JP3708102B2 - レーザ加工装置 - Google Patents
レーザ加工装置 Download PDFInfo
- Publication number
- JP3708102B2 JP3708102B2 JP2003415142A JP2003415142A JP3708102B2 JP 3708102 B2 JP3708102 B2 JP 3708102B2 JP 2003415142 A JP2003415142 A JP 2003415142A JP 2003415142 A JP2003415142 A JP 2003415142A JP 3708102 B2 JP3708102 B2 JP 3708102B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- optical system
- laser head
- main body
- system main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims abstract description 58
- 230000003287 optical effect Effects 0.000 claims abstract description 88
- 238000001816 cooling Methods 0.000 claims abstract description 38
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 37
- 238000012937 correction Methods 0.000 description 28
- 238000005259 measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/703—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Laser Surgery Devices (AREA)
Description
Claims (3)
- 加工対象物にレーザ光を照射して前記加工対象物を加工するレーザ加工装置であって、
レーザ光を出射するレーザヘッドと、
前記レーザヘッドを保持すると共に、前記レーザヘッドを冷却する冷却ジャケットと、
前記レーザヘッドから出射されたレーザ光を所定の特性に調整する光学系本体部と、
前記レーザヘッドの光軸及び前記光学系本体部の光軸上において前記冷却ジャケットと前記光学系本体部との間に配置され、前記レーザヘッドの光軸が前記光学系本体部の光軸と一致するように前記光学系本体部に対して前記冷却ジャケットの位置及び傾きを調整するための調整部と、
を備えることを特徴とするレーザ加工装置。
- 前記冷却ジャケットは、前記レーザヘッドから出射されたレーザ光の光路を開閉するシャッタユニットを保持すると共に、前記シャッタユニットを冷却することを特徴とする請求項1に記載のレーザ加工装置。
- 前記光学系本体部は、
前記レーザヘッドから出射された前記レーザ光のビームサイズを調整するビームエキスパンダと、
前記加工対象物を観察するための加工対象物観察光学系と、
前記レーザ光を前記加工対象物に集光する加工用対物レンズと、
を有することを特徴とする請求項1又は2に記載のレーザ加工装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003415142A JP3708102B2 (ja) | 2003-12-12 | 2003-12-12 | レーザ加工装置 |
CN2004800369097A CN1890048B (zh) | 2003-12-12 | 2004-12-06 | 激光加工装置 |
KR1020067012960A KR101167328B1 (ko) | 2003-12-12 | 2004-12-06 | 레이저 가공 장치 |
AT04820181T ATE524267T1 (de) | 2003-12-12 | 2004-12-06 | Laserbearbeitungsvorrichtung |
PCT/JP2004/018157 WO2005056229A1 (ja) | 2003-12-12 | 2004-12-06 | レーザ加工装置 |
EP04820181A EP1700666B1 (en) | 2003-12-12 | 2004-12-06 | Laser processing device |
US10/582,332 US7777772B2 (en) | 2003-12-12 | 2004-12-06 | Laser processing device |
TW093137879A TWI309186B (en) | 2003-12-12 | 2004-12-08 | Laser working device |
MYPI20045118A MY135053A (en) | 2003-12-12 | 2004-12-10 | Laser processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003415142A JP3708102B2 (ja) | 2003-12-12 | 2003-12-12 | レーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005169476A JP2005169476A (ja) | 2005-06-30 |
JP3708102B2 true JP3708102B2 (ja) | 2005-10-19 |
Family
ID=34675121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003415142A Expired - Fee Related JP3708102B2 (ja) | 2003-12-12 | 2003-12-12 | レーザ加工装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7777772B2 (ja) |
EP (1) | EP1700666B1 (ja) |
JP (1) | JP3708102B2 (ja) |
KR (1) | KR101167328B1 (ja) |
CN (1) | CN1890048B (ja) |
AT (1) | ATE524267T1 (ja) |
MY (1) | MY135053A (ja) |
TW (1) | TWI309186B (ja) |
WO (1) | WO2005056229A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7777772B2 (en) | 2003-12-12 | 2010-08-17 | Hamamatsu Photonics K.K. | Laser processing device |
US8436273B2 (en) | 2007-07-18 | 2013-05-07 | Hamamatsu Photonics K.K. | Machining information supply equipment and supply system |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5239151B2 (ja) * | 2006-12-07 | 2013-07-17 | コニカミノルタエムジー株式会社 | インクジェット記録装置 |
KR101051823B1 (ko) * | 2009-10-19 | 2011-07-25 | 윤태중 | 도광판 가공용 레이저 발생 장치 |
CN101804519B (zh) * | 2010-03-18 | 2013-05-29 | 张文武 | 激光加工头 |
KR100998484B1 (ko) * | 2010-07-07 | 2010-12-06 | 레이져라이팅(주) | 레이저 빔의 광경로 거리가 일정한 도광판 레이저 가공장치 |
KR101425493B1 (ko) * | 2012-12-26 | 2014-08-04 | 주식회사 이오테크닉스 | 레이저 가공 방법 및 이를 적용하는 장치 |
CN105458501A (zh) * | 2015-12-29 | 2016-04-06 | 苏州润昇精密机械有限公司 | 具有断电保护功能的激光焊接机 |
JP6684472B2 (ja) * | 2016-08-09 | 2020-04-22 | ブラザー工業株式会社 | レーザ加工装置 |
KR102134461B1 (ko) * | 2018-07-09 | 2020-07-15 | 주식회사기성이엔지 | 열연 코일용 레이저 마킹장치 |
