JP3683891B2 - セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法 - Google Patents

セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法 Download PDF

Info

Publication number
JP3683891B2
JP3683891B2 JP2003282557A JP2003282557A JP3683891B2 JP 3683891 B2 JP3683891 B2 JP 3683891B2 JP 2003282557 A JP2003282557 A JP 2003282557A JP 2003282557 A JP2003282557 A JP 2003282557A JP 3683891 B2 JP3683891 B2 JP 3683891B2
Authority
JP
Japan
Prior art keywords
photosensitive material
light
ceramic green
green sheet
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003282557A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004253771A (ja
JP2004253771A5 (enExample
Inventor
政幸 吉田
純一 須藤
俊二 青木
源一 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2003282557A priority Critical patent/JP3683891B2/ja
Priority to US10/543,710 priority patent/US7540931B2/en
Priority to PCT/JP2004/000950 priority patent/WO2004068516A1/ja
Priority to TW093102219A priority patent/TWI286330B/zh
Publication of JP2004253771A publication Critical patent/JP2004253771A/ja
Publication of JP2004253771A5 publication Critical patent/JP2004253771A5/ja
Application granted granted Critical
Publication of JP3683891B2 publication Critical patent/JP3683891B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/127—Encapsulating or impregnating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2003282557A 2003-01-31 2003-07-30 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法 Expired - Fee Related JP3683891B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003282557A JP3683891B2 (ja) 2003-01-31 2003-07-30 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
US10/543,710 US7540931B2 (en) 2003-01-31 2004-01-30 Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet
PCT/JP2004/000950 WO2004068516A1 (ja) 2003-01-31 2004-01-30 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
TW093102219A TWI286330B (en) 2003-01-31 2004-01-30 Manufacturing method of ceramic printed circuit board and manufacturing method of electronic components using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003023245 2003-01-31
JP2003282557A JP3683891B2 (ja) 2003-01-31 2003-07-30 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP2004315859A Division JP4205045B2 (ja) 2003-01-31 2004-10-29 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP2004360898A Division JP4205050B2 (ja) 2003-01-31 2004-12-14 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP2004360888A Division JP4148474B2 (ja) 2003-01-31 2004-12-14 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP2004360892A Division JP4205049B2 (ja) 2003-01-31 2004-12-14 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法

Publications (3)

Publication Number Publication Date
JP2004253771A JP2004253771A (ja) 2004-09-09
JP2004253771A5 JP2004253771A5 (enExample) 2005-05-26
JP3683891B2 true JP3683891B2 (ja) 2005-08-17

Family

ID=32828920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003282557A Expired - Fee Related JP3683891B2 (ja) 2003-01-31 2003-07-30 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法

Country Status (4)

Country Link
US (1) US7540931B2 (enExample)
JP (1) JP3683891B2 (enExample)
TW (1) TWI286330B (enExample)
WO (1) WO2004068516A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7467928B2 (en) * 2002-12-12 2008-12-23 Board Of Trustees Of The University Of Arkansas Microfluidic device utilizing magnetohydrodynamics and method for fabrication thereof
US20060091534A1 (en) 2002-12-13 2006-05-04 Matsushita Electric Industrial Co., Ltd. Chip part manufacturing method and chip parts
US20050079450A1 (en) * 2003-08-28 2005-04-14 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
JP2006173163A (ja) * 2004-12-13 2006-06-29 Matsushita Electric Ind Co Ltd チップコイル
US20060163774A1 (en) * 2005-01-25 2006-07-27 Norbert Abels Methods for shaping green bodies and articles made by such methods
DE102010035488B4 (de) * 2010-08-26 2018-11-15 Snaptrack, Inc. Herstellung von keramischen Grünfolien sowie deren Verwendung zur Herstellung von Keramiken
WO2012161058A1 (ja) * 2011-05-20 2012-11-29 パナソニック株式会社 有機エレクトロルミネッセンス素子
RU2014122255A (ru) * 2011-11-03 2015-12-10 Керамтек Гмбх Печатные платы из ain с медными структурами
KR20150005292A (ko) * 2013-07-05 2015-01-14 삼성전기주식회사 코일 부품
CN115116737A (zh) 2021-03-09 2022-09-27 Tdk株式会社 层叠线圈部件的制造方法
JP2022138107A (ja) * 2021-03-09 2022-09-22 Tdk株式会社 積層コイル部品の製造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111283Y2 (enExample) 1971-02-16 1976-03-26
JPS6298799A (ja) * 1985-10-25 1987-05-08 株式会社リコー 多層配線形成方法
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
JPH04215414A (ja) 1990-12-14 1992-08-06 Taiyo Yuden Co Ltd 積層セラミック電子部品の製造方法
US6004705A (en) * 1992-07-07 1999-12-21 Toray Industries, Inc. Photosensitive ceramics green sheet
JP2858609B2 (ja) 1992-08-24 1999-02-17 太陽誘電株式会社 積層セラミック電子部品の製造方法
DE69324640T2 (de) 1992-09-23 1999-10-14 E.I. Du Pont De Nemours And Co. Photoempfindliches dielektrisches Schichtmaterial und untereinander verbundene Mehrschichtschaltungen
JPH0823102A (ja) 1994-07-08 1996-01-23 Matsushita Electric Ind Co Ltd 電子部品及びその製造方法
JP3292009B2 (ja) 1995-10-20 2002-06-17 株式会社村田製作所 電極一体型グリーンシート及び積層セラミック電子部品の製造方法
JP3231987B2 (ja) * 1995-12-27 2001-11-26 京セラ株式会社 多層セラミック回路基板の製造方法
US6159322A (en) * 1996-06-17 2000-12-12 Toray Industries, Inc. Photosensitive ceramic green sheet, ceramic package, and process for producing the same
JP3707216B2 (ja) * 1997-11-20 2005-10-19 株式会社村田製作所 厚膜配線の形成方法
JP3473401B2 (ja) * 1998-05-20 2003-12-02 日立エーアイシー株式会社 プリント配線板の製造方法
JP2000147758A (ja) * 1998-11-17 2000-05-26 Kyocera Corp 感光性導電ペースト
JP3760085B2 (ja) * 2000-07-06 2006-03-29 リンテック株式会社 セラミックグリーンシート製造用工程フィルム
JP2002026046A (ja) 2000-07-11 2002-01-25 Murata Mfg Co Ltd 電子部品装置、電子部品装置用基板およびそれらの製造方法
JP2002221801A (ja) 2001-01-29 2002-08-09 Hitachi Ltd 配線基板の製造方法
JP4072046B2 (ja) 2002-11-28 2008-04-02 京セラ株式会社 複合シートの製造方法および積層部品の製造方法
JP4072045B2 (ja) 2002-11-28 2008-04-02 京セラ株式会社 複合シートの製造方法および積層部品の製造方法
US20040134875A1 (en) * 2002-11-22 2004-07-15 Kyocera Corporation Circuit-parts sheet and method of producing a multi-layer circuit board
JP4044830B2 (ja) * 2002-11-22 2008-02-06 京セラ株式会社 複合シートの製造方法、並びに積層部品の製造方法
JP4372493B2 (ja) 2003-08-28 2009-11-25 Ｔｄｋ株式会社 セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP2005072539A (ja) 2003-08-28 2005-03-17 Tdk Corp セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
US20050079450A1 (en) 2003-08-28 2005-04-14 Tdk Corporation Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
JP4151846B2 (ja) * 2004-03-03 2008-09-17 Ｔｄｋ株式会社 積層セラミック電子部品、回路基板等、および当該部品、基板等の製造に供せられるセラミックグリーンシートの製造方法

Also Published As

Publication number Publication date
WO2004068516A1 (ja) 2004-08-12
JP2004253771A (ja) 2004-09-09
US20060213602A1 (en) 2006-09-28
TW200423163A (en) 2004-11-01
US7540931B2 (en) 2009-06-02
TWI286330B (en) 2007-09-01

Similar Documents

Publication Publication Date Title
JP3683891B2 (ja) セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4151846B2 (ja) 積層セラミック電子部品、回路基板等、および当該部品、基板等の製造に供せられるセラミックグリーンシートの製造方法
JP4372493B2 (ja) セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4205050B2 (ja) セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4205049B2 (ja) セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
KR100726314B1 (ko) 세라믹 그린 시트의 제조 방법 및 상기 세라믹 그린시트를 사용하는 전자 부품의 제조 방법
JP4205045B2 (ja) セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4148474B2 (ja) セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
CN100580830C (zh) 陶瓷生片及电子元件的制造方法
JP4573025B2 (ja) セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法
JP4033401B2 (ja) 積層セラミック電子部品および当該部品の製造の供せられるセラミックグリーンシートの製造方法
JP4577479B2 (ja) 多層配線基板形成に用いられる異材質部を有するシート形成方法および異材質部を有するシート
JP2006185987A (ja) セラミックグリーンシートの製造方法及び当該セラミックグリーンシートを用いた電子部品の製造方法。
JP4151843B2 (ja) 積層セラミックコンデンサおよび当該コンデンサの製造に供せられるセラミックグリーンシートの製造方法
JP4127695B2 (ja) セラミックグリーンシートの製造方法及び当該セラミックグリーンシートを用いた電子部品の製造方法
JP2005340728A (ja) 積層セラミック電子部品、回路基板等、および当該部品、基板等の製造に供せられる電極等を内蔵するセラミックグリーンシートの製造方法
JP4138740B2 (ja) セラミックグリーンシートの製造方法及びセラミック電子部品の製造方法
JP2007067427A (ja) 電子部品の構成に用いられるシート
JP2019197819A (ja) 多層基板の製造方法及び電子部品パッケージの製造方法
JP2004247679A (ja) 電子部品の構成に用いられるシート

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040916

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20040916

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20041026

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050105

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050303

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050523

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050526

R150 Certificate of patent or registration of utility model

Ref document number: 3683891

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080603

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090603

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090603

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100603

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110603

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120603

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120603

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130603

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140603

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees