JP3681457B2 - ソケット - Google Patents

ソケット Download PDF

Info

Publication number
JP3681457B2
JP3681457B2 JP02052796A JP2052796A JP3681457B2 JP 3681457 B2 JP3681457 B2 JP 3681457B2 JP 02052796 A JP02052796 A JP 02052796A JP 2052796 A JP2052796 A JP 2052796A JP 3681457 B2 JP3681457 B2 JP 3681457B2
Authority
JP
Japan
Prior art keywords
contact
flexible sheet
socket
conductive member
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP02052796A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09199247A (ja
Inventor
清和 池谷
慎治 坪井
Original Assignee
日本テキサス・インスツルメンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本テキサス・インスツルメンツ株式会社 filed Critical 日本テキサス・インスツルメンツ株式会社
Priority to JP02052796A priority Critical patent/JP3681457B2/ja
Priority to US08/780,305 priority patent/US5816828A/en
Priority to KR1019970000321A priority patent/KR100385352B1/ko
Priority to SG1997000034A priority patent/SG65632A1/en
Priority to TW086100198A priority patent/TW323406B/zh
Publication of JPH09199247A publication Critical patent/JPH09199247A/ja
Application granted granted Critical
Publication of JP3681457B2 publication Critical patent/JP3681457B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP02052796A 1996-01-11 1996-01-11 ソケット Expired - Fee Related JP3681457B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP02052796A JP3681457B2 (ja) 1996-01-11 1996-01-11 ソケット
US08/780,305 US5816828A (en) 1996-01-11 1997-01-08 Socket
KR1019970000321A KR100385352B1 (ko) 1996-01-11 1997-01-09 소켓
SG1997000034A SG65632A1 (en) 1996-01-11 1997-01-09 Socket
TW086100198A TW323406B (ko) 1996-01-11 1997-01-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP02052796A JP3681457B2 (ja) 1996-01-11 1996-01-11 ソケット

Publications (2)

Publication Number Publication Date
JPH09199247A JPH09199247A (ja) 1997-07-31
JP3681457B2 true JP3681457B2 (ja) 2005-08-10

Family

ID=12029636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP02052796A Expired - Fee Related JP3681457B2 (ja) 1996-01-11 1996-01-11 ソケット

Country Status (5)

Country Link
US (1) US5816828A (ko)
JP (1) JP3681457B2 (ko)
KR (1) KR100385352B1 (ko)
SG (1) SG65632A1 (ko)
TW (1) TW323406B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101441987B1 (ko) 2014-03-13 2014-09-24 주식회사 예도전기조명 설치가 용이한 폴더형 조명 등기구용 어댑터

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162066A (en) * 1997-05-16 2000-12-19 Wells-Cti, Inc. Socket for positioning and installing an integrated circuit chip on a flexible connector sheet
US6142809A (en) * 1998-02-27 2000-11-07 Enplas Corporation IC socket assembly with tracking structure
JPH11329648A (ja) * 1998-05-19 1999-11-30 Molex Inc Ｉｃデバイスソケット
US5973923A (en) * 1998-05-28 1999-10-26 Jitaru; Ionel Packaging power converters
US5997316A (en) * 1998-06-12 1999-12-07 Twp, Inc. Slide-lock test socket assembly
JP4230036B2 (ja) * 1998-12-25 2009-02-25 株式会社エンプラス 電気部品用ソケット
US6430057B1 (en) 2000-08-17 2002-08-06 Lucent Technologies Inc. Device for interfacing an integrated circuit chip with a printed circuit board
FR2835651B1 (fr) * 2002-02-06 2005-04-15 St Microelectronics Sa Dispositif de montage d'un boitier semi-conducteur sur une plaque-support par l'intermediaire d'une embase
JP4213455B2 (ja) * 2002-11-27 2009-01-21 株式会社エンプラス 電気部品用ソケット
JP3803099B2 (ja) * 2002-12-17 2006-08-02 山一電機株式会社 半導体装置用ソケット
JP4383843B2 (ja) * 2003-12-18 2009-12-16 アルプス電気株式会社 電気的接触構造体及びその製造方法
JP4537702B2 (ja) * 2003-12-26 2010-09-08 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
WO2006123998A1 (en) * 2005-05-17 2006-11-23 Infineon Technologies Ag A test socket
JP2007103437A (ja) * 2005-09-30 2007-04-19 Toshiba Corp 部品固定方法および部品固定装置、並びに部品固定装置を備えたプリント回路板および電子機器
JP5373809B2 (ja) * 2008-10-21 2013-12-18 株式会社旭電化研究所 メスコネクタ、それに組付けるオスコネクタ、それらを用いた電気・電子機器
US8952714B2 (en) * 2011-05-27 2015-02-10 Jf Microtechnology Sdn. Bhd. Electrical interconnect assembly
CN103390826B (zh) * 2012-05-08 2016-02-24 赛恩倍吉科技顾问（深圳）有限公司 电连接器
US9274141B1 (en) 2013-01-22 2016-03-01 Johnstech International Corporation Low resistance low wear test pin for test contactor

