KR970008145B1 - 세라믹-온 금속-회로 기판 및 그 제조방법 - Google Patents

세라믹-온 금속-회로 기판 및 그 제조방법 Download PDF

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Publication number
KR970008145B1
KR970008145B1 KR1019920024285A KR920024285A KR970008145B1 KR 970008145 B1 KR970008145 B1 KR 970008145B1 KR 1019920024285 A KR1019920024285 A KR 1019920024285A KR 920024285 A KR920024285 A KR 920024285A KR 970008145 B1 KR970008145 B1 KR 970008145B1
Authority
KR
South Korea
Prior art keywords
ceramic
glass
circuit board
metal
bonding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920024285A
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English (en)
Korean (ko)
Other versions
KR930015993A (ko
Inventor
쵸대리 체루쿠리 새트얌
스테핀 오니쉬케비치 루버미르
나라얀 프라뷰 아쇼크
제이 델러 베리
Original Assignee
제너럴 일렉트릭 컴페니
데니스 에이치. 어얼백
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/809,372 external-priority patent/US5277724A/en
Priority claimed from US07/809,371 external-priority patent/US5256469A/en
Application filed by 제너럴 일렉트릭 컴페니, 데니스 에이치. 어얼백 filed Critical 제너럴 일렉트릭 컴페니
Publication of KR930015993A publication Critical patent/KR930015993A/ko
Application granted granted Critical
Publication of KR970008145B1 publication Critical patent/KR970008145B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Glass Compositions (AREA)
KR1019920024285A 1991-12-18 1992-12-15 세라믹-온 금속-회로 기판 및 그 제조방법 Expired - Fee Related KR970008145B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US07/809,372 US5277724A (en) 1991-12-18 1991-12-18 Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board
US07/809,371 US5256469A (en) 1991-12-18 1991-12-18 Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
US809,372 1991-12-18
US07/809,371 1991-12-18
US07/809,372 1991-12-18
US809,371 1991-12-18

Publications (2)

Publication Number Publication Date
KR930015993A KR930015993A (ko) 1993-07-24
KR970008145B1 true KR970008145B1 (ko) 1997-05-21

Family

ID=27123219

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920024285A Expired - Fee Related KR970008145B1 (ko) 1991-12-18 1992-12-15 세라믹-온 금속-회로 기판 및 그 제조방법

Country Status (5)

Country Link
JP (1) JP2922375B2 (https=)
KR (1) KR970008145B1 (https=)
DE (1) DE4243040C2 (https=)
GB (1) GB2263253B (https=)
SG (1) SG50478A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100382416B1 (ko) * 1999-09-28 2003-05-01 가부시끼가이샤 도시바 세라믹 회로기판

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6233817B1 (en) * 1999-01-17 2001-05-22 Delphi Technologies, Inc. Method of forming thick-film hybrid circuit on a metal circuit board
KR100696859B1 (ko) * 1999-12-10 2007-03-19 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 제조 방법
KR100696861B1 (ko) * 1999-12-10 2007-03-19 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 제조 방법
DE10148751A1 (de) * 2001-10-02 2003-04-17 Siemens Ag Verfahren zur Herstellung einer Elektronikeinheit sowie Elektronikeinheit
US20100089620A1 (en) * 2006-11-30 2010-04-15 Richard Matz Electronic Component Module and Method for the Production Thereof
JP5585649B2 (ja) * 2010-03-30 2014-09-10 株式会社村田製作所 金属ベース基板およびその製造方法
JP6285271B2 (ja) * 2014-04-24 2018-02-28 株式会社ノリタケカンパニーリミテド 接合材およびその利用
JP6577763B2 (ja) * 2015-06-23 2019-09-18 イビデン株式会社 エンジンバルブ及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3954486A (en) * 1974-07-30 1976-05-04 Owens-Illinois, Inc. Solder glass with refractory filler
US4185139A (en) * 1977-12-30 1980-01-22 International Standard Electric Corporation Filler for a glass-ceramic material comprising CaF2 granules overcoated with a silicon dioxide film
JPS55140732A (en) * 1979-04-19 1980-11-04 Chloride Silent Power Ltd Sealing glass
US4256796A (en) * 1979-11-05 1981-03-17 Rca Corporation Partially devitrified porcelain composition and articles prepared with same
JPS5911700A (ja) * 1982-07-12 1984-01-21 株式会社日立製作所 セラミツク多層配線回路板
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system
US5041695A (en) * 1989-06-01 1991-08-20 Westinghouse Electric Corp. Co-fired ceramic package for a power circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100382416B1 (ko) * 1999-09-28 2003-05-01 가부시끼가이샤 도시바 세라믹 회로기판

Also Published As

Publication number Publication date
JPH05270934A (ja) 1993-10-19
KR930015993A (ko) 1993-07-24
GB9226220D0 (en) 1993-02-10
DE4243040A1 (https=) 1993-06-24
SG50478A1 (en) 1998-07-20
GB2263253B (en) 1996-02-07
JP2922375B2 (ja) 1999-07-19
GB2263253A (en) 1993-07-21
DE4243040C2 (de) 1999-06-17

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