ATE225985T1 - Herstellungsmethode eines oberflächen- montierbaren bauteils und dieser selbst - Google Patents
Herstellungsmethode eines oberflächen- montierbaren bauteils und dieser selbstInfo
- Publication number
- ATE225985T1 ATE225985T1 AT95921959T AT95921959T ATE225985T1 AT E225985 T1 ATE225985 T1 AT E225985T1 AT 95921959 T AT95921959 T AT 95921959T AT 95921959 T AT95921959 T AT 95921959T AT E225985 T1 ATE225985 T1 AT E225985T1
- Authority
- AT
- Austria
- Prior art keywords
- itself
- production
- mount component
- semiconductor
- package leads
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 5
- 239000000463 material Substances 0.000 abstract 2
Classifications
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP94202182 | 1994-07-26 | ||
PCT/IB1995/000539 WO1996003772A2 (en) | 1994-07-26 | 1995-07-05 | Method of manufacturing a semiconductor device for surface mounting, and semiconductor device for surface mounting |
Publications (1)
Publication Number | Publication Date |
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ATE225985T1 true ATE225985T1 (de) | 2002-10-15 |
Family
ID=8217069
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02077552T ATE350765T1 (de) | 1994-07-26 | 1995-07-05 | Verfahren zur herstellung einer halbleitervorrichtunng und eine halbleitervorrichtung |
AT95921959T ATE225985T1 (de) | 1994-07-26 | 1995-07-05 | Herstellungsmethode eines oberflächen- montierbaren bauteils und dieser selbst |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02077552T ATE350765T1 (de) | 1994-07-26 | 1995-07-05 | Verfahren zur herstellung einer halbleitervorrichtunng und eine halbleitervorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US5753537A (de) |
EP (2) | EP0721661B1 (de) |
KR (1) | KR100380701B1 (de) |
AT (2) | ATE350765T1 (de) |
DE (2) | DE69528515T2 (de) |
TW (1) | TW345728B (de) |
WO (1) | WO1996003772A2 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100372136B1 (ko) * | 1995-05-10 | 2003-03-15 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 반도체디바이스및그제조에적합한캐리어로드 |
EP0860876A3 (de) * | 1997-02-21 | 1999-09-22 | DaimlerChrysler AG | Anordnung und Verfahren zur Herstellung von CSP-Gehäusen für elektrische Bauteile |
KR100390897B1 (ko) * | 1997-12-29 | 2003-08-19 | 주식회사 하이닉스반도체 | 칩 크기 패키지의 제조방법 |
DE19818036B4 (de) * | 1998-04-22 | 2005-05-19 | Siemens Ag | Verfahren zur Herstellung eines elektrotechnischen Bauteils mit einer kunststoffpassivierten Oberfläche, derartiges Bauteil und Anwendung dieses Bauteils |
KR100294449B1 (ko) * | 1998-07-15 | 2001-07-12 | 윤종용 | 본딩패드하부에형성되는커패시터를구비한반도체집적회로장치 |
US6429036B1 (en) * | 1999-01-14 | 2002-08-06 | Micron Technology, Inc. | Backside illumination of CMOS image sensor |
JP2003501839A (ja) | 1999-06-03 | 2003-01-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体装置用接続配置およびその製造方法 |
WO2001004956A1 (en) | 1999-07-10 | 2001-01-18 | Koninklijke Philips Electronics N.V. | Semiconductor device and method of manufacturing same |
US6538328B1 (en) * | 1999-11-10 | 2003-03-25 | Em Microelectronic | Metal film protection of the surface of a structure formed on a semiconductor substrate during etching of the substrate by a KOH etchant |
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-
1995
- 1995-07-05 AT AT02077552T patent/ATE350765T1/de not_active IP Right Cessation
- 1995-07-05 KR KR1019960701653A patent/KR100380701B1/ko not_active IP Right Cessation
- 1995-07-05 AT AT95921959T patent/ATE225985T1/de not_active IP Right Cessation
- 1995-07-05 WO PCT/IB1995/000539 patent/WO1996003772A2/en active IP Right Grant
- 1995-07-05 EP EP95921959A patent/EP0721661B1/de not_active Expired - Lifetime
- 1995-07-05 EP EP02077552A patent/EP1251557B1/de not_active Expired - Lifetime
- 1995-07-05 DE DE69528515T patent/DE69528515T2/de not_active Expired - Lifetime
- 1995-07-05 DE DE69535361T patent/DE69535361T2/de not_active Expired - Lifetime
- 1995-07-11 TW TW084107164A patent/TW345728B/zh active
-
1997
- 1997-01-31 US US08/792,338 patent/US5753537A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW345728B (en) | 1998-11-21 |
KR100380701B1 (ko) | 2003-07-22 |
DE69528515T2 (de) | 2003-04-24 |
ATE350765T1 (de) | 2007-01-15 |
EP1251557A2 (de) | 2002-10-23 |
EP0721661B1 (de) | 2002-10-09 |
DE69535361T2 (de) | 2007-10-04 |
EP0721661A1 (de) | 1996-07-17 |
US5753537A (en) | 1998-05-19 |
KR960705353A (ko) | 1996-10-09 |
EP1251557B1 (de) | 2007-01-03 |
DE69535361D1 (de) | 2007-02-15 |
DE69528515D1 (de) | 2002-11-14 |
WO1996003772A2 (en) | 1996-02-08 |
WO1996003772A3 (en) | 1996-04-18 |
EP1251557A3 (de) | 2003-04-09 |
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