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03120742A (ja) * 1989-10-04 1991-05-22 Hitachi Ltd 半導体装置のエージング方法、及び、同装置
JPH04154136A (ja) * 1990-10-18 1992-05-27 Fujitsu Ltd ベアチップの実装方法
JP3307470B2 (ja) * 1993-04-05 2002-07-24 三菱電機株式会社 半導体検査装置
JP3205814B2 (ja) * 1992-09-24 2001-09-04 日本テキサス・インスツルメンツ株式会社 ソケット
JPH0722470A (ja) * 1993-06-18 1995-01-24 Minnesota Mining & Mfg Co <3M> バンプ付きｔａｂテープ及びそれを用いた接合方法
JPH07211416A (ja) * 1994-01-10 1995-08-11 Texas Instr Japan Ltd ソケット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101441987B1 (ko) 2014-03-13 2014-09-24 주식회사 예도전기조명 설치가 용이한 폴더형 조명 등기구용 어댑터

Also Published As

Publication number Publication date
US5816828A (en) 1998-10-06
SG65632A1 (en) 1999-06-22
TW323406B (ko) 1997-12-21
KR970060594A (ko) 1997-08-12
KR100385352B1 (ko) 2003-10-04
JPH09199247A (ja) 1997-07-31

Similar Documents

Publication Publication Date Title
JP3681457B2 (ja) ソケット
JP3410396B2 (ja) 高性能集積回路チップパッケージ
US5829988A (en) Socket assembly for integrated circuit chip carrier package
US5973394A (en) Small contactor for test probes, chip packaging and the like
US7423439B2 (en) Probe sheet adhesion holder, probe card, semiconductor test device, and manufacturing method of semiconductor device
KR100281667B1 (ko) 반도체 장치 실장 구조 및 반도체 장치 실장 방법
KR200334763Y1 (ko) 베어 ｉｃ 칩 시험용 시스템 및 이러한 칩을 위한 소켓
US7056131B1 (en) Contact grid array system
JPH11162601A (ja) ソケット
EP0458448A2 (en) An adapter and test fixture for an integrated circuit device package
US6672882B2 (en) Socket structure for grid array (GA) packages
JP3323449B2 (ja) 半導体用ソケット
US6222378B1 (en) Probe adapter for a ball-grid-array package
KR19990037535A (ko) 전자 디바이스 시험용 장치
JP2004047376A (ja) コンタクトユニット
JP2904193B2 (ja) Ｉｃソケット
JP2003121469A (ja) プローブの製造方法及びプローブカードの製造方法
JPH0562748A (ja) Ｉｃソケツト
JPH10340773A (ja) Ｉｃ用ソケット
US11191170B2 (en) Silicone contact element
KR100522753B1 (ko) 모듈형 ｉｃ 소켓
US6367763B1 (en) Test mounting for grid array packages
JP4233806B2 (ja) Ｉｃソケット
JP2006164623A (ja) 半導体装置用ソケット
JPH1197140A (ja) Ｉｃ用ソケット

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040721

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040803

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041001

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20041001

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20041116

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20050111

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050517

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050518

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S303 Written request for registration of pledge or change of pledge

Free format text: JAPANESE INTERMEDIATE CODE: R316303

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S303 Written request for registration of pledge or change of pledge

Free format text: JAPANESE INTERMEDIATE CODE: R316303

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080527

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080527

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080527

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080527

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080527

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080527

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090527

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees