JP3875519B2 - フォトレジスト組成物、フォトレジストパターン形成方法、及び、半導体素子の製造方法 - Google Patents

フォトレジスト組成物、フォトレジストパターン形成方法、及び、半導体素子の製造方法 Download PDF

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Publication number
JP3875519B2
JP3875519B2 JP2001200816A JP2001200816A JP3875519B2 JP 3875519 B2 JP3875519 B2 JP 3875519B2 JP 2001200816 A JP2001200816 A JP 2001200816A JP 2001200816 A JP2001200816 A JP 2001200816A JP 3875519 B2 JP3875519 B2 JP 3875519B2
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Japan
Prior art keywords
photoresist
photoresist composition
forming
hept
pattern
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Expired - Fee Related
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JP2001200816A
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English (en)
Japanese (ja)
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JP2002082440A5 (enExample
JP2002082440A (ja
Inventor
載昌 鄭
根守 李
▲みん▼鎬 鄭
基鎬 白
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SK Hynix Inc
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Hynix Semiconductor Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/115—Cationic or anionic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/124—Carbonyl compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/126—Halogen compound containing

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP2001200816A 2000-06-30 2001-07-02 フォトレジスト組成物、フォトレジストパターン形成方法、及び、半導体素子の製造方法 Expired - Fee Related JP3875519B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020000037228A KR100583095B1 (ko) 2000-06-30 2000-06-30 광산 발생제와 함께 광 라디칼 발생제(ｐｒｇ)를 포함하는포토레지스트 조성물
KR2000-37228 2000-06-30

Publications (3)

Publication Number Publication Date
JP2002082440A JP2002082440A (ja) 2002-03-22
JP2002082440A5 JP2002082440A5 (enExample) 2005-04-07
JP3875519B2 true JP3875519B2 (ja) 2007-01-31

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JP2001200816A Expired - Fee Related JP3875519B2 (ja) 2000-06-30 2001-07-02 フォトレジスト組成物、フォトレジストパターン形成方法、及び、半導体素子の製造方法

Country Status (7)

Country Link
US (1) US6692891B2 (enExample)
JP (1) JP3875519B2 (enExample)
KR (1) KR100583095B1 (enExample)
CN (1) CN1241065C (enExample)
DE (1) DE10131123A1 (enExample)
GB (1) GB2364392B (enExample)
TW (1) TWI225967B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012230320A (ja) * 2011-04-27 2012-11-22 Nissan Chem Ind Ltd 光ラジカル重合開始剤を含む感光性レジスト下層膜形成組成物

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101952269B (zh) * 2007-10-10 2014-06-25 巴斯夫欧洲公司 锍盐引发剂
JP5834630B2 (ja) * 2011-02-04 2015-12-24 日立化成株式会社 樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
DE112011105280B4 (de) 2011-05-23 2017-02-02 Otis Elevator Company Polygon-Kompensationskopplung für ketten- und zahnradgetriebene Systeme
EP2791187A4 (en) * 2011-12-16 2015-07-15 Univ Akron SUBSTITUTED PHENACYLMOLECULES AND LIGHT-SENSITIVE POLYMERS
JP5772642B2 (ja) * 2012-02-09 2015-09-02 Jsr株式会社 硬化性樹脂組成物、表示素子用硬化膜、表示素子用硬化膜の形成方法及び表示素子
WO2013119134A1 (en) * 2012-10-16 2013-08-15 Eugen Pavel Photoresist with rare-earth sensitizers
MY201381A (en) 2013-02-12 2024-02-21 Carbon3D Inc Continuous liquid interphase printing
JP6423801B2 (ja) 2013-02-12 2018-11-14 カーボン，インコーポレイテッド ３次元製作のための方法および装置
WO2015142546A1 (en) 2014-03-21 2015-09-24 Carbon3D, Inc. Method and apparatus for three-dimensional fabrication with gas injection through carrier
US10259171B2 (en) 2014-04-25 2019-04-16 Carbon, Inc. Continuous three dimensional fabrication from immiscible liquids
WO2015195920A1 (en) 2014-06-20 2015-12-23 Carbon3D, Inc. Three-dimensional printing method using increased light intensity and apparatus therefore
US10569465B2 (en) 2014-06-20 2020-02-25 Carbon, Inc. Three-dimensional printing using tiled light engines
AU2015277034B2 (en) 2014-06-20 2019-07-11 Carbon, Inc. Three-dimensional printing with reciprocal feeding of polymerizable liquid
MX2016016630A (es) 2014-06-23 2017-06-06 Carbon Inc Metodos para producir objetos tridimensionales de poliuretano a partir de materiales que tienen multiples mecanismos de endurecimiento.
US11390062B2 (en) 2014-08-12 2022-07-19 Carbon, Inc. Three-dimensional printing with supported build plates
WO2016109550A1 (en) 2014-12-31 2016-07-07 Carbon3D, Inc. Three-dimensional printing of objects with breathing orifices
US20160193786A1 (en) 2015-01-06 2016-07-07 Carbon3D, Inc. Three-dimensional printing with build plates having a rough or patterned surface and related methods
WO2016112090A1 (en) 2015-01-07 2016-07-14 Carbon3D, Inc. Microfluidic devices and methods of making the same
EP3245044B1 (en) 2015-01-13 2021-05-05 Carbon, Inc. Three-dimensional printing with build plates having surface topologies for increasing permeability and related methods
US11020898B2 (en) 2015-01-30 2021-06-01 Carbon, Inc. Build plates for continuous liquid interface printing having permeable base and adhesive for increasing permeability and related methods, systems and devices
WO2016123506A1 (en) 2015-01-30 2016-08-04 Carbon3D, Inc. Build plates for continuous liquid interface printing having permeable sheets and related methods, systems and devices
EP3253558B1 (en) 2015-02-05 2020-04-08 Carbon, Inc. Method of additive manufacturing by fabrication through multiple zones
WO2016133759A1 (en) 2015-02-20 2016-08-25 Carbon3D, Inc. Methods and apparatus for continuous liquid interface printing with electrochemically supported dead zone
US20180029292A1 (en) 2015-03-05 2018-02-01 Carbon, Inc. Continuous liquid interface production with sequential patterned exposure
US10391711B2 (en) 2015-03-05 2019-08-27 Carbon, Inc. Fabrication of three dimensional objects with multiple operating modes
US20180015662A1 (en) 2015-03-05 2018-01-18 Carbon, Inc. Fabrication of three dimensional objects with variable slice thickness
WO2016145050A1 (en) 2015-03-10 2016-09-15 Carbon3D, Inc. Microfluidic devices having flexible features and methods of making the same
WO2016145182A1 (en) 2015-03-12 2016-09-15 Carbon3D, Inc. Additive manufacturing using polymerization initiators or inhibitors having controlled migration
WO2016149151A1 (en) 2015-03-13 2016-09-22 Carbon3D, Inc. Three-dimensional printing with concurrent delivery of different polymerizable liquids
WO2016149097A1 (en) 2015-03-13 2016-09-22 Carbon3D, Inc. Three-dimensional printing with reduced pressure build plate unit
WO2016149104A1 (en) 2015-03-13 2016-09-22 Carbon3D, Inc. Three-dimensional printing with flexible build plates
WO2017048710A1 (en) 2015-09-14 2017-03-23 Carbon, Inc. Light-curable article of manufacture with portions of differing solubility
US11220051B2 (en) 2015-09-25 2022-01-11 Carbon, Inc. Build plate assemblies for continuous liquid interphase printing having lighting panels and related methods, systems and devices
WO2017059082A1 (en) 2015-09-30 2017-04-06 Carbon, Inc. Method and apparatus for producing three-dimensional objects
US12010287B2 (en) 2015-10-09 2024-06-11 Southern Methodist University System and method for a three-dimensional optical switch display device
US10647873B2 (en) 2015-10-30 2020-05-12 Carbon, Inc. Dual cure article of manufacture with portions of differing solubility
US10538031B2 (en) 2015-12-22 2020-01-21 Carbon, Inc. Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products
WO2017112521A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Production of flexible products by additive manufacturing with dual cure resins
WO2017112682A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Fabrication of compound products from multiple intermediates by additive manufacturing with dual cure resins
CN108139665B (zh) 2015-12-22 2022-07-05 卡本有限公司 用于用双重固化树脂的增材制造的双重前体树脂系统
WO2017112483A2 (en) 2015-12-22 2017-06-29 Carbon, Inc. Accelerants for additive manufacturing with dual cure resins
EP3463820A4 (en) 2016-05-31 2020-04-08 Northwestern University METHOD FOR MANUFACTURING THREE-DIMENSIONAL OBJECTS AND APPARATUS THEREOF
CN211105627U (zh) 2016-07-01 2020-07-28 卡本有限公司 用于三维打印机的构造板、构造板组件和用于由可聚合液体形成三维物体的装置
WO2018094131A1 (en) 2016-11-21 2018-05-24 Carbon, Inc. Method of making three-dimensional object by delivering reactive component for subsequent cure
US10239255B2 (en) 2017-04-11 2019-03-26 Molecule Corp Fabrication of solid materials or films from a polymerizable liquid
EP3597694B1 (en) * 2018-07-17 2023-10-11 Shin-Etsu Chemical Co., Ltd. Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, and black matrix
NL2022372B1 (en) 2018-12-17 2020-07-03 What The Future Venture Capital Wtfvc B V Process for producing a cured 3d product
WO2020185692A2 (en) 2019-03-07 2020-09-17 Northwestern University Rapid, large volume, dead layer-free 3d printing
KR20220016453A (ko) 2019-04-09 2022-02-09 아줄 쓰리디, 인크. 적층 제조에 의해 생성되는 부분들을 신속하게 경화시키고 코팅하는 방법론들

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US245029A (en) * 1881-08-02 Sole-fastening staple
US4245029A (en) * 1979-08-20 1981-01-13 General Electric Company Photocurable compositions using triarylsulfonium salts
US4968582A (en) * 1988-06-28 1990-11-06 Mcnc And University Of Nc At Charlotte Photoresists resistant to oxygen plasmas
DE69128274T2 (de) * 1990-11-05 1998-04-23 Ciba Geigy Ag Photopolymerisierbare Zusammensetzungen
JPH04349463A (ja) * 1991-05-27 1992-12-03 Nippon Telegr & Teleph Corp <Ntt> ポジ型レジスト材料
US5393642A (en) * 1992-12-31 1995-02-28 The University Of North Carolina At Charlotte Ionic modification of organic resins and photoresists to produce photoactive etch resistant compositions
WO1997033198A1 (en) * 1996-03-07 1997-09-12 The B.F. Goodrich Company Photoresist compositions comprising polycyclic polymers with acid labile pendant groups
KR100265597B1 (ko) * 1996-12-30 2000-09-15 김영환 Arf 감광막 수지 및 그 제조방법
JP3802179B2 (ja) * 1997-02-07 2006-07-26 富士写真フイルム株式会社 ポジ型フォトレジスト組成物
JP3832013B2 (ja) 1997-03-17 2006-10-11 Ｊｓｒ株式会社 プラズマディスプレイパネル用螢光面の形成方法
JPH1195435A (ja) * 1997-09-17 1999-04-09 Fuji Photo Film Co Ltd ポジ型感光性着色組成物
JPH11305433A (ja) * 1998-04-21 1999-11-05 Toppan Printing Co Ltd 感光性組成物、感光性着色組成物及びその感光性着色組成物を用いたカラーフィルタ
KR100279497B1 (ko) * 1998-07-16 2001-02-01 박찬구 술포늄 염의 제조방법
KR20000056355A (ko) * 1999-02-19 2000-09-15 김영환 고농도의 아민 존재하에서 우수한 특성을 갖는 포토레지스트 조성물
KR100481601B1 (ko) * 1999-09-21 2005-04-08 주식회사 하이닉스반도체 광산 발생제와 함께 광염기 발생제를 포함하는 포토레지스트 조성물

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012230320A (ja) * 2011-04-27 2012-11-22 Nissan Chem Ind Ltd 光ラジカル重合開始剤を含む感光性レジスト下層膜形成組成物

Also Published As

Publication number Publication date
GB2364392A (en) 2002-01-23
GB0114259D0 (en) 2001-08-01
US6692891B2 (en) 2004-02-17
KR20020002877A (ko) 2002-01-10
GB2364392B (en) 2004-08-18
US20020012873A1 (en) 2002-01-31
CN1330288A (zh) 2002-01-09
DE10131123A1 (de) 2002-02-14
TWI225967B (en) 2005-01-01
KR100583095B1 (ko) 2006-05-24
JP2002082440A (ja) 2002-03-22
CN1241065C (zh) 2006-02-08

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