JP2638571B2 - 半導体装置の入力保護装置 - Google Patents
半導体装置の入力保護装置Info
- Publication number
- JP2638571B2 JP2638571B2 JP7155821A JP15582195A JP2638571B2 JP 2638571 B2 JP2638571 B2 JP 2638571B2 JP 7155821 A JP7155821 A JP 7155821A JP 15582195 A JP15582195 A JP 15582195A JP 2638571 B2 JP2638571 B2 JP 2638571B2
- Authority
- JP
- Japan
- Prior art keywords
- diffusion layer
- type diffusion
- conductivity type
- input signal
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7155821A JP2638571B2 (ja) | 1995-06-22 | 1995-06-22 | 半導体装置の入力保護装置 |
| TW085107497A TW322631B (enExample) | 1995-06-22 | 1996-06-22 | |
| CN96110768A CN1116703C (zh) | 1995-06-22 | 1996-06-22 | 用于改善静电击穿电压的半导体器件的输入保护电路 |
| KR1019960023023A KR100210554B1 (ko) | 1995-06-22 | 1996-06-22 | 반도체 장치의 입력 보호 회로 |
| US08/668,908 US5895958A (en) | 1995-06-22 | 1996-06-24 | Input protection circuit for use in semiconductor device having an improved electrostatic breakdown voltage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7155821A JP2638571B2 (ja) | 1995-06-22 | 1995-06-22 | 半導体装置の入力保護装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH098232A JPH098232A (ja) | 1997-01-10 |
| JP2638571B2 true JP2638571B2 (ja) | 1997-08-06 |
Family
ID=15614230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7155821A Expired - Fee Related JP2638571B2 (ja) | 1995-06-22 | 1995-06-22 | 半導体装置の入力保護装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5895958A (enExample) |
| JP (1) | JP2638571B2 (enExample) |
| KR (1) | KR100210554B1 (enExample) |
| CN (1) | CN1116703C (enExample) |
| TW (1) | TW322631B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6218704B1 (en) * | 1997-05-07 | 2001-04-17 | International Business Machines Corporation | ESD protection structure and method |
| JP4376348B2 (ja) * | 1998-05-18 | 2009-12-02 | パナソニック株式会社 | 半導体装置 |
| US6355508B1 (en) * | 1998-09-02 | 2002-03-12 | Micron Technology, Inc. | Method for forming electrostatic discharge protection device having a graded junction |
| KR20000018511A (ko) * | 1998-09-02 | 2000-04-06 | 김영환 | 바이어스 전압 발생기의 레이 아웃방법 |
| US5960290A (en) * | 1998-10-29 | 1999-09-28 | United Microelectronics Corp. | Method for fabricating a protection circuit of electrostatic discharge on a field device |
| US6114194A (en) * | 1998-11-17 | 2000-09-05 | United Microelectronics Corp. | Method for fabricating a field device transistor |
| US6285062B1 (en) * | 1999-05-12 | 2001-09-04 | Micron Technology, Inc. | Adjustable high-trigger-voltage electrostatic discharge protection device |
| DE19934413A1 (de) * | 1999-07-22 | 2001-01-25 | Siemens Ag | Vorrichtung zum Einbringen eines Zuschlagstoffes in ein Abgas |
| US6396107B1 (en) | 2000-11-20 | 2002-05-28 | International Business Machines Corporation | Trench-defined silicon germanium ESD diode network |
| CN100388481C (zh) * | 2003-12-24 | 2008-05-14 | 上海华虹Nec电子有限公司 | 集成电路芯片结构 |
| FR2918504B1 (fr) * | 2007-07-06 | 2009-11-27 | St Microelectronics Sa | Resistance integree diffusee |
| CN101819993B (zh) * | 2010-04-13 | 2011-07-06 | 东南大学 | 降低热载流子效应的p型横向绝缘栅双极型器件 |
| JP2013172085A (ja) * | 2012-02-22 | 2013-09-02 | Asahi Kasei Electronics Co Ltd | 半導体装置の製造方法及び半導体装置 |
| JP6664261B2 (ja) * | 2016-04-07 | 2020-03-13 | キヤノン株式会社 | 半導体装置及び液体吐出ヘッド用基板 |
| CN109712972B (zh) * | 2017-10-26 | 2024-06-04 | 上海维安电子股份有限公司 | 一种过压保护芯片的版图结构 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4602267A (en) * | 1981-02-17 | 1986-07-22 | Fujitsu Limited | Protection element for semiconductor device |
| JPH03120751A (ja) * | 1989-10-03 | 1991-05-22 | Sharp Corp | 半導体素子の静電保護装置 |
-
1995
- 1995-06-22 JP JP7155821A patent/JP2638571B2/ja not_active Expired - Fee Related
-
1996
- 1996-06-22 TW TW085107497A patent/TW322631B/zh active
- 1996-06-22 CN CN96110768A patent/CN1116703C/zh not_active Expired - Fee Related
- 1996-06-22 KR KR1019960023023A patent/KR100210554B1/ko not_active Expired - Fee Related
- 1996-06-24 US US08/668,908 patent/US5895958A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR970003928A (ko) | 1997-01-29 |
| CN1116703C (zh) | 2003-07-30 |
| CN1147152A (zh) | 1997-04-09 |
| JPH098232A (ja) | 1997-01-10 |
| KR100210554B1 (ko) | 1999-07-15 |
| TW322631B (enExample) | 1997-12-11 |
| US5895958A (en) | 1999-04-20 |
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