JP2525555Y2 - 樹脂封止型半導体装置用リードフレーム組立体 - Google Patents

樹脂封止型半導体装置用リードフレーム組立体

Info

Publication number
JP2525555Y2
JP2525555Y2 JP1990120301U JP12030190U JP2525555Y2 JP 2525555 Y2 JP2525555 Y2 JP 2525555Y2 JP 1990120301 U JP1990120301 U JP 1990120301U JP 12030190 U JP12030190 U JP 12030190U JP 2525555 Y2 JP2525555 Y2 JP 2525555Y2
Authority
JP
Japan
Prior art keywords
groove
support plate
resin
main surface
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990120301U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0477261U (US06277897-20010821-C00009.png
Inventor
定雄 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1990120301U priority Critical patent/JP2525555Y2/ja
Publication of JPH0477261U publication Critical patent/JPH0477261U/ja
Application granted granted Critical
Publication of JP2525555Y2 publication Critical patent/JP2525555Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990120301U 1990-11-19 1990-11-19 樹脂封止型半導体装置用リードフレーム組立体 Expired - Lifetime JP2525555Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990120301U JP2525555Y2 (ja) 1990-11-19 1990-11-19 樹脂封止型半導体装置用リードフレーム組立体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990120301U JP2525555Y2 (ja) 1990-11-19 1990-11-19 樹脂封止型半導体装置用リードフレーム組立体

Publications (2)

Publication Number Publication Date
JPH0477261U JPH0477261U (US06277897-20010821-C00009.png) 1992-07-06
JP2525555Y2 true JP2525555Y2 (ja) 1997-02-12

Family

ID=31868214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990120301U Expired - Lifetime JP2525555Y2 (ja) 1990-11-19 1990-11-19 樹脂封止型半導体装置用リードフレーム組立体

Country Status (1)

Country Link
JP (1) JP2525555Y2 (US06277897-20010821-C00009.png)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2552887Y2 (ja) * 1991-03-29 1997-10-29 サンケン電気株式会社 絶縁物被覆電子部品
JP4979661B2 (ja) * 2008-09-24 2012-07-18 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法
JP2013258387A (ja) 2012-05-15 2013-12-26 Rohm Co Ltd パワーモジュール半導体装置
JP6301602B2 (ja) * 2013-07-22 2018-03-28 ローム株式会社 パワーモジュールおよびその製造方法
DE102019112979B4 (de) 2019-05-16 2024-07-11 Infineon Technologies Ag Clip mit Verriegelungsausnehmung, Package mit dem Clip und Verfahren zum Herstellen eines Packages

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2507343B2 (ja) * 1986-09-08 1996-06-12 株式会社東芝 樹脂封止型半導体装置
JPS6378558A (ja) * 1986-09-22 1988-04-08 Hitachi Ltd 電子装置

Also Published As

Publication number Publication date
JPH0477261U (US06277897-20010821-C00009.png) 1992-07-06

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