JP3313263B2 - 電解水生成方法及びその生成装置、半導体製造装置 - Google Patents

電解水生成方法及びその生成装置、半導体製造装置

Info

Publication number
JP3313263B2
JP3313263B2 JP11399695A JP11399695A JP3313263B2 JP 3313263 B2 JP3313263 B2 JP 3313263B2 JP 11399695 A JP11399695 A JP 11399695A JP 11399695 A JP11399695 A JP 11399695A JP 3313263 B2 JP3313263 B2 JP 3313263B2
Authority
JP
Japan
Prior art keywords
water
tank
electrolytic
supporting electrolyte
ultrapure water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP11399695A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08283976A (ja
Inventor
淳 高安
直人 宮下
美紀子 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP11399695A priority Critical patent/JP3313263B2/ja
Priority to US08/631,226 priority patent/US6723226B1/en
Priority to TW085105083A priority patent/TW323306B/zh
Publication of JPH08283976A publication Critical patent/JPH08283976A/ja
Application granted granted Critical
Publication of JP3313263B2 publication Critical patent/JP3313263B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/46Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C02F1/46104Devices therefor; Their operating or servicing
    • C02F1/4618Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/68Treatment of water, waste water, or sewage by addition of specified substances, e.g. trace elements, for ameliorating potable water
    • C02F1/685Devices for dosing the additives
    • C02F1/688Devices in which the water progressively dissolves a solid compound
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/46Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/02Non-contaminated water, e.g. for industrial water supply
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F9/00Multistage treatment of water, waste water or sewage
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Water Supply & Treatment (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP11399695A 1995-04-15 1995-04-15 電解水生成方法及びその生成装置、半導体製造装置 Expired - Fee Related JP3313263B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP11399695A JP3313263B2 (ja) 1995-04-15 1995-04-15 電解水生成方法及びその生成装置、半導体製造装置
US08/631,226 US6723226B1 (en) 1995-04-15 1996-04-12 Method and apparatus for forming electrolytic water and apparatus for washing semiconductor substrate using electrolytic water-forming apparatus
TW085105083A TW323306B (OSRAM) 1995-04-15 1996-04-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11399695A JP3313263B2 (ja) 1995-04-15 1995-04-15 電解水生成方法及びその生成装置、半導体製造装置

Publications (2)

Publication Number Publication Date
JPH08283976A JPH08283976A (ja) 1996-10-29
JP3313263B2 true JP3313263B2 (ja) 2002-08-12

Family

ID=14626454

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11399695A Expired - Fee Related JP3313263B2 (ja) 1995-04-15 1995-04-15 電解水生成方法及びその生成装置、半導体製造装置

Country Status (3)

Country Link
US (1) US6723226B1 (OSRAM)
JP (1) JP3313263B2 (OSRAM)
TW (1) TW323306B (OSRAM)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5140218B2 (ja) * 2001-09-14 2013-02-06 有限会社コヒーレントテクノロジー 表面洗浄・表面処理に適した帯電アノード水の製造用電解槽及びその製造法、並びに使用方法
AU2002353060A1 (en) * 2001-12-05 2003-06-17 Oculus Innovative Sciences, Inc. Method and apparatus for producing negative and positive oxidative reductive potential (orp) water
JP3869730B2 (ja) 2002-01-16 2007-01-17 株式会社平間理化研究所 処理液調製供給方法及び装置
US7122269B1 (en) * 2002-05-30 2006-10-17 Wurzburger Stephen R Hydronium-oxyanion energy cell
US20050196462A1 (en) * 2003-12-30 2005-09-08 Oculus Innovative Sciences, Inc. Topical formulation containing oxidative reductive potential water solution and method for using same
US9168318B2 (en) 2003-12-30 2015-10-27 Oculus Innovative Sciences, Inc. Oxidative reductive potential water solution and methods of using the same
US20050139808A1 (en) * 2003-12-30 2005-06-30 Oculus Innovative Sciences, Inc. Oxidative reductive potential water solution and process for producing same
EP1863502B1 (en) * 2005-03-23 2018-09-12 Sonoma Pharmaceuticals, Inc. Method of treating skin ulcers using oxidative reductive potential water solution
US9498548B2 (en) 2005-05-02 2016-11-22 Oculus Innovative Sciences, Inc. Method of using oxidative reductive potential water solution in dental applications
KR101100607B1 (ko) * 2005-06-13 2011-12-29 오엠에스아이 컴패니, 리미티드 탄산가스 용액의 제조방법, 제조장치 및 탄산수
EP1993571B1 (en) * 2006-01-20 2018-07-25 Sonoma Pharmaceuticals, Inc. Methods of treating or preventing inflammation and hypersensitivity with oxidative reductive potential water solution
EP1826183B1 (en) * 2006-02-24 2010-01-06 Enterprises Skyview Ionized water and method of producing same
JP5072892B2 (ja) * 2008-04-03 2012-11-14 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR101781229B1 (ko) 2009-06-15 2017-09-22 오클루스 이노바티브 사이언시즈 인코포레이티드 차아염소산을 함유하는 용액 및 그의 사용 방법
US9688550B2 (en) * 2010-08-09 2017-06-27 Aqua Vectors, Incorporated Electrolytic apparatus and method for treating water to remove nitrates, phosphates, arsenates, and molecules of high molecular weight
AT512689A1 (de) * 2012-03-29 2013-10-15 Pro Aqua Diamantelektroden Produktion Gmbh & Co Kg Flüssigkeit auf der Basis von Wasser zur Verwendung als Reinigungs- und/oder Desinfektionsmittel, Substanz zur Auflösung in Wasser zur Herstellung eines Reinigungs- und/oder Desinfektionsmittels und Verfahren zur Herstellung eines Reinigungs- und/oder Desinfektionsmittels
DE102016109771B4 (de) * 2016-05-27 2020-09-10 Brooks Automation (Germany) Gmbh Verfahren zum Reinigen einer Kunststoffoberfläche

