JP2638571B2 - 半導体装置の入力保護装置 - Google Patents

半導体装置の入力保護装置

Info

Publication number
JP2638571B2
JP2638571B2 JP7155821A JP15582195A JP2638571B2 JP 2638571 B2 JP2638571 B2 JP 2638571B2 JP 7155821 A JP7155821 A JP 7155821A JP 15582195 A JP15582195 A JP 15582195A JP 2638571 B2 JP2638571 B2 JP 2638571B2
Authority
JP
Japan
Prior art keywords
diffusion layer
type diffusion
conductivity type
input signal
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7155821A
Other languages
English (en)
Japanese (ja)
Other versions
JPH098232A (ja
Inventor
淳範 三木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP7155821A priority Critical patent/JP2638571B2/ja
Priority to TW085107497A priority patent/TW322631B/zh
Priority to CN96110768A priority patent/CN1116703C/zh
Priority to KR1019960023023A priority patent/KR100210554B1/ko
Priority to US08/668,908 priority patent/US5895958A/en
Publication of JPH098232A publication Critical patent/JPH098232A/ja
Application granted granted Critical
Publication of JP2638571B2 publication Critical patent/JP2638571B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
JP7155821A 1995-06-22 1995-06-22 半導体装置の入力保護装置 Expired - Fee Related JP2638571B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP7155821A JP2638571B2 (ja) 1995-06-22 1995-06-22 半導体装置の入力保護装置
TW085107497A TW322631B (enExample) 1995-06-22 1996-06-22
CN96110768A CN1116703C (zh) 1995-06-22 1996-06-22 用于改善静电击穿电压的半导体器件的输入保护电路
KR1019960023023A KR100210554B1 (ko) 1995-06-22 1996-06-22 반도체 장치의 입력 보호 회로
US08/668,908 US5895958A (en) 1995-06-22 1996-06-24 Input protection circuit for use in semiconductor device having an improved electrostatic breakdown voltage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7155821A JP2638571B2 (ja) 1995-06-22 1995-06-22 半導体装置の入力保護装置

Publications (2)

Publication Number Publication Date
JPH098232A JPH098232A (ja) 1997-01-10
JP2638571B2 true JP2638571B2 (ja) 1997-08-06

Family

ID=15614230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7155821A Expired - Fee Related JP2638571B2 (ja) 1995-06-22 1995-06-22 半導体装置の入力保護装置

Country Status (5)

Country Link
US (1) US5895958A (enExample)
JP (1) JP2638571B2 (enExample)
KR (1) KR100210554B1 (enExample)
CN (1) CN1116703C (enExample)
TW (1) TW322631B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6218704B1 (en) * 1997-05-07 2001-04-17 International Business Machines Corporation ESD protection structure and method
JP4376348B2 (ja) * 1998-05-18 2009-12-02 パナソニック株式会社 半導体装置
US6355508B1 (en) * 1998-09-02 2002-03-12 Micron Technology, Inc. Method for forming electrostatic discharge protection device having a graded junction
KR20000018511A (ko) * 1998-09-02 2000-04-06 김영환 바이어스 전압 발생기의 레이 아웃방법
US5960290A (en) * 1998-10-29 1999-09-28 United Microelectronics Corp. Method for fabricating a protection circuit of electrostatic discharge on a field device
US6114194A (en) * 1998-11-17 2000-09-05 United Microelectronics Corp. Method for fabricating a field device transistor
US6285062B1 (en) * 1999-05-12 2001-09-04 Micron Technology, Inc. Adjustable high-trigger-voltage electrostatic discharge protection device
DE19934413A1 (de) * 1999-07-22 2001-01-25 Siemens Ag Vorrichtung zum Einbringen eines Zuschlagstoffes in ein Abgas
US6396107B1 (en) 2000-11-20 2002-05-28 International Business Machines Corporation Trench-defined silicon germanium ESD diode network
CN100388481C (zh) * 2003-12-24 2008-05-14 上海华虹Nec电子有限公司 集成电路芯片结构
FR2918504B1 (fr) * 2007-07-06 2009-11-27 St Microelectronics Sa Resistance integree diffusee
CN101819993B (zh) * 2010-04-13 2011-07-06 东南大学 降低热载流子效应的p型横向绝缘栅双极型器件
JP2013172085A (ja) * 2012-02-22 2013-09-02 Asahi Kasei Electronics Co Ltd 半導体装置の製造方法及び半導体装置
JP6664261B2 (ja) * 2016-04-07 2020-03-13 キヤノン株式会社 半導体装置及び液体吐出ヘッド用基板
CN109712972B (zh) * 2017-10-26 2024-06-04 上海维安电子股份有限公司 一种过压保护芯片的版图结构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4602267A (en) * 1981-02-17 1986-07-22 Fujitsu Limited Protection element for semiconductor device
JPH03120751A (ja) * 1989-10-03 1991-05-22 Sharp Corp 半導体素子の静電保護装置

Also Published As

Publication number Publication date
KR970003928A (ko) 1997-01-29
CN1116703C (zh) 2003-07-30
CN1147152A (zh) 1997-04-09
JPH098232A (ja) 1997-01-10
KR100210554B1 (ko) 1999-07-15
TW322631B (enExample) 1997-12-11
US5895958A (en) 1999-04-20

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