JP3507084B2 - 銅導体組成物 - Google Patents

銅導体組成物

Info

Publication number
JP3507084B2
JP3507084B2 JP35234791A JP35234791A JP3507084B2 JP 3507084 B2 JP3507084 B2 JP 3507084B2 JP 35234791 A JP35234791 A JP 35234791A JP 35234791 A JP35234791 A JP 35234791A JP 3507084 B2 JP3507084 B2 JP 3507084B2
Authority
JP
Japan
Prior art keywords
copper
weight
flake
powder
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP35234791A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05166409A (ja
Inventor
バリー・イ・テイラー
元彦 土屋
千恵 岡部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
EIDP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co, EIDP Inc filed Critical EI Du Pont de Nemours and Co
Priority to JP35234791A priority Critical patent/JP3507084B2/ja
Priority to EP92121111A priority patent/EP0546560A1/en
Priority to KR1019920024054A priority patent/KR930012181A/ko
Priority to CN92114433A priority patent/CN1075378A/zh
Priority to TW081110311A priority patent/TW245801B/zh
Publication of JPH05166409A publication Critical patent/JPH05166409A/ja
Application granted granted Critical
Publication of JP3507084B2 publication Critical patent/JP3507084B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H10W70/666—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
JP35234791A 1991-12-13 1991-12-13 銅導体組成物 Expired - Fee Related JP3507084B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP35234791A JP3507084B2 (ja) 1991-12-13 1991-12-13 銅導体組成物
EP92121111A EP0546560A1 (en) 1991-12-13 1992-12-11 Thick film copper paste composition
KR1019920024054A KR930012181A (ko) 1991-12-13 1992-12-12 후막 구리 페이스트 조성물
CN92114433A CN1075378A (zh) 1991-12-13 1992-12-12 厚膜铜浆组合物
TW081110311A TW245801B (enExample) 1991-12-13 1992-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35234791A JP3507084B2 (ja) 1991-12-13 1991-12-13 銅導体組成物

Publications (2)

Publication Number Publication Date
JPH05166409A JPH05166409A (ja) 1993-07-02
JP3507084B2 true JP3507084B2 (ja) 2004-03-15

Family

ID=18423439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35234791A Expired - Fee Related JP3507084B2 (ja) 1991-12-13 1991-12-13 銅導体組成物

Country Status (5)

Country Link
EP (1) EP0546560A1 (enExample)
JP (1) JP3507084B2 (enExample)
KR (1) KR930012181A (enExample)
CN (1) CN1075378A (enExample)
TW (1) TW245801B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2223099A1 (en) * 1995-06-06 1996-12-12 David Sarnoff Research Center, Inc. Electrokinetic pumping
JP4146119B2 (ja) * 2001-12-04 2008-09-03 Ｊｆｅミネラル株式会社 導電ペースト用銅合金粉
DE102005043242A1 (de) * 2005-09-09 2007-03-15 Basf Ag Dispersion zum Aufbringen einer Metallschicht
US8419981B2 (en) 2010-11-15 2013-04-16 Cheil Industries, Inc. Conductive paste composition and electrode prepared using the same
CN103733277B (zh) 2011-08-03 2017-03-01 日立化成株式会社 组合物套剂、导电性基板及其制造方法以及导电性粘接材料组合物
KR101411012B1 (ko) * 2011-11-25 2014-06-24 제일모직주식회사 태양전지 전극용 페이스트 및 이를 이용한 전극 및 태양전지
CN103310870A (zh) * 2012-03-12 2013-09-18 深圳市圣龙特电子有限公司 一种硅太阳能电池电极用无铅铜浆及其制备方法
AT512041B1 (de) * 2012-05-04 2013-05-15 Mikroelektronik Ges Mit Beschraenkter Haftung Ab Verfahren zur Herstellung eines metallisierten Substrats
SG2013066683A (en) 2012-09-10 2014-04-28 Heraeus Precious Metals North America Conshohocken Llc Low firing temperature copper composition
JP6487700B2 (ja) * 2015-01-26 2019-03-20 田中貴金属工業株式会社 ビア電極用導電性ペースト組成物
JP7172224B2 (ja) * 2018-07-19 2022-11-16 昭和電工マテリアルズ株式会社 導体形成用組成物、及び、導体層を有する物品の製造方法
TWI717004B (zh) * 2018-09-07 2021-01-21 美商菲洛公司 用於氮化矽和其他基板的導電厚膜漿料及形成導電厚膜的方法
CN111761050B (zh) * 2019-04-01 2022-06-03 广州力及热管理科技有限公司 以金属浆料制作毛细结构的方法
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2286160A1 (fr) * 1974-09-30 1976-04-23 Eaton Manford Nouveau materiau resilient conducteur de l'electricite sous pression
US4247594A (en) * 1979-04-30 1981-01-27 Marshall & Pike Enterprises Inc. Electrically conductive resinous composition
US4884754A (en) * 1989-01-03 1989-12-05 Gte Products Corporation Process for producing fine copper flakes

Also Published As

Publication number Publication date
EP0546560A1 (en) 1993-06-16
CN1075378A (zh) 1993-08-18
JPH05166409A (ja) 1993-07-02
KR930012181A (ko) 1993-07-20
TW245801B (enExample) 1995-04-21

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