JP2958136B2 - 半導体集積回路装置、その製造方法および実装構造 - Google Patents
半導体集積回路装置、その製造方法および実装構造Info
- Publication number
- JP2958136B2 JP2958136B2 JP3042158A JP4215891A JP2958136B2 JP 2958136 B2 JP2958136 B2 JP 2958136B2 JP 3042158 A JP3042158 A JP 3042158A JP 4215891 A JP4215891 A JP 4215891A JP 2958136 B2 JP2958136 B2 JP 2958136B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- package body
- circuit device
- chip
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3042158A JP2958136B2 (ja) | 1991-03-08 | 1991-03-08 | 半導体集積回路装置、その製造方法および実装構造 |
KR1019920002524A KR100218083B1 (ko) | 1991-03-08 | 1992-02-20 | 반도체집적회로장치와 그 제조방법 및 내장구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3042158A JP2958136B2 (ja) | 1991-03-08 | 1991-03-08 | 半導体集積回路装置、その製造方法および実装構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04280458A JPH04280458A (ja) | 1992-10-06 |
JP2958136B2 true JP2958136B2 (ja) | 1999-10-06 |
Family
ID=12628145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3042158A Expired - Fee Related JP2958136B2 (ja) | 1991-03-08 | 1991-03-08 | 半導体集積回路装置、その製造方法および実装構造 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2958136B2 (ko) |
KR (1) | KR100218083B1 (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6826827B1 (en) | 1994-12-29 | 2004-12-07 | Tessera, Inc. | Forming conductive posts by selective removal of conductive material |
US6211572B1 (en) * | 1995-10-31 | 2001-04-03 | Tessera, Inc. | Semiconductor chip package with fan-in leads |
US6284563B1 (en) | 1995-10-31 | 2001-09-04 | Tessera, Inc. | Method of making compliant microelectronic assemblies |
TW448524B (en) | 1997-01-17 | 2001-08-01 | Seiko Epson Corp | Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment |
JP3335575B2 (ja) | 1997-06-06 | 2002-10-21 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
WO2000079589A1 (de) * | 1999-06-17 | 2000-12-28 | Infineon Technologies Ag | Elektronisches bauelement mit flexiblen kontaktierungsstellen und verfahren zum herstellen eines derartigen bauelements |
DE10016132A1 (de) | 2000-03-31 | 2001-10-18 | Infineon Technologies Ag | Elektronisches Bauelement mit flexiblen Kontaktierungsstellen und Verfahren zu dessen Herstellung |
DE10116069C2 (de) | 2001-04-02 | 2003-02-20 | Infineon Technologies Ag | Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zu seiner Herstellung |
JP4539268B2 (ja) * | 2004-09-29 | 2010-09-08 | セイコーエプソン株式会社 | 実装構造体 |
JP4224717B2 (ja) | 2005-07-11 | 2009-02-18 | セイコーエプソン株式会社 | 半導体装置 |
JP4296434B2 (ja) * | 2005-09-13 | 2009-07-15 | セイコーエプソン株式会社 | 半導体装置 |
US9137903B2 (en) | 2010-12-21 | 2015-09-15 | Tessera, Inc. | Semiconductor chip assembly and method for making same |
-
1991
- 1991-03-08 JP JP3042158A patent/JP2958136B2/ja not_active Expired - Fee Related
-
1992
- 1992-02-20 KR KR1019920002524A patent/KR100218083B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH04280458A (ja) | 1992-10-06 |
KR100218083B1 (ko) | 1999-09-01 |
KR920018909A (ko) | 1992-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6768190B2 (en) | Stack type flip-chip package | |
KR100209993B1 (ko) | 필름 캐리어 반도체 장치 | |
US8653655B2 (en) | Semiconductor device and manufacturing method thereof | |
US6414381B1 (en) | Interposer for separating stacked semiconductor chips mounted on a multi-layer printed circuit board | |
US7939924B2 (en) | Stack type ball grid array package and method for manufacturing the same | |
US7115441B2 (en) | Semiconductor package with semiconductor chips stacked therein and method of making the package | |
US20040251531A1 (en) | Stack type flip-chip package | |
US20020140085A1 (en) | Semiconductor package including passive elements and method of manufacture | |
US20070069371A1 (en) | Cavity chip package | |
US20060097402A1 (en) | Semiconductor device having flip-chip package and method for fabricating the same | |
KR20080094251A (ko) | 웨이퍼 레벨 패키지 및 그 제조방법 | |
JPH0595015A (ja) | 半導体装置 | |
US6277670B1 (en) | Semiconductor chip package and fabrication method thereof | |
US20060284298A1 (en) | Chip stack package having same length bonding leads | |
JP2958136B2 (ja) | 半導体集積回路装置、その製造方法および実装構造 | |
US5514905A (en) | Semiconductor device | |
US6097081A (en) | Semiconductor device having adhesive between lead and chip | |
JPH1056093A (ja) | 半導体装置およびその半導体装置を組み込んだ電子装置 | |
US20040130036A1 (en) | Mult-chip module | |
US7030489B2 (en) | Multi-chip module having bonding wires and method of fabricating the same | |
JP3547303B2 (ja) | 半導体装置の製造方法 | |
JP3339881B2 (ja) | 半導体集積回路装置およびその製造方法 | |
US6911721B2 (en) | Semiconductor device, method for manufacturing semiconductor device and electronic equipment | |
JP2002026073A (ja) | 半導体装置およびその製造方法 | |
KR100673378B1 (ko) | 칩 스케일 적층 칩 패키지와 그 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080723 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080723 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090723 Year of fee payment: 10 |
|
LAPS | Cancellation because of no payment of annual fees |