JP2534434B2 - 耐酸化性化合物およびその製造方法 - Google Patents

耐酸化性化合物およびその製造方法

Info

Publication number
JP2534434B2
JP2534434B2 JP5073947A JP7394793A JP2534434B2 JP 2534434 B2 JP2534434 B2 JP 2534434B2 JP 5073947 A JP5073947 A JP 5073947A JP 7394793 A JP7394793 A JP 7394793A JP 2534434 B2 JP2534434 B2 JP 2534434B2
Authority
JP
Japan
Prior art keywords
semiconductor
compound
transition element
copper
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP5073947A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0621056A (ja
Inventor
モハメド・オサマ・アブールフォトフ
リア・クルスィン＝エルバウム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH0621056A publication Critical patent/JPH0621056A/ja
Application granted granted Critical
Publication of JP2534434B2 publication Critical patent/JP2534434B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W20/4421—
    • H10D64/0112—
    • H10W20/031—
    • H10W20/4424—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP5073947A 1992-04-30 1993-03-31 耐酸化性化合物およびその製造方法 Expired - Fee Related JP2534434B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87666992A 1992-04-30 1992-04-30
US876669 1992-04-30

Publications (2)

Publication Number Publication Date
JPH0621056A JPH0621056A (ja) 1994-01-28
JP2534434B2 true JP2534434B2 (ja) 1996-09-18

Family

ID=25368329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5073947A Expired - Fee Related JP2534434B2 (ja) 1992-04-30 1993-03-31 耐酸化性化合物およびその製造方法

Country Status (2)

Country Link
EP (1) EP0567867A2 (index.php)
JP (1) JP2534434B2 (index.php)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6575165B1 (en) * 2000-08-03 2003-06-10 3M Innovative Properties Company Apparatus and method for breathing apparatus component coupling
US6703308B1 (en) 2001-11-26 2004-03-09 Advanced Micro Devices, Inc. Method of inserting alloy elements to reduce copper diffusion and bulk diffusion
US7696092B2 (en) 2001-11-26 2010-04-13 Globalfoundries Inc. Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
US6835655B1 (en) 2001-11-26 2004-12-28 Advanced Micro Devices, Inc. Method of implanting copper barrier material to improve electrical performance
US6703307B2 (en) 2001-11-26 2004-03-09 Advanced Micro Devices, Inc. Method of implantation after copper seed deposition
US6861349B1 (en) 2002-05-15 2005-03-01 Advanced Micro Devices, Inc. Method of forming an adhesion layer with an element reactive with a barrier layer
US7169706B2 (en) 2003-10-16 2007-01-30 Advanced Micro Devices, Inc. Method of using an adhesion precursor layer for chemical vapor deposition (CVD) copper deposition
CN112342422A (zh) * 2020-10-27 2021-02-09 湖北新蓝天新材料股份有限公司 一种铜硅合金材料及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2511289B2 (ja) * 1988-03-30 1996-06-26 株式会社日立製作所 半導体装置
EP0769808B1 (en) * 1990-08-01 2001-11-28 International Business Machines Corporation Wet etching process with high selectivity between Cu and Cu3Ge
US5130274A (en) * 1991-04-05 1992-07-14 International Business Machines Corporation Copper alloy metallurgies for VLSI interconnection structures
JP3220760B2 (ja) * 1992-03-19 2001-10-22 株式会社日立製作所 半導体装置

Also Published As

Publication number Publication date
EP0567867A3 (index.php) 1994-03-09
JPH0621056A (ja) 1994-01-28
EP0567867A2 (en) 1993-11-03

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Legal Events

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LAPS Cancellation because of no payment of annual fees