JP3413645B2 - レーザ刻印装置における刻印位置補正装置 - Google Patents

レーザ刻印装置における刻印位置補正装置

Info

Publication number
JP3413645B2
JP3413645B2 JP06286195A JP6286195A JP3413645B2 JP 3413645 B2 JP3413645 B2 JP 3413645B2 JP 06286195 A JP06286195 A JP 06286195A JP 6286195 A JP6286195 A JP 6286195A JP 3413645 B2 JP3413645 B2 JP 3413645B2
Authority
JP
Japan
Prior art keywords
lens
marking
marking position
moving distance
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP06286195A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08257771A (ja
Inventor
昭彦 宗田
幸司 三杉
孝司 与四田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Ltd
Original Assignee
Komatsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd filed Critical Komatsu Ltd
Priority to JP06286195A priority Critical patent/JP3413645B2/ja
Priority to KR1019960006539A priority patent/KR960033640A/ko
Priority to EP96906919A priority patent/EP0873811A1/en
Priority to US08/913,342 priority patent/US5896233A/en
Priority to PCT/JP1996/000747 priority patent/WO1996029175A1/ja
Publication of JPH08257771A publication Critical patent/JPH08257771A/ja
Application granted granted Critical
Publication of JP3413645B2 publication Critical patent/JP3413645B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
JP06286195A 1995-03-22 1995-03-22 レーザ刻印装置における刻印位置補正装置 Expired - Fee Related JP3413645B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP06286195A JP3413645B2 (ja) 1995-03-22 1995-03-22 レーザ刻印装置における刻印位置補正装置
KR1019960006539A KR960033640A (ko) 1995-03-22 1996-03-12 레이저 각인장치에 있어서의 각인위치 보정장치
EP96906919A EP0873811A1 (en) 1995-03-22 1996-03-22 Position correction apparatus for laser marker
US08/913,342 US5896233A (en) 1995-03-22 1996-03-22 Marking position correcting device for laser marker
PCT/JP1996/000747 WO1996029175A1 (en) 1995-03-22 1996-03-22 Position correction apparatus for laser marker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP06286195A JP3413645B2 (ja) 1995-03-22 1995-03-22 レーザ刻印装置における刻印位置補正装置

Publications (2)

Publication Number Publication Date
JPH08257771A JPH08257771A (ja) 1996-10-08
JP3413645B2 true JP3413645B2 (ja) 2003-06-03

Family

ID=13212509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP06286195A Expired - Fee Related JP3413645B2 (ja) 1995-03-22 1995-03-22 レーザ刻印装置における刻印位置補正装置

Country Status (5)

Country Link
US (1) US5896233A (enExample)
EP (1) EP0873811A1 (enExample)
JP (1) JP3413645B2 (enExample)
KR (1) KR960033640A (enExample)
WO (1) WO1996029175A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09277069A (ja) * 1996-04-12 1997-10-28 Komatsu Ltd 液晶マスク、液晶式レーザマーカ及びそれを用いた刻印方法
FR2821678B1 (fr) * 2001-03-02 2004-06-18 Teem Photonics Module de deflexion optique
KR20040044554A (ko) * 2001-10-25 2004-05-28 토레이 엔지니어링 컴퍼니, 리미티드 레이저빔에 의한 식별코드의 마킹 방법 및 장치
US7397592B2 (en) * 2003-04-21 2008-07-08 Semiconductor Energy Laboratory Co., Ltd. Beam irradiation apparatus, beam irradiation method, and method for manufacturing a thin film transistor
US7220627B2 (en) * 2003-04-21 2007-05-22 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device where the scanning direction changes between regions during crystallization and process
US7476629B2 (en) * 2003-04-21 2009-01-13 Semiconductor Energy Laboratory Co., Ltd. Beam irradiation apparatus, beam irradiation method, and method for manufacturing thin film transistor
WO2007069516A1 (en) * 2005-12-16 2007-06-21 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and manufacturing method of semiconductor device
US9018561B2 (en) * 2007-05-23 2015-04-28 Cymer, Llc High power seed/amplifier laser system with beam shaping intermediate the seed and amplifier
CN102248817B (zh) * 2010-05-21 2013-07-03 深圳泰德激光科技有限公司 激光打标的校正方法和校正装置以及激光打标系统

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4045201A (en) * 1976-07-09 1977-08-30 American Atomics Corporation Method and apparatus for subdividing a gas filled glass tube
JPS6046978A (ja) * 1983-08-20 1985-03-14 長尾曹達株式会社 セラミック多孔体の製造患法
JPS6046978U (ja) * 1983-09-05 1985-04-02 渋谷工業株式会社 レ−ザ光線の加工位置移動装置
JPH01228688A (ja) * 1988-03-09 1989-09-12 Mitsubishi Electric Corp レーザ加工機の加工ヘッド
JP2840103B2 (ja) * 1990-02-26 1998-12-24 川崎製鉄株式会社 高クロム含有圧延用素材鋼の製造方法
JPH03248784A (ja) * 1990-02-28 1991-11-06 Hitachi Ltd レーザマーキングシステム
KR950013780B1 (ko) * 1990-05-22 1995-11-16 후루까와 뗀끼 고요교오 가부시끼가이샤 이동하고 있는 길다란 물건의 길이를 측정하는 장치 및 그 방법
JPH0439646A (ja) * 1990-06-05 1992-02-10 Konica Corp ハロゲン化銀カラー写真感光材料
JP2701183B2 (ja) * 1991-08-09 1998-01-21 株式会社小松製作所 液晶マスク式レーザマーカ
KR960704672A (ko) * 1993-09-30 1996-10-09 안자키 사토루 투과형 액정마스크마커(transmission type liqutd crystal mask marker)
WO1995013899A1 (en) * 1993-11-19 1995-05-26 Komatsu Ltd. Laser marking method and apparatus therefor

Also Published As

Publication number Publication date
JPH08257771A (ja) 1996-10-08
KR960033640A (ko) 1996-10-22
EP0873811A1 (en) 1998-10-28
EP0873811A4 (enExample) 1998-10-28
WO1996029175A1 (en) 1996-09-26
US5896233A (en) 1999-04-20

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