JP3010784B2 - 低温紫外線硬化型エポキシ封止を有する半導体デバイスとその製法 - Google Patents

低温紫外線硬化型エポキシ封止を有する半導体デバイスとその製法

Info

Publication number
JP3010784B2
JP3010784B2 JP3130804A JP13080491A JP3010784B2 JP 3010784 B2 JP3010784 B2 JP 3010784B2 JP 3130804 A JP3130804 A JP 3130804A JP 13080491 A JP13080491 A JP 13080491A JP 3010784 B2 JP3010784 B2 JP 3010784B2
Authority
JP
Japan
Prior art keywords
semiconductor device
electronic component
package
ultraviolet
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3130804A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0621251A (ja
Inventor
モーリス・エス・カープマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Solutions Inc
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Solutions Inc, Motorola Inc filed Critical Motorola Solutions Inc
Publication of JPH0621251A publication Critical patent/JPH0621251A/ja
Application granted granted Critical
Publication of JP3010784B2 publication Critical patent/JP3010784B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W95/00—
    • H10W74/114—
    • H10W74/47—
    • H10W76/60—
    • H10W70/682—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP3130804A 1990-03-23 1991-03-22 低温紫外線硬化型エポキシ封止を有する半導体デバイスとその製法 Expired - Fee Related JP3010784B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/498,156 US5117279A (en) 1990-03-23 1990-03-23 Semiconductor device having a low temperature uv-cured epoxy seal
US498156 2000-02-04

Publications (2)

Publication Number Publication Date
JPH0621251A JPH0621251A (ja) 1994-01-28
JP3010784B2 true JP3010784B2 (ja) 2000-02-21

Family

ID=23979815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3130804A Expired - Fee Related JP3010784B2 (ja) 1990-03-23 1991-03-22 低温紫外線硬化型エポキシ封止を有する半導体デバイスとその製法

Country Status (4)

Country Link
US (1) US5117279A (enExample)
EP (1) EP0447884B1 (enExample)
JP (1) JP3010784B2 (enExample)
DE (1) DE69129668T2 (enExample)

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US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
CA2150569A1 (en) * 1992-12-09 1994-06-23 Dexin Liang Electronic package sealed with a dispensable adhesive
US5477008A (en) * 1993-03-19 1995-12-19 Olin Corporation Polymer plug for electronic packages
JPH0837252A (ja) * 1994-07-22 1996-02-06 Nec Corp 半導体装置
DE69528515T2 (de) * 1994-07-26 2003-04-24 Koninklijke Philips Electronics N.V., Eindhoven Herstellungsmethode eines oberflächen-montierbaren bauteils und dieser selbst
US6184575B1 (en) 1994-08-26 2001-02-06 National Semiconductor Corporation Ultra-thin composite package for integrated circuits
WO1996034517A1 (en) * 1995-04-26 1996-10-31 Buztronics, Inc. Electronic novelty assembly including a pin switch and embedded printed circuit component
US7041771B1 (en) * 1995-08-11 2006-05-09 Kac Holdings, Inc. Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
US5938956A (en) * 1996-09-10 1999-08-17 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
US6426484B1 (en) 1996-09-10 2002-07-30 Micron Technology, Inc. Circuit and method for heating an adhesive to package or rework a semiconductor die
US5689089A (en) * 1996-09-20 1997-11-18 Motorola, Inc. Electronic control module having fluid-tight seals of a polymer material which expands when wet
US6274927B1 (en) 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
JP4588837B2 (ja) * 2000-04-11 2010-12-01 浜松ホトニクス株式会社 半導体受光装置
US6432752B1 (en) * 2000-08-17 2002-08-13 Micron Technology, Inc. Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
US7127362B2 (en) 2000-08-22 2006-10-24 Mundt Randall S Process tolerant methods and apparatus for obtaining data
JP4003860B2 (ja) * 2000-11-02 2007-11-07 富士通株式会社 マイクロアクチュエータ及びその製造方法
US6376266B1 (en) * 2000-11-06 2002-04-23 Semiconductor Components Industries Llc Semiconductor package and method for forming same
US6747298B2 (en) 2001-07-23 2004-06-08 Cree, Inc. Collets for bonding of light emitting diodes having shaped substrates
US6888167B2 (en) 2001-07-23 2005-05-03 Cree, Inc. Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
US6861720B1 (en) 2001-08-29 2005-03-01 Amkor Technology, Inc. Placement template and method for placing optical dies
US6759266B1 (en) * 2001-09-04 2004-07-06 Amkor Technology, Inc. Quick sealing glass-lidded package fabrication method
US7276394B2 (en) * 2001-09-20 2007-10-02 Eastman Kodak Company Large area flat image sensor assembly
US20030054583A1 (en) * 2001-09-20 2003-03-20 Eastman Kodak Company Method for producing an image sensor assembly
US6507097B1 (en) * 2001-11-29 2003-01-14 Clarisay, Inc. Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same
US6784534B1 (en) 2002-02-06 2004-08-31 Amkor Technology, Inc. Thin integrated circuit package having an optically transparent window
JP3560161B1 (ja) * 2003-01-30 2004-09-02 日立化成工業株式会社 半導体封止用エポキシ樹脂組成物の製造方法
US7195953B2 (en) * 2003-04-02 2007-03-27 Yamaha Corporation Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
DE102004013816A1 (de) * 2004-03-20 2005-10-06 Robert Bosch Gmbh Verfahren zum Herstellen eines Sensormoduls und Sensormodul
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
EP1619726A1 (fr) * 2004-07-22 2006-01-25 St Microelectronics S.A. Boîtier optique pour capteur semiconducteur
KR100782798B1 (ko) * 2006-02-22 2007-12-05 삼성전기주식회사 기판 패키지 및 그 제조 방법
DE102006008793A1 (de) * 2006-02-24 2007-09-13 Osram Opto Semiconductors Gmbh Elektronisches Bauteil
EP2019424B1 (de) 2007-07-26 2016-11-23 SEMIKRON Elektronik GmbH & Co. KG Leistungshalbleitermodul mit Dichteinrichtung zum Substratträger und Herstellungsverfahren hierzu
US8421214B2 (en) * 2007-10-10 2013-04-16 Vishay General Semiconductor Llc Semiconductor device and method for manufacturing a semiconductor device
US9147813B2 (en) 2011-09-09 2015-09-29 Avago Technologies General Ip (Singapore) Pte. Ltd. High thermal conductivity and low degradation die attach with dual adhesive
EP3086364B1 (en) 2013-12-19 2021-01-27 Daishinku Corporation Electronic component-use package and piezoelectric device
US10170304B1 (en) 2017-10-25 2019-01-01 Globalfoundries Inc. Self-aligned nanotube structures

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US4000054A (en) * 1970-11-06 1976-12-28 Microsystems International Limited Method of making thin film crossover structure
US4141055A (en) * 1977-04-27 1979-02-20 Bell Telephone Laboratories, Incorporated Crossover structure for microelectronic circuits
US4480009A (en) * 1980-12-15 1984-10-30 M&T Chemicals Inc. Siloxane-containing polymers
EP0114258A1 (en) * 1982-11-30 1984-08-01 Kabushiki Kaisha Toshiba Resin encapsulation type photo-semiconductor devices
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4703338A (en) * 1983-10-14 1987-10-27 Daicel Chemical Industries, Ltd. Resin composition to seal electronic device
US4783697A (en) * 1985-01-07 1988-11-08 Motorola, Inc. Leadless chip carrier for RF power transistors or the like

Also Published As

Publication number Publication date
US5117279A (en) 1992-05-26
DE69129668D1 (de) 1998-08-06
EP0447884B1 (en) 1998-07-01
DE69129668T2 (de) 1999-03-11
EP0447884A2 (en) 1991-09-25
JPH0621251A (ja) 1994-01-28
EP0447884A3 (enExample) 1994-02-23

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Legal Events

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LAPS Cancellation because of no payment of annual fees