JP3214279B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JP3214279B2
JP3214279B2 JP03434395A JP3434395A JP3214279B2 JP 3214279 B2 JP3214279 B2 JP 3214279B2 JP 03434395 A JP03434395 A JP 03434395A JP 3434395 A JP3434395 A JP 3434395A JP 3214279 B2 JP3214279 B2 JP 3214279B2
Authority
JP
Japan
Prior art keywords
coating film
etching
space
width
boundary position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP03434395A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08213369A (ja
Inventor
雅彦 名倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP03434395A priority Critical patent/JP3214279B2/ja
Priority to TW085101080A priority patent/TW294829B/zh
Priority to US08/593,008 priority patent/US5792673A/en
Publication of JPH08213369A publication Critical patent/JPH08213369A/ja
Application granted granted Critical
Publication of JP3214279B2 publication Critical patent/JP3214279B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP03434395A 1995-01-31 1995-01-31 半導体装置の製造方法 Expired - Fee Related JP3214279B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP03434395A JP3214279B2 (ja) 1995-01-31 1995-01-31 半導体装置の製造方法
TW085101080A TW294829B (https=) 1995-01-31 1996-01-29
US08/593,008 US5792673A (en) 1995-01-31 1996-01-29 Monitoring of eching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03434395A JP3214279B2 (ja) 1995-01-31 1995-01-31 半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2001132320A Division JP3890919B2 (ja) 2001-04-27 2001-04-27 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH08213369A JPH08213369A (ja) 1996-08-20
JP3214279B2 true JP3214279B2 (ja) 2001-10-02

Family

ID=12411497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03434395A Expired - Fee Related JP3214279B2 (ja) 1995-01-31 1995-01-31 半導体装置の製造方法

Country Status (3)

Country Link
US (1) US5792673A (https=)
JP (1) JP3214279B2 (https=)
TW (1) TW294829B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115050664A (zh) * 2022-06-28 2022-09-13 上海中航光电子有限公司 一种检测电路及检测线宽刻蚀量的方法、显示装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5861660A (en) * 1995-08-21 1999-01-19 Stmicroelectronics, Inc. Integrated-circuit die suitable for wafer-level testing and method for forming the same
DE19651029C2 (de) * 1996-12-09 1999-12-02 Ibm Kalibrierstandard für Profilometer und Herstellverfahren
KR100257811B1 (ko) * 1997-10-24 2000-06-01 구본준 액정표시장치의 기판의 제조방법
US6555465B2 (en) * 1997-12-05 2003-04-29 Yamaha Corp. Multi-layer wiring structure of integrated circuit and manufacture of multi-layer wiring
US6094965A (en) * 1998-05-29 2000-08-01 Vlsi Technology, Inc. Semiconductor calibration structures and calibration wafers for ascertaining layer alignment during processing and calibrating multiple semiconductor wafer coating systems
JP2000276078A (ja) * 1999-03-23 2000-10-06 Sanyo Electric Co Ltd 有機エレクトロルミネッセンス表示装置
US20110037069A1 (en) * 2009-08-13 2011-02-17 Polar Semiconductor, Inc. Method and apparatus for visually determining etch depth

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5453864A (en) * 1977-10-05 1979-04-27 Sanyo Electric Co Ltd Monitoring method of line widths
JPS58180027A (ja) * 1982-04-16 1983-10-21 Oki Electric Ind Co Ltd 半導体装置の製造方法
KR890004566B1 (ko) * 1987-03-21 1989-11-15 삼성전자 주식회사 반도체 제조공정중의 패턴의 씨디변화를 모니타링하기 위한 테스트 패턴
JPH01105533A (ja) * 1987-10-19 1989-04-24 Hitachi Ltd 半導体装置の製造方法
JPH02207545A (ja) * 1989-02-07 1990-08-17 Fujitsu Ltd 半導体装置
JPH02208951A (ja) * 1989-02-08 1990-08-20 Fujitsu Ltd 半導体装置の測定方法
JPH02307266A (ja) * 1989-05-23 1990-12-20 Seiko Epson Corp 半導体集積回路装置
JPH02310942A (ja) * 1989-05-25 1990-12-26 Mitsubishi Electric Corp 半導体装置の製造検査装置
JPH0587246A (ja) * 1991-09-25 1993-04-06 Nippon Reinz Co Ltd メタルガスケツトの製造方法
JP3128947B2 (ja) * 1992-04-21 2001-01-29 ソニー株式会社 寸法測定セルのエッチングマスクパターン
JPH07153802A (ja) * 1993-11-30 1995-06-16 Nec Corp 半導体装置
JPH07201823A (ja) * 1993-12-28 1995-08-04 Sony Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115050664A (zh) * 2022-06-28 2022-09-13 上海中航光电子有限公司 一种检测电路及检测线宽刻蚀量的方法、显示装置

Also Published As

Publication number Publication date
US5792673A (en) 1998-08-11
TW294829B (https=) 1997-01-01
JPH08213369A (ja) 1996-08-20

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