JP2535527Y2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The present invention relates to a semiconductor device in which a semiconductor element is directly mounted on a substrate on which a wiring pattern is formed and sealed with a resin.

(Prior Art) Conventionally, technologies in such a field include, for example,
There are those disclosed in Japanese Patent Application Laid-Open No. 58-48442 or Japanese Patent Application Laid-Open No. 58-17646.

 FIG. 5 is a plan view of such a conventional semiconductor device.

In this figure, reference numeral 1 denotes a substrate on which a wiring pattern 2 is formed, and a semiconductor element 3 is mounted on a central portion of the substrate 1, and electrodes of the semiconductor element 3 are connected to the wiring pattern 2 by wires 4. Further, a rectangular frame 5 is adhesively fixed on the substrate 1 with epoxy resin or the like so as to surround the wiring portion and the semiconductor element portion, and the wiring portion and the semiconductor element portion are embedded in the frame 5. Is filled with resin 6.

When filling the resin 6, the resin 6 is injected into the center of the frame 5. Then, the resin 6 spreads due to the fluidity of the resin, and comes into contact with the center of each side of the frame 5 which is the shortest distance. After that, the resin 6 flows along each side of the frame 5 and spreads to the corners of the frame 5 to fill the entire inside of the frame 5.

(Problem to be Solved by the Invention) However, the above-described conventional semiconductor device has the rectangular frame 5, and the resin 6 flows along each side of the frame 5, and the resin 6 flows into the corner of the frame 5. When spreading, the amount of the spreading resin 6 gradually decreases, and the spreading gradually weakens. Therefore, in the rectangular frame 5 as described above, the unfilled portion 7 of the resin 6 There was a problem that occurs.

This problem can be solved by injecting a large amount of the resin 6 into the frame 5. However, when the amount of the injected resin is large, the resin 6 rises higher than the height of the frame 5, and there is a problem that a height defect occurs even if the resin 6 is allowed at a certain height.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a semiconductor device which can solve the problem of the occurrence of an unfilled portion without increasing the amount of injected resin and thus eliminating the occurrence of a height defect. With the goal.

(Means for Solving the Problems) In order to achieve the above object, the present invention relates to a substrate on which a wiring pattern is formed, a semiconductor element mounted on the substrate, and the semiconductor element and the wiring pattern. In a semiconductor device comprising an electrically connected wire and a frame surrounding the semiconductor element and sealing a sealing resin, the frame is elliptical on the substrate, and a longitudinal direction of the frame is provided. A rectangular semiconductor element that is longer and shorter in the short axis direction of the frame is positioned substantially at the center of the frame, and is dropped and filled from above substantially the center of the frame, and the semiconductor element is positioned inside the frame. And a sealing resin that covers the wire.

(Operation) According to the present invention, a rectangular semiconductor element which is long in the major axis direction and short in the minor axis direction of the frame is sealed in the frame within the wiring portion surrounded by the frame. So that the resin is filled. At that time, the resin is filled into the center of the frame.
Then, the resin spreads due to the fluidity of the resin, and comes into contact with the center of the long side of the shortest distance frame, for example, as shown in FIG. Thereafter, the resin flows along the long side of the frame along with the shape of the semiconductor element, and further spreads in the longitudinal direction of the frame, and finally fills the entire inside of the frame. At this time,
As the amount of spreading resin gradually decreases, the spreading gradually weakens.

However, according to the elliptical frame, the frame region (two regions) which has the nearest portion (two places) from the resin dropping point at both ends and is bounded between the both ends has an area and a frame length. Both have the same shape, and further, for one of the divided areas, the distance from each end of both ends to the part farthest from the dropping point of the resin is equal, and gradually from both ends toward the part. Because of the narrowed shape, each of the divided areas similarly extends directly from the resin dropping point, reaches the frame close to the resin dropping point, and indirectly follows the frame. Spreading works strongly up to the part farthest from the resin dropping point,
The weakly small spread of the resin also causes its indirect spread over the entire frame, so that the entire inside of the frame is filled with the resin without leaving unfilled portions.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a semiconductor device showing a first embodiment of the present invention.

In the first embodiment, the frame 11 is formed in an elliptical shape as a specific example of a circle having a short axis and a long axis. The rest is the same as the conventional example of FIG. 5, and the same parts are denoted by the same reference numerals and description thereof will be omitted.

Inside the frame 11, a wiring portion surrounded by the frame 11, a frame
The resin 6 is filled so as to seal the rectangular semiconductor element 3 which is long in the long axis direction of the frame 11 and short in the short axis direction of the frame. At this time, the resin 6 is dropped at the center of the frame 11. Is done. Then, the resin 6 spreads due to the fluidity of the resin 6, and the second
As shown in the figure, the shortest distance comes in contact with the center of the long side 11a of the frame body 11. After that, the resin 6 is applied to the long side 11a of the frame 11.
And spreads further in the longitudinal direction of the frame 11, and finally fills the entire inside of the frame 11. At this time, the spread of the resin 6 gradually decreases, so that the spread gradually decreases.

However, according to the elliptical frame 11, the center region of the long side 11a is at both ends, and the frame regions (two regions) which are connected and partitioned between both ends have the same shape in both area and frame length. ,
Furthermore, for one of the divided regions, the distance from each end of both ends to the part farthest from the dropping point of the resin is equal to each other, and the short-axis direction is gradually narrowed toward the part at both ends. Because of the shape, each of the partitioned areas similarly reaches the frame at a short distance from the resin drop point in addition to the direct spread from the resin drop point, and the indirect spread along the frame body Works strongly up to the part distant from the resin dropping point, so even the weak little resin spread causes its indirect spread over the entire frame body, and the entire inside of the frame body is filled with resin without leaving unfilled parts. Will be filled in.

As described above, according to the elliptical frame 11, the filling property of the resin 6 is improved in combination with the shape of the semiconductor element, and the generation of the unfilled portion can be prevented. In addition, the occurrence of unfilled portions can be prevented without increasing the amount of the filled resin, so that the occurrence of height defects is also eliminated.

FIG. 3 is a plan view of a semiconductor device showing a second embodiment of the present invention.

In the second embodiment, the frame body 12 has portions (two places) closest to the resin dropping point at both ends, and a frame region (two regions) bounded between the both ends is an area and a frame length. Have the same shape, and further, for one of the divided areas, the distance from each end of both ends to the portion farthest from the resin dropping point is equal, and from one end to the other end, It has a gradually narrowing shape, that is, an elliptical shape as another specific example of an elliptical shape. Even with such a shape, it is possible to obtain exactly the same effects as in the first embodiment.

In addition, as shown in FIG. 4, a frame 13 of a perfect circle can be considered as similar to the frame of the present invention. However, in the case of the frame 13 having a perfect circle, the resin 6 dropped at the center does not flow along the frame 13 but spreads only by its own fluidity to the end, so that the whole should be filled. No. However, in this case, the resin 6 becomes spherical due to the surface tension of the resin 6 and the water repellency of the substrate 1, and the dripping of the resin 6 is the center in the frame 13, and the distance from the drop point to the frame 13 is Since they are all equal, the frame 13, which arrives first,
Since there is no portion of the frame 13 that is the shortest distance from the so-called resin dropping point, there is a problem that the frame 13 does not spread well to the end.

On the other hand, according to the frame of the present invention, as described in detail in the first embodiment, the resin spreads from the middle along the inner surface of the frame, that is, a capillary phenomenon. This is to utilize the spread using the phenomenon, and therefore, it is possible to spread the resin well to the end.

Note that the present invention is not limited to the above embodiment, and various modifications are possible based on the gist of the present invention.
These are not excluded from the scope of the present invention.

(Effects of the Invention) As described in detail above, according to the present invention, the frame has an elliptical shape on the substrate, and is long in the longitudinal direction of the frame.
A rectangular semiconductor element, which is short in the short axis direction of the frame, is positioned substantially at the center of the frame, and the semiconductor element and the wire are filled by dripping from substantially above the center of the frame, inside the frame. Is provided, so that the resin filling property can be improved and the occurrence of unfilled portions can be prevented in combination with the shape of the semiconductor element.

Therefore, the wiring portion and the element portion can be completely sealed with the resin, and a highly reliable semiconductor device can be obtained.

Moreover, according to the present invention, it is possible to obtain the above-mentioned favorable filling state without increasing the amount of the filled resin, and therefore, it is possible to eliminate the occurrence of the height defect due to the large amount of the filled resin. be able to.

[Brief description of the drawings]

FIG. 1 is a plan view of a semiconductor device showing a first embodiment of the present invention, FIG. 2 is a plan view for explaining the spread of resin in the first embodiment, and FIG. 3 is a second embodiment of the present invention. FIG. 4 is a plan view showing a similar example,
FIG. 5 is a plan view of a conventional semiconductor device. 1 ... substrate, 2 ... wiring pattern, 3 ... semiconductor element,
4 ... wire, 6 ... resin, 11,12 ... frame.

Claims (1)

(57) [Scope of request for utility model registration] A substrate on which a wiring pattern is formed, a semiconductor element mounted on the substrate, a wire electrically connecting the semiconductor element to the wiring pattern, and a sealing resin surrounding the semiconductor element. A semiconductor device comprising a frame to be sealed, wherein the frame is elliptical on the substrate, longer in a major axis direction of the frame, and shorter in a minor axis direction of the frame. And a sealing resin that is positioned substantially at the center of the frame, is dropped and filled from substantially above the center of the frame, and covers the semiconductor element and the wires inside the frame.