JP2565303Y2 - 半導体パッケージ用セラミック基板 - Google Patents

半導体パッケージ用セラミック基板

Info

Publication number
JP2565303Y2
JP2565303Y2 JP1990405558U JP40555890U JP2565303Y2 JP 2565303 Y2 JP2565303 Y2 JP 2565303Y2 JP 1990405558 U JP1990405558 U JP 1990405558U JP 40555890 U JP40555890 U JP 40555890U JP 2565303 Y2 JP2565303 Y2 JP 2565303Y2
Authority
JP
Japan
Prior art keywords
ceramic substrate
semiconductor package
chipping
depth
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990405558U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0492649U (cs
Inventor
元秀 荒山
昌克 遠藤
浩二 曽我
忠寿 山本
和彦 松瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990405558U priority Critical patent/JP2565303Y2/ja
Publication of JPH0492649U publication Critical patent/JPH0492649U/ja
Application granted granted Critical
Publication of JP2565303Y2 publication Critical patent/JP2565303Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP1990405558U 1990-12-28 1990-12-28 半導体パッケージ用セラミック基板 Expired - Fee Related JP2565303Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990405558U JP2565303Y2 (ja) 1990-12-28 1990-12-28 半導体パッケージ用セラミック基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990405558U JP2565303Y2 (ja) 1990-12-28 1990-12-28 半導体パッケージ用セラミック基板

Publications (2)

Publication Number Publication Date
JPH0492649U JPH0492649U (cs) 1992-08-12
JP2565303Y2 true JP2565303Y2 (ja) 1998-03-18

Family

ID=31882960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990405558U Expired - Fee Related JP2565303Y2 (ja) 1990-12-28 1990-12-28 半導体パッケージ用セラミック基板

Country Status (1)

Country Link
JP (1) JP2565303Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5617574B2 (ja) * 2010-12-01 2014-11-05 株式会社村田製作所 セラミック多層基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731549Y2 (ja) * 1988-11-11 1995-07-19 京セラ株式会社 半導体パッケージ用セラミック基板

Also Published As

Publication number Publication date
JPH0492649U (cs) 1992-08-12

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