JP3636523B2 - 半導体集積回路装置およびその製造方法 - Google Patents

半導体集積回路装置およびその製造方法 Download PDF

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Publication number
JP3636523B2
JP3636523B2 JP33839895A JP33839895A JP3636523B2 JP 3636523 B2 JP3636523 B2 JP 3636523B2 JP 33839895 A JP33839895 A JP 33839895A JP 33839895 A JP33839895 A JP 33839895A JP 3636523 B2 JP3636523 B2 JP 3636523B2
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JP
Japan
Prior art keywords
wiring
layer
block
semiconductor integrated
region
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Expired - Fee Related
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JP33839895A
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English (en)
Japanese (ja)
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JPH09181184A (ja
Inventor
健志 廣瀬
郁夫 工藤
裕二朗 宮入
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Hitachi Solutions Technology Ltd
Original Assignee
Renesas Technology Corp
Hitachi ULSI Systems Co Ltd
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Application filed by Renesas Technology Corp, Hitachi ULSI Systems Co Ltd filed Critical Renesas Technology Corp
Priority to JP33839895A priority Critical patent/JP3636523B2/ja
Priority to TW085103214A priority patent/TW312846B/zh
Publication of JPH09181184A publication Critical patent/JPH09181184A/ja
Application granted granted Critical
Publication of JP3636523B2 publication Critical patent/JP3636523B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP33839895A 1995-12-26 1995-12-26 半導体集積回路装置およびその製造方法 Expired - Fee Related JP3636523B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP33839895A JP3636523B2 (ja) 1995-12-26 1995-12-26 半導体集積回路装置およびその製造方法
TW085103214A TW312846B (enExample) 1995-12-26 1996-03-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33839895A JP3636523B2 (ja) 1995-12-26 1995-12-26 半導体集積回路装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPH09181184A JPH09181184A (ja) 1997-07-11
JP3636523B2 true JP3636523B2 (ja) 2005-04-06

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ID=18317791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33839895A Expired - Fee Related JP3636523B2 (ja) 1995-12-26 1995-12-26 半導体集積回路装置およびその製造方法

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JP (1) JP3636523B2 (enExample)
TW (1) TW312846B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216264A (ja) 1999-01-22 2000-08-04 Mitsubishi Electric Corp Ｃｍｏｓ論理回路素子、半導体装置とその製造方法およびその製造方法において用いる半導体回路設計方法
JP3616611B2 (ja) 2002-05-14 2005-02-02 株式会社東芝 半導体集積回路装置の設計装置、半導体集積回路の設計方法および半導体集積回路設計プログラム

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Publication number Publication date
JPH09181184A (ja) 1997-07-11
TW312846B (enExample) 1997-08-11

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