JP2004002898A5 - - Google Patents

Download PDF

Info

Publication number
JP2004002898A5
JP2004002898A5 JP2003308814A JP2003308814A JP2004002898A5 JP 2004002898 A5 JP2004002898 A5 JP 2004002898A5 JP 2003308814 A JP2003308814 A JP 2003308814A JP 2003308814 A JP2003308814 A JP 2003308814A JP 2004002898 A5 JP2004002898 A5 JP 2004002898A5
Authority
JP
Japan
Prior art keywords
supply port
polyamide
supplied
resin composition
upstream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003308814A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004002898A (ja
JP3565836B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003308814A priority Critical patent/JP3565836B2/ja
Priority claimed from JP2003308814A external-priority patent/JP3565836B2/ja
Publication of JP2004002898A publication Critical patent/JP2004002898A/ja
Application granted granted Critical
Publication of JP3565836B2 publication Critical patent/JP3565836B2/ja
Publication of JP2004002898A5 publication Critical patent/JP2004002898A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003308814A 2000-04-26 2003-09-01 ポリアミド/ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法 Expired - Fee Related JP3565836B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003308814A JP3565836B2 (ja) 2000-04-26 2003-09-01 ポリアミド/ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000125081 2000-04-26
JP2003308814A JP3565836B2 (ja) 2000-04-26 2003-09-01 ポリアミド/ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001578553A Division JP3844436B2 (ja) 2000-04-26 2001-02-26 導電性樹脂組成物及びその製法

Publications (3)

Publication Number Publication Date
JP2004002898A JP2004002898A (ja) 2004-01-08
JP3565836B2 JP3565836B2 (ja) 2004-09-15
JP2004002898A5 true JP2004002898A5 (enExample) 2005-05-26

Family

ID=30445616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003308814A Expired - Fee Related JP3565836B2 (ja) 2000-04-26 2003-09-01 ポリアミド/ポリフェニレンエーテル樹脂組成物用ポリアミドマスターペレットの製造方法

Country Status (1)

Country Link
JP (1) JP3565836B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005264028A (ja) * 2004-03-19 2005-09-29 Asahi Kasei Chemicals Corp 樹脂組成物
JP2005281616A (ja) * 2004-03-30 2005-10-13 Asahi Kasei Chemicals Corp ポリアミド/ポリフェニレンエーテル樹脂組成物
JP2005298546A (ja) * 2004-04-06 2005-10-27 Asahi Kasei Chemicals Corp ポリアミド/ポリフェニレンエーテル樹脂組成物
JP4806914B2 (ja) * 2004-09-30 2011-11-02 住友化学株式会社 アンチブロッキング剤マスターバッチおよびポリプロピレンフィルム用組成物およびその製造方法
US7887901B2 (en) 2005-06-29 2011-02-15 Sabic Innovative Plastics Ip B.V. Article made from a poly(arylene ether)/polyamide composition
WO2007029634A1 (ja) 2005-09-05 2007-03-15 Asahi Kasei Chemicals Corporation 導電性マスターバッチの製造方法
US8304472B2 (en) 2006-05-12 2012-11-06 Asahi Kasei Chemicals Corporation Process for production of conductive resin composition
JP5793397B2 (ja) * 2011-10-28 2015-10-14 旭化成ケミカルズ株式会社 ポリプロピレン系樹脂組成物の製造方法
KR102247186B1 (ko) 2018-11-08 2021-05-04 주식회사 엘지화학 전도성 농축 수지 조성물, 전도성 폴리아미드 수지 조성물, 이의 제조방법 및 성형품
WO2022030773A1 (ko) 2020-08-04 2022-02-10 (주) 엘지화학 전도성 수지 조성물, 이의 제조방법 및 이를 포함하는 성형품
KR20250048839A (ko) 2023-10-04 2025-04-11 주식회사 엘지화학 전도성 수지 조성물, 이의 제조방법 및 이를 포함하는 성형품

Similar Documents

Publication Publication Date Title
CN1774325B (zh) 聚合物树脂共混物及其制造方法
KR100638298B1 (ko) 도전성 마스터 배치 및 도전성 수지 조성물
CN105874543B (zh) 导电聚酰胺/聚亚苯基醚树脂组合物以及由其制造的机动车模制品
JP2004002898A5 (enExample)
US20070235699A1 (en) Conductive thermoplastic composition
EP2066750B1 (en) Reinforced poly (arylene ether)/polyamide composition and article comprising the foregoing
EP1971647A1 (en) Poly (arylene ether) compositions and methods of making the same
EP2267078A1 (en) Polyphenylene ether thermoplastic resin composition, and molded product using the same
US7935275B2 (en) Resin moldings and conductive resin composition
JP6581119B2 (ja) 塗装成形品
JP4040073B2 (ja) ポリアミド/ポリフェニレンエーテル樹脂組成物
JP4248845B2 (ja) 導電性樹脂組成物とその製法
CN101258186B (zh) 导电性母炼胶的制备方法
JP2005112990A5 (enExample)
US20150187457A1 (en) Electroconductive Polyamide/Polyphenylene Ether Resin Composition, Method for Preparing the Same and Molded Product for Vehicle Using the Same
JP4162201B2 (ja) 熱可塑性樹脂組成物
JP2882689B2 (ja) 樹脂組成物の製造方法
JP2004143240A (ja) 樹脂組成物
JP4159339B2 (ja) 導電性樹脂組成物
JP4162465B2 (ja) 導電性樹脂組成物及びその製法
JP4249461B2 (ja) 熱可塑性樹脂組成物及びその製法
CN101153105A (zh) 一种abs改性配方
JP2004143238A (ja) 導電性熱可塑性樹脂組成物
JP2001302905A (ja) 導電性樹脂組成物
JP4545037B2 (ja) 熱可塑性樹脂組成物