja) * 2011-04-18 2013-07-03 東京応化工業株式会社 処理装置
JP5838067B2 (ja) 2011-10-05 2015-12-24 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 塗布方法および塗布装置
DE102013003688A1 (de) * 2012-10-26 2014-04-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Kombinationsdüse sowie Vorrichtung für den Auftrag eines viskosen Materials auf eine Bauteilkante
JP6275984B2 (ja) * 2013-09-27 2018-02-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI569349B (zh) 2013-09-27 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
JP6443243B2 (ja) * 2015-06-30 2018-12-26 東京エレクトロン株式会社 基板処理方法
JP6443242B2 (ja) * 2015-06-30 2018-12-26 東京エレクトロン株式会社 ノズル、処理液供給装置、液処理装置、及び処理液供給方法
KR101842125B1 (ko) * 2015-12-28 2018-05-14 세메스 주식회사 기판 처리 장치 및 방법
JP7236318B2 (ja) * 2019-04-26 2023-03-09 東京エレクトロン株式会社 液処理装置、及び液処理方法

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JP2004221244A (ja) 2004-08-05

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