JP2696750B2 - 半導体素子のパターン形成方法 - Google Patents

半導体素子のパターン形成方法

Info

Publication number
JP2696750B2
JP2696750B2 JP7188985A JP18898595A JP2696750B2 JP 2696750 B2 JP2696750 B2 JP 2696750B2 JP 7188985 A JP7188985 A JP 7188985A JP 18898595 A JP18898595 A JP 18898595A JP 2696750 B2 JP2696750 B2 JP 2696750B2
Authority
JP
Japan
Prior art keywords
layer
photosensitive film
colloid
pattern
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7188985A
Other languages
English (en)
Japanese (ja)
Other versions
JPH08172098A (ja
Inventor
儁 黄
容 和 金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hynix Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of JPH08172098A publication Critical patent/JPH08172098A/ja
Application granted granted Critical
Publication of JP2696750B2 publication Critical patent/JP2696750B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
JP7188985A 1994-07-28 1995-07-25 半導体素子のパターン形成方法 Expired - Fee Related JP2696750B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR94-18404 1994-07-28
KR1019940018404A KR0148610B1 (ko) 1994-07-28 1994-07-28 반도체 소자의 패턴 형성방법

Publications (2)

Publication Number Publication Date
JPH08172098A JPH08172098A (ja) 1996-07-02
JP2696750B2 true JP2696750B2 (ja) 1998-01-14

Family

ID=19389106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7188985A Expired - Fee Related JP2696750B2 (ja) 1994-07-28 1995-07-25 半導体素子のパターン形成方法

Country Status (4)

Country Link
JP (1) JP2696750B2 (ko)
KR (1) KR0148610B1 (ko)
CN (1) CN1124406A (ko)
GB (1) GB2291977A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200425327A (en) * 2003-02-21 2004-11-16 Matsushita Electric Ind Co Ltd Method and apparatus for liquid etching
JP2005077955A (ja) * 2003-09-02 2005-03-24 Sanyo Electric Co Ltd エッチング方法およびそれを用いた回路装置の製造方法
JP4519512B2 (ja) * 2004-04-28 2010-08-04 株式会社半導体エネルギー研究所 半導体装置の作製方法、除去方法
US7852456B2 (en) * 2004-10-13 2010-12-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5053318A (en) * 1989-05-18 1991-10-01 Shipley Company Inc. Plasma processing with metal mask integration

Also Published As

Publication number Publication date
KR0148610B1 (ko) 1998-12-01
GB9515148D0 (en) 1995-09-20
CN1124406A (zh) 1996-06-12
JPH08172098A (ja) 1996-07-02
GB2291977A (en) 1996-02-07

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