JP3844608B2 - 真空成膜装置 - Google Patents

真空成膜装置 Download PDF

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Publication number
JP3844608B2
JP3844608B2 JP28962498A JP28962498A JP3844608B2 JP 3844608 B2 JP3844608 B2 JP 3844608B2 JP 28962498 A JP28962498 A JP 28962498A JP 28962498 A JP28962498 A JP 28962498A JP 3844608 B2 JP3844608 B2 JP 3844608B2
Authority
JP
Japan
Prior art keywords
substrate
chamber
vacuum
plate
film forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP28962498A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000119848A (ja
Inventor
政輔 末代
重光 佐藤
弘樹 大空
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP28962498A priority Critical patent/JP3844608B2/ja
Priority to KR10-1999-0043798A priority patent/KR100508744B1/ko
Priority to TW088117608A priority patent/TW439100B/zh
Publication of JP2000119848A publication Critical patent/JP2000119848A/ja
Application granted granted Critical
Publication of JP3844608B2 publication Critical patent/JP3844608B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C23C16/463—Cooling of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
JP28962498A 1998-10-12 1998-10-12 真空成膜装置 Expired - Fee Related JP3844608B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP28962498A JP3844608B2 (ja) 1998-10-12 1998-10-12 真空成膜装置
KR10-1999-0043798A KR100508744B1 (ko) 1998-10-12 1999-10-11 진공 막형성장치
TW088117608A TW439100B (en) 1998-10-12 1999-10-12 Vacuum film forming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28962498A JP3844608B2 (ja) 1998-10-12 1998-10-12 真空成膜装置

Publications (2)

Publication Number Publication Date
JP2000119848A JP2000119848A (ja) 2000-04-25
JP3844608B2 true JP3844608B2 (ja) 2006-11-15

Family

ID=17745653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28962498A Expired - Fee Related JP3844608B2 (ja) 1998-10-12 1998-10-12 真空成膜装置

Country Status (3)

Country Link
JP (1) JP3844608B2 (ko)
KR (1) KR100508744B1 (ko)
TW (1) TW439100B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5021112B2 (ja) 2000-08-11 2012-09-05 キヤノンアネルバ株式会社 真空処理装置
JP6024372B2 (ja) 2012-10-12 2016-11-16 Tdk株式会社 基板処理装置および基板処理チャンバモジュール
CN110323161B (zh) * 2018-03-30 2023-06-06 芝浦机械电子株式会社 有机膜形成装置以及有机膜制造方法
CN110616406A (zh) * 2018-11-29 2019-12-27 爱发科豪威光电薄膜科技(深圳)有限公司 磁控溅射镀膜机

Also Published As

Publication number Publication date
KR20000028980A (ko) 2000-05-25
JP2000119848A (ja) 2000-04-25
KR100508744B1 (ko) 2005-08-17
TW439100B (en) 2001-06-07

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