JP7269820B2 (ja) * | 2019-08-01 | 2023-05-09 | 能美防災株式会社 | 視野確認器 |
GB201913629D0 (en) * | 2019-09-20 | 2019-11-06 | Alltec Angewandte Laserlicht Tech Gmbh | Electromagnetic radiation system |
DE102019220263A1 (de) * | 2019-12-19 | 2021-06-24 | MTU Aero Engines AG | Anordnungsvorrichtung, die an einem Laserschweißkopf zum Laserauftragsschweißen eines Objekts entfernbar anordenbar ist |
CN111975223A (zh) * | 2020-08-28 | 2020-11-24 | 东莞市耀霆五金机械有限公司 | 一种3d数控激光切割机 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5729999Y2 (ja) * | 1975-03-25 | 1982-06-30 | ||
JPH02207992A (ja) | 1989-02-06 | 1990-08-17 | Mitsubishi Heavy Ind Ltd | レーザ加工機の光学ヘッド |
JP2723320B2 (ja) * | 1989-12-19 | 1998-03-09 | 株式会社東芝 | レーザ装置 |
JPH04244910A (ja) * | 1991-01-31 | 1992-09-01 | Nec Corp | 高さ検出装置 |
JP3170023B2 (ja) * | 1992-02-27 | 2001-05-28 | ホーヤ株式会社 | レーザ加工装置 |
JPH05261575A (ja) | 1992-03-16 | 1993-10-12 | Hitachi Constr Mach Co Ltd | パルスレーザ加工機 |
JP2781718B2 (ja) | 1993-10-19 | 1998-07-30 | ミヤチテクノス株式会社 | Yagレーザ加工機 |
US5580471A (en) * | 1994-03-30 | 1996-12-03 | Panasonic Technologies, Inc. | Apparatus and method for material treatment and inspection using fiber-coupled laser diode |
JPH08335732A (ja) | 1995-06-08 | 1996-12-17 | Olympus Optical Co Ltd | レーザ光源の取付角度調整機構 |
JP2746254B2 (ja) | 1996-04-16 | 1998-05-06 | 住友電気工業株式会社 | レーザ加工ヘッド |
JPH1034368A (ja) * | 1996-07-18 | 1998-02-10 | Mitsubishi Electric Corp | レーザ加工機 |
JP4273542B2 (ja) * | 1998-09-08 | 2009-06-03 | トヨタ自動車株式会社 | レーザー溶接方法 |
US6332276B1 (en) * | 2000-03-30 | 2001-12-25 | Ronnie L. Mangel | Articulate laser degree finder |
US6501772B1 (en) * | 2000-08-11 | 2002-12-31 | Litton Systems, Inc. | Microlaser assembly having a microresonator and aligned electro-optic components |
JP3983024B2 (ja) | 2001-10-12 | 2007-09-26 | 株式会社トプコン | レーザ発振装置 |
JP3563384B2 (ja) | 2001-11-08 | 2004-09-08 | 大日本スクリーン製造株式会社 | 画像記録装置 |
JP2003158315A (ja) * | 2001-11-20 | 2003-05-30 | Miyachi Technos Corp | レーザ発振器の保持構造 |
JP2003225786A (ja) * | 2002-01-30 | 2003-08-12 | Uht Corp | レーザー加工ユニット及び該レーザー加工ユニットを備えた加工装置 |
JP3734812B2 (ja) * | 2003-11-04 | 2006-01-11 | 浜松ホトニクス株式会社 | シャッタユニット及びそれを用いたレーザ加工装置 |
JP3708102B2 (ja) * | 2003-12-12 | 2005-10-19 | 浜松ホトニクス株式会社 | レーザ加工装置 |
JP3708104B2 (ja) * | 2004-01-13 | 2005-10-19 | 浜松ホトニクス株式会社 | レーザ加工方法及びレーザ加工装置 |
-
2003
- 2003-12-12 JP JP2003415142A patent/JP3708102B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-06 WO PCT/JP2004/018157 patent/WO2005056229A1/ja active Application Filing
- 2004-12-06 AT AT04820181T patent/ATE524267T1/de not_active IP Right Cessation
- 2004-12-06 CN CN2004800369097A patent/CN1890048B/zh not_active Expired - Fee Related
- 2004-12-06 US US10/582,332 patent/US7777772B2/en active Active
- 2004-12-06 KR KR1020067012960A patent/KR101167328B1/ko active IP Right Grant
- 2004-12-06 EP EP04820181A patent/EP1700666B1/en active Active
- 2004-12-08 TW TW093137879A patent/TWI309186B/zh not_active IP Right Cessation
- 2004-12-10 MY MYPI20045118A patent/MY135053A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7777772B2 (en) | 2003-12-12 | 2010-08-17 | Hamamatsu Photonics K.K. | Laser processing device |
US8436273B2 (en) | 2007-07-18 | 2013-05-07 | Hamamatsu Photonics K.K. | Machining information supply equipment and supply system |
Also Published As
Publication number | Publication date |
---|---|
CN1890048B (zh) | 2010-10-13 |
TWI309186B (en) | 2009-05-01 |
US20080019405A1 (en) | 2008-01-24 |
MY135053A (en) | 2008-01-31 |
CN1890048A (zh) | 2007-01-03 |
US7777772B2 (en) | 2010-08-17 |
KR101167328B1 (ko) | 2012-07-19 |
KR20060108733A (ko) | 2006-10-18 |
TW200531772A (en) | 2005-10-01 |
ATE524267T1 (de) | 2011-09-15 |
EP1700666B1 (en) | 2011-09-14 |
WO2005056229A1 (ja) | 2005-06-23 |
JP2005169476A (ja) | 2005-06-30 |
EP1700666A4 (en) | 2008-12-03 |
EP1700666A1 (en) | 2006-09-13 |
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