JP3804049B2 - 回路基板の検査装置および検査方法 - Google Patents

回路基板の検査装置および検査方法 Download PDF

Info

Publication number
JP3804049B2
JP3804049B2 JP2002020984A JP2002020984A JP3804049B2 JP 3804049 B2 JP3804049 B2 JP 3804049B2 JP 2002020984 A JP2002020984 A JP 2002020984A JP 2002020984 A JP2002020984 A JP 2002020984A JP 3804049 B2 JP3804049 B2 JP 3804049B2
Authority
JP
Japan
Prior art keywords
wiring
inspected
circuit board
wirings
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002020984A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002372563A5 (https=
JP2002372563A (ja
Inventor
嘉雄 辻
正良 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Advance Technology Corp
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2002020984A priority Critical patent/JP3804049B2/ja
Publication of JP2002372563A publication Critical patent/JP2002372563A/ja
Publication of JP2002372563A5 publication Critical patent/JP2002372563A5/ja
Application granted granted Critical
Publication of JP3804049B2 publication Critical patent/JP3804049B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
JP2002020984A 2001-04-10 2002-01-30 回路基板の検査装置および検査方法 Expired - Fee Related JP3804049B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002020984A JP3804049B2 (ja) 2001-04-10 2002-01-30 回路基板の検査装置および検査方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-111133 2001-04-10
JP2001111133 2001-04-10
JP2002020984A JP3804049B2 (ja) 2001-04-10 2002-01-30 回路基板の検査装置および検査方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006067137A Division JP3934665B2 (ja) 2001-04-10 2006-03-13 回路基板の検査装置および検査方法

Publications (3)

Publication Number Publication Date
JP2002372563A JP2002372563A (ja) 2002-12-26
JP2002372563A5 JP2002372563A5 (https=) 2004-10-28
JP3804049B2 true JP3804049B2 (ja) 2006-08-02

Family

ID=26613353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002020984A Expired - Fee Related JP3804049B2 (ja) 2001-04-10 2002-01-30 回路基板の検査装置および検査方法

Country Status (1)

Country Link
JP (1) JP3804049B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4287255B2 (ja) * 2003-11-27 2009-07-01 日本電産リード株式会社 基板検査装置及び基板検査方法
KR101376935B1 (ko) * 2012-10-31 2014-03-20 삼성전기주식회사 비접촉식 전기검사장치 및 전기검사방법
CN119689142B (zh) * 2025-02-21 2025-05-06 深检集团(东莞)质量技术服务有限公司 一种电子产品稳定性的测试方法

Also Published As

Publication number Publication date
JP2002372563A (ja) 2002-12-26

Similar Documents

Publication Publication Date Title
KR100877243B1 (ko) 회로 기판 검사 장치 및 회로 기판을 검사하기 위한 방법
US4771230A (en) Electro-luminescent method and testing system for unpopulated printed circuit boards, ceramic substrates, and the like having both electrical and electro-optical read-out
JPH03135778A (ja) 電気回路の開路／短絡試験を非接触に行う方法及び装置
US4884026A (en) Electrical characteristic measuring apparatus
JPH06213955A (ja) テストプローブ
JP3165056B2 (ja) 基板検査装置および基板検査方法
JP3804049B2 (ja) 回路基板の検査装置および検査方法
JP3934665B2 (ja) 回路基板の検査装置および検査方法
JP3804046B2 (ja) 回路基板の検査装置および検査方法
JP2006029997A (ja) 基板検査装置及び基板検査方法
US7202690B2 (en) Substrate inspection device and substrate inspecting method
KR20090031663A (ko) 기판 검사 방법 및 기판 검사 장치
JP4287255B2 (ja) 基板検査装置及び基板検査方法
JP4181019B2 (ja) 基板検査装置及び基板検査方法
JP3804047B2 (ja) 回路基板の検査装置および検査方法
KR20150130506A (ko) 기판 검사 방법
JP2008292372A (ja) 検査支援システムを搭載する回路検査装置とその検査支援方法
JP3934664B2 (ja) 回路基板の検査装置および検査方法
JP3076245B2 (ja) 検査ピンおよび検査装置
JP2004361249A (ja) 基板検査装置
JP2006184291A (ja) 回路基板の検査装置および検査方法
JP3227207B2 (ja) 半導体装置およびその測定方法
TWI919154B (zh) 使晶圓接地之方法及其相關非暫時性電腦可讀媒體
JPH07287042A (ja) インサーキット検査方法
US20020140443A1 (en) Method and apparatus for inspecting conductive pattern

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060111

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060313

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20060425

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20060428

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100519

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110519

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110519

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120519

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees