JP3565836B2 - ポリアミド／ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法 - Google Patents

ポリアミド／ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法 Download PDF

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Publication number
JP3565836B2
JP3565836B2 JP2003308814A JP2003308814A JP3565836B2 JP 3565836 B2 JP3565836 B2 JP 3565836B2 JP 2003308814 A JP2003308814 A JP 2003308814A JP 2003308814 A JP2003308814 A JP 2003308814A JP 3565836 B2 JP3565836 B2 JP 3565836B2
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Prior art keywords
polyamide
polyphenylene ether
acid
group
resin composition
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JP2003308814A
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Japanese (ja)
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JP2004002898A (ja
JP2004002898A5 (enExample
Inventor
貴章 三好
一彦 橋本
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Asahi Kasei Chemicals Corp
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Asahi Kasei Chemicals Corp
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  • Processes Of Treating Macromolecular Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2003308814A 2000-04-26 2003-09-01 ポリアミド／ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法 Expired - Fee Related JP3565836B2 (ja)

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JP2003308814A JP3565836B2 (ja) 2000-04-26 2003-09-01 ポリアミド／ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法

Applications Claiming Priority (2)

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JP2000125081 2000-04-26
JP2003308814A JP3565836B2 (ja) 2000-04-26 2003-09-01 ポリアミド／ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法

Related Parent Applications (1)

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JP2001578553A Division JP3844436B2 (ja) 2000-04-26 2001-02-26 導電性樹脂組成物及びその製法

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JP2004002898A JP2004002898A (ja) 2004-01-08
JP3565836B2 true JP3565836B2 (ja) 2004-09-15
JP2004002898A5 JP2004002898A5 (enExample) 2005-05-26

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4534604A1 (en) 2023-10-04 2025-04-09 LG Chem, Ltd. Conductive resin composition, method of preparing the same, and molded article including the same

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005264028A (ja) * 2004-03-19 2005-09-29 Asahi Kasei Chemicals Corp 樹脂組成物
JP2005281616A (ja) * 2004-03-30 2005-10-13 Asahi Kasei Chemicals Corp ポリアミド／ポリフェニレンエーテル樹脂組成物
JP2005298546A (ja) * 2004-04-06 2005-10-27 Asahi Kasei Chemicals Corp ポリアミド／ポリフェニレンエーテル樹脂組成物
JP4806914B2 (ja) * 2004-09-30 2011-11-02 住友化学株式会社 アンチブロッキング剤マスターバッチおよびポリプロピレンフィルム用組成物およびその製造方法
US7887901B2 (en) 2005-06-29 2011-02-15 Sabic Innovative Plastics Ip B.V. Article made from a poly(arylene ether)/polyamide composition
WO2007029634A1 (ja) 2005-09-05 2007-03-15 Asahi Kasei Chemicals Corporation 導電性マスターバッチの製造方法
WO2007132504A1 (ja) * 2006-05-12 2007-11-22 Asahi Kasei Chemicals Corporation 導電性樹脂組成物の製造方法
JP5793397B2 (ja) * 2011-10-28 2015-10-14 旭化成ケミカルズ株式会社 ポリプロピレン系樹脂組成物の製造方法
KR102247186B1 (ko) 2018-11-08 2021-05-04 주식회사 엘지화학 전도성 농축 수지 조성물, 전도성 폴리아미드 수지 조성물, 이의 제조방법 및 성형품
US12322523B2 (en) 2020-08-04 2025-06-03 Lg Chem, Ltd. Conductive resin composition, method of preparing the same, and molded article including the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4534604A1 (en) 2023-10-04 2025-04-09 LG Chem, Ltd. Conductive resin composition, method of preparing the same, and molded article including the same

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