JP2565303Y2 - 半導体パッケージ用セラミック基板 - Google Patents

半導体パッケージ用セラミック基板

Info

Publication number
JP2565303Y2
JP2565303Y2 JP1990405558U JP40555890U JP2565303Y2 JP 2565303 Y2 JP2565303 Y2 JP 2565303Y2 JP 1990405558 U JP1990405558 U JP 1990405558U JP 40555890 U JP40555890 U JP 40555890U JP 2565303 Y2 JP2565303 Y2 JP 2565303Y2
Authority
JP
Japan
Prior art keywords
ceramic substrate
semiconductor package
chipping
depth
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990405558U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0492649U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
元秀 荒山
昌克 遠藤
浩二 曽我
忠寿 山本
和彦 松瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP1990405558U priority Critical patent/JP2565303Y2/ja
Publication of JPH0492649U publication Critical patent/JPH0492649U/ja
Application granted granted Critical
Publication of JP2565303Y2 publication Critical patent/JP2565303Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP1990405558U 1990-12-28 1990-12-28 半導体パッケージ用セラミック基板 Expired - Fee Related JP2565303Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990405558U JP2565303Y2 (ja) 1990-12-28 1990-12-28 半導体パッケージ用セラミック基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990405558U JP2565303Y2 (ja) 1990-12-28 1990-12-28 半導体パッケージ用セラミック基板

Publications (2)

Publication Number Publication Date
JPH0492649U JPH0492649U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-08-12
JP2565303Y2 true JP2565303Y2 (ja) 1998-03-18

Family

ID=31882960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990405558U Expired - Fee Related JP2565303Y2 (ja) 1990-12-28 1990-12-28 半導体パッケージ用セラミック基板

Country Status (1)

Country Link
JP (1) JP2565303Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5617574B2 (ja) * 2010-12-01 2014-11-05 株式会社村田製作所 セラミック多層基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731549Y2 (ja) * 1988-11-11 1995-07-19 京セラ株式会社 半導体パッケージ用セラミック基板

Also Published As

Publication number Publication date
JPH0492649U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-08-12

Similar Documents

Publication Publication Date Title
KR101804195B1 (ko) 유리 필름 적층체
EP1160882A3 (en) A photonic device, a substrate for fabricating a photonic device, a method for fabricating the photonic device and a method for manufacturing the photonic device-fabricating substrate
JP2005534603A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP1056126A3 (en) Electronic device, method of manufacturing the same, and apparatus for manufacturing the same
EP1209734A3 (en) Multilayered ceramic substrate and production method therefor
JP2565303Y2 (ja) 半導体パッケージ用セラミック基板
EP1011127A3 (en) Chip junction nozzle
JP2003321117A (ja) フラットパネルと保持機器との間の圧力域によってフラットパネルを保持する機器及びロボットハンド
JPH10182176A (ja) 板ガラス用曲げ型
EP1283551A3 (en) Angular substrates
JP4737715B2 (ja) ガラス基板及びガラス基板の製造方法
CN116387163A (zh) 一种改善薄型瓷片的dcb基板烧结气泡不良的方法
JPH1192170A (ja) ガラス基板
JP2569932Y2 (ja) 半導体パッケージ
JP4189093B2 (ja) セラミック製搬送アーム及びその製造方法
JP2002333282A (ja) 焼成用セッター及びその製造方法
CN106103025B (zh) 抽吸头及片材处理装置
CN221089416U (zh) 一种平面靶材模具
JPH0451485Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2517104Y2 (ja) 半導体パッケージ用セラミック基板
JP2000042645A (ja) プレス成形装置
CN219917120U (zh) 用于吸附芯片的真空吸头
JP2003068835A (ja) 真空チャック
CN218351409U (zh) 一种半导体结构
EP1610159A4 (en) SILICON SUBSTRATE AND METHOD FOR FORMING SAME

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees