JP3861537B2 - 接着フィルムの真空積層法 - Google Patents
接着フィルムの真空積層法 Download PDFInfo
- Publication number
- JP3861537B2 JP3861537B2 JP34371099A JP34371099A JP3861537B2 JP 3861537 B2 JP3861537 B2 JP 3861537B2 JP 34371099 A JP34371099 A JP 34371099A JP 34371099 A JP34371099 A JP 34371099A JP 3861537 B2 JP3861537 B2 JP 3861537B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- resin composition
- adhesive film
- base film
- composition layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002313 adhesive film Substances 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 20
- 238000003475 lamination Methods 0.000 title description 4
- 239000011342 resin composition Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000010030 laminating Methods 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 10
- 229920001971 elastomer Polymers 0.000 claims description 7
- 238000009499 grossing Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 239000005060 rubber Substances 0.000 claims description 7
- 238000004049 embossing Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 34
- -1 polyethylene Polymers 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000004020 conductor Substances 0.000 description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- XKENEFKGZRRAGI-UHFFFAOYSA-N C1=CN=NN=C1.O=C1NC(=O)NC(=O)N1 Chemical compound C1=CN=NN=C1.O=C1NC(=O)NC(=O)N1 XKENEFKGZRRAGI-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34371099A JP3861537B2 (ja) | 1998-12-02 | 1999-12-02 | 接着フィルムの真空積層法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-342413 | 1998-12-02 | ||
| JP34241398 | 1998-12-02 | ||
| JP34371099A JP3861537B2 (ja) | 1998-12-02 | 1999-12-02 | 接着フィルムの真空積層法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005367788A Division JP2006173638A (ja) | 1998-12-02 | 2005-12-21 | 接着フィルムの真空積層法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000228581A JP2000228581A (ja) | 2000-08-15 |
| JP2000228581A5 JP2000228581A5 (enrdf_load_stackoverflow) | 2006-02-16 |
| JP3861537B2 true JP3861537B2 (ja) | 2006-12-20 |
Family
ID=26577256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34371099A Expired - Lifetime JP3861537B2 (ja) | 1998-12-02 | 1999-12-02 | 接着フィルムの真空積層法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3861537B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030056819A (ko) * | 2001-12-28 | 2003-07-04 | 삼성전기주식회사 | 필름형태의 절연재를 적층하는 방법 |
| KR100514610B1 (ko) * | 2002-06-24 | 2005-09-13 | 삼신써키트 주식회사 | 양면 노출형 연성 인쇄 회로기판 제조 방법 |
| JP4577613B2 (ja) * | 2005-06-22 | 2010-11-10 | 株式会社名機製作所 | ビルドアップ基板を積層成形するための積層成形装置および積層成形方法 |
| WO2009035014A1 (ja) * | 2007-09-11 | 2009-03-19 | Ajinomoto Co., Inc. | 多層プリント配線板の製造方法 |
| CN101803485B (zh) * | 2007-09-14 | 2012-01-25 | 味之素株式会社 | 多层印刷电路板的制造方法 |
-
1999
- 1999-12-02 JP JP34371099A patent/JP3861537B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000228581A (ja) | 2000-08-15 |
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