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2859081B2 (ja) 1993-01-08 1999-02-17 日本電気株式会社 ウェット処理方法及び処理装置
DE69306542T2 (de) * 1993-01-08 1997-05-15 Nippon Electric Co Verfahren und Vorrichtung zur Nassbehandlung von festen Oberflächen
DE69409996T2 (de) * 1993-02-22 1999-01-14 Nippon Intek Co., Ltd., Kawagoe, Saitama Verfahren und Vorrichtung zur Erzeugung von elektrolytischem Wasser
JP2830733B2 (ja) * 1994-03-25 1998-12-02 日本電気株式会社 電解水生成方法および電解水生成機構
JP3181795B2 (ja) * 1994-10-28 2001-07-03 オルガノ株式会社 電解水製造装置

Also Published As

Publication number Publication date
TW323306B (OSRAM) 1997-12-21
JPH08283976A (ja) 1996-10-29
US6723226B1 (en) 2004-04-20

Similar Documents

Publication Publication Date Title
JP3313263B2 (ja) 電解水生成方法及びその生成装置、半導体製造装置
US5635053A (en) Method and apparatus for cleaning electronic parts
JP2830733B2 (ja) 電解水生成方法および電解水生成機構
JP3409849B2 (ja) 電子部品部材類洗浄用洗浄液の製造装置
US5599438A (en) Method for producing electrolyzed water
KR100913449B1 (ko) 세정 시스템 및 세정 방법
JP3455035B2 (ja) 電解イオン水生成装置及び半導体製造装置
US20140076355A1 (en) Treatment apparatus, method for manufacturing treatment liquid, and method for manufacturing electronic device
JPH1064867A (ja) 電子部品部材類の洗浄方法及び洗浄装置
JP2000354729A (ja) 洗浄用機能水製造方法及び製造装置
JP4462513B2 (ja) 電解水の製造方法、洗浄水、及び洗浄方法
JP3639102B2 (ja) ウェット処理装置
JP3586364B2 (ja) 電解イオン水生成装置、電解イオン水生成方法及び洗浄方法
JPH10296198A (ja) 洗浄方法
JP3594282B2 (ja) 電解イオン水生成装置、電解イオン水生成方法及び洗浄方法
JPH1129795A (ja) 電子材料用洗浄水、その製造方法及び電子材料の洗浄方法
JP3324943B2 (ja) ガラス基板乃至シリコン基板洗浄用水の製造装置
JP2001096273A (ja) 洗浄用イオン水の製造方法及びその製造装置
JP2003290729A (ja) 電子部品の洗浄方法及び装置
JP3507590B2 (ja) ウエット処理方法及び処理装置
JP2002224674A (ja) 基板洗浄用水の製造装置及び製造方法、それらにより製造された基板洗浄用水、並びに該基板洗浄用水を用いた基板の洗浄方法
JP3677129B2 (ja) 電解イオン水による洗浄方法
JP3663048B2 (ja) ウェット処理方法
JP3590273B2 (ja) 半導体装置の製造方法及び処理液の生成装置
JP2000008083A (ja) ガス溶解水製造装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees