JP3220088U - 異形基板の端材分断装置 - Google Patents

異形基板の端材分断装置 Download PDF

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JP3220088U
JP3220088U JP2018004618U JP2018004618U JP3220088U JP 3220088 U JP3220088 U JP 3220088U JP 2018004618 U JP2018004618 U JP 2018004618U JP 2018004618 U JP2018004618 U JP 2018004618U JP 3220088 U JP3220088 U JP 3220088U
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substrate
gripping
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白井　明
明 白井
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株式会社シライテック
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Priority to TW108210875U priority patent/TWM586265U/zh
Priority to CN201921407902.1U priority patent/CN210516755U/zh
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JP2018004618U 2018-11-29 2018-11-29 異形基板の端材分断装置 Active JP3220088U (ja)

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Application Number Priority Date Filing Date Title
JP2018004618U JP3220088U (ja) 2018-11-29 2018-11-29 異形基板の端材分断装置
TW108210875U TWM586265U (zh) 2018-11-29 2019-08-16 異形基板之端材分割裝置
CN201921407902.1U CN210516755U (zh) 2018-11-29 2019-08-27 异形基板的端材分割装置

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JP2018004618U JP3220088U (ja) 2018-11-29 2018-11-29 異形基板の端材分断装置

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JP3220088U true JP3220088U (ja) 2019-02-14

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JP2018004618U Active JP3220088U (ja) 2018-11-29 2018-11-29 異形基板の端材分断装置

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CN (1) CN210516755U (zh)
TW (1) TWM586265U (zh)

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TWM586265U (zh) 2019-11-11
CN210516755U (zh) 2020-05-12

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