JP2922375B2 - セラミック・オン金属回路基板およびその製造方法 - Google Patents

セラミック・オン金属回路基板およびその製造方法

Info

Publication number
JP2922375B2
JP2922375B2 JP4356082A JP35608292A JP2922375B2 JP 2922375 B2 JP2922375 B2 JP 2922375B2 JP 4356082 A JP4356082 A JP 4356082A JP 35608292 A JP35608292 A JP 35608292A JP 2922375 B2 JP2922375 B2 JP 2922375B2
Authority
JP
Japan
Prior art keywords
ceramic
glass
metal
fired
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4356082A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05270934A (ja
Inventor
チヤウダリ チエルクリ サテイアム
ステイーブン オニシユケビイチ ルボミル
ナラヤン プラブー アシヨク
ジエイ サラー バリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JENERARU EREKUTORITSUKU CO
Original Assignee
JENERARU EREKUTORITSUKU CO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/809,372 external-priority patent/US5277724A/en
Priority claimed from US07/809,371 external-priority patent/US5256469A/en
Application filed by JENERARU EREKUTORITSUKU CO filed Critical JENERARU EREKUTORITSUKU CO
Publication of JPH05270934A publication Critical patent/JPH05270934A/ja
Application granted granted Critical
Publication of JP2922375B2 publication Critical patent/JP2922375B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Glass Compositions (AREA)
JP4356082A 1991-12-18 1992-12-18 セラミック・オン金属回路基板およびその製造方法 Expired - Fee Related JP2922375B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US809372 1991-12-18
US809371 1991-12-18
US07/809,372 US5277724A (en) 1991-12-18 1991-12-18 Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board
US07/809,371 US5256469A (en) 1991-12-18 1991-12-18 Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging

Publications (2)

Publication Number Publication Date
JPH05270934A JPH05270934A (ja) 1993-10-19
JP2922375B2 true JP2922375B2 (ja) 1999-07-19

Family

ID=27123219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4356082A Expired - Fee Related JP2922375B2 (ja) 1991-12-18 1992-12-18 セラミック・オン金属回路基板およびその製造方法

Country Status (5)

Country Link
JP (1) JP2922375B2 (https=)
KR (1) KR970008145B1 (https=)
DE (1) DE4243040C2 (https=)
GB (1) GB2263253B (https=)
SG (1) SG50478A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6233817B1 (en) * 1999-01-17 2001-05-22 Delphi Technologies, Inc. Method of forming thick-film hybrid circuit on a metal circuit board
KR100382416B1 (ko) * 1999-09-28 2003-05-01 가부시끼가이샤 도시바 세라믹 회로기판
KR100696859B1 (ko) * 1999-12-10 2007-03-19 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 제조 방법
KR100696861B1 (ko) * 1999-12-10 2007-03-19 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 제조 방법
DE10148751A1 (de) * 2001-10-02 2003-04-17 Siemens Ag Verfahren zur Herstellung einer Elektronikeinheit sowie Elektronikeinheit
US20100089620A1 (en) * 2006-11-30 2010-04-15 Richard Matz Electronic Component Module and Method for the Production Thereof
JP5585649B2 (ja) * 2010-03-30 2014-09-10 株式会社村田製作所 金属ベース基板およびその製造方法
JP6285271B2 (ja) * 2014-04-24 2018-02-28 株式会社ノリタケカンパニーリミテド 接合材およびその利用
JP6577763B2 (ja) * 2015-06-23 2019-09-18 イビデン株式会社 エンジンバルブ及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3954486A (en) * 1974-07-30 1976-05-04 Owens-Illinois, Inc. Solder glass with refractory filler
US4185139A (en) * 1977-12-30 1980-01-22 International Standard Electric Corporation Filler for a glass-ceramic material comprising CaF2 granules overcoated with a silicon dioxide film
JPS55140732A (en) * 1979-04-19 1980-11-04 Chloride Silent Power Ltd Sealing glass
US4256796A (en) * 1979-11-05 1981-03-17 Rca Corporation Partially devitrified porcelain composition and articles prepared with same
JPS5911700A (ja) * 1982-07-12 1984-01-21 株式会社日立製作所 セラミツク多層配線回路板
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system
US5041695A (en) * 1989-06-01 1991-08-20 Westinghouse Electric Corp. Co-fired ceramic package for a power circuit

Also Published As

Publication number Publication date
JPH05270934A (ja) 1993-10-19
KR930015993A (ko) 1993-07-24
GB9226220D0 (en) 1993-02-10
DE4243040A1 (https=) 1993-06-24
SG50478A1 (en) 1998-07-20
KR970008145B1 (ko) 1997-05-21
GB2263253B (en) 1996-02-07
GB2263253A (en) 1993-07-21
DE4243040C2 (de) 1999-06-17

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