TW312846B - - Google Patents

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Publication number
TW312846B
TW312846B TW085103214A TW85103214A TW312846B TW 312846 B TW312846 B TW 312846B TW 085103214 A TW085103214 A TW 085103214A TW 85103214 A TW85103214 A TW 85103214A TW 312846 B TW312846 B TW 312846B
Authority
TW
Taiwan
Prior art keywords
wiring
layer
wiring layer
circuit
many
Prior art date
Application number
TW085103214A
Other languages
English (en)
Chinese (zh)
Original Assignee
Hitachi Ltd
Hitachi Microcomp System Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomp System Kk filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW312846B publication Critical patent/TW312846B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW085103214A 1995-12-26 1996-03-18 TW312846B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33839895A JP3636523B2 (ja) 1995-12-26 1995-12-26 半導体集積回路装置およびその製造方法

Publications (1)

Publication Number Publication Date
TW312846B true TW312846B (enExample) 1997-08-11

Family

ID=18317791

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085103214A TW312846B (enExample) 1995-12-26 1996-03-18

Country Status (2)

Country Link
JP (1) JP3636523B2 (enExample)
TW (1) TW312846B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000216264A (ja) 1999-01-22 2000-08-04 Mitsubishi Electric Corp Ｃｍｏｓ論理回路素子、半導体装置とその製造方法およびその製造方法において用いる半導体回路設計方法
JP3616611B2 (ja) 2002-05-14 2005-02-02 株式会社東芝 半導体集積回路装置の設計装置、半導体集積回路の設計方法および半導体集積回路設計プログラム

Also Published As

Publication number Publication date
JP3636523B2 (ja) 2005-04-06
JPH09181184A (ja) 1997-07-11

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