JP2535527Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2535527Y2
JP2535527Y2 JP1987116818U JP11681887U JP2535527Y2 JP 2535527 Y2 JP2535527 Y2 JP 2535527Y2 JP 1987116818 U JP1987116818 U JP 1987116818U JP 11681887 U JP11681887 U JP 11681887U JP 2535527 Y2 JP2535527 Y2 JP 2535527Y2
Authority
JP
Japan
Prior art keywords
frame
resin
semiconductor element
substrate
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987116818U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6422038U (enrdf_load_stackoverflow
Inventor
裕 奥秋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1987116818U priority Critical patent/JP2535527Y2/ja
Publication of JPS6422038U publication Critical patent/JPS6422038U/ja
Application granted granted Critical
Publication of JP2535527Y2 publication Critical patent/JP2535527Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987116818U 1987-07-31 1987-07-31 半導体装置 Expired - Lifetime JP2535527Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987116818U JP2535527Y2 (ja) 1987-07-31 1987-07-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987116818U JP2535527Y2 (ja) 1987-07-31 1987-07-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS6422038U JPS6422038U (enrdf_load_stackoverflow) 1989-02-03
JP2535527Y2 true JP2535527Y2 (ja) 1997-05-14

Family

ID=31359705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987116818U Expired - Lifetime JP2535527Y2 (ja) 1987-07-31 1987-07-31 半導体装置

Country Status (1)

Country Link
JP (1) JP2535527Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6422038U (enrdf_load_stackoverflow) 1989-02-03

Similar Documents

Publication Publication Date Title
KR100259080B1 (ko) 히트 스프레드를 갖는 리드 프레임 및 이를 이용한반도체 패키지
US4801998A (en) EPROM device
US6653720B2 (en) Semiconductor electronic parts
KR101212661B1 (ko) 반도체 장치 실장 기판 및 반도체 장치 실장 구조
JP4441545B2 (ja) 半導体装置
JP2571024B2 (ja) マルチチップモジュール
US20020127774A1 (en) Flip-chip semiconductor package structure and process for fabricating the same
KR20000026955A (ko) 반도체 패키지 및 그 제조방법
JP2000156433A (ja) 電子装置
KR0179925B1 (ko) 리드프레임 및 그를 이용한 버텀 리드 반도체 패키지
JP3784684B2 (ja) 樹脂パッケージ型半導体装置の製造方法
JP2857648B2 (ja) 電子部品の製造方法
JP2535527Y2 (ja) 半導体装置
JPS63240053A (ja) 半導体装置
KR0181333B1 (ko) 반도체 장치
JPS61102040A (ja) 樹脂封止型半導体装置の製造方法
JP2002237620A (ja) 発光装置及びその製造方法
JPH10178048A (ja) 配線基板
JP5139400B2 (ja) 半導体装置の製造方法
JPS6354222B2 (enrdf_load_stackoverflow)
JPH02298051A (ja) 半導体装置
JP3816636B2 (ja) Ｂｇａ型半導体装置
JPH04239160A (ja) 樹脂封止型電子部品の製造方法
JPH0625959Y2 (ja) 半導体装置
JP2007042709A (ja) 樹脂封止金型及び樹脂封止型電